We have issued a press release. Takaya Corporation and Estakaya Electronics Co., Ltd. will exhibit at the 1st [Kansai] Nepcon Japan - Electronics Development and Implementation Exhibition.

2025 Electronics Packaging Society Technical Award Winner!" "55th Mechanical Industry Design Award IDEA Winner!

Takaya Corporation has announced a new model of its flying probe tester, the "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-high-speed inspection. Equipped with cutting-edge inspection technology that can check the placement and connections of fine components with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting the improvement of product quality. Additionally, thanks to the company's unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, it features a user-friendly interface that anyone can intuitively operate, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

• Other measurement, recording and measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F is a next-generation flying probe tester that boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards. With its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F-SL is a large model that maintains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long boards up to W985×D610mm. It can accommodate component heights of up to 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. On July 31, 2025, at the Keidanren Kaikan in Otemachi, Chiyoda-ku, Tokyo, this product received the "Nikkankogyo Shimbun 110th Anniversary Award" at the "55th Mechanical Industry Design Award IDEA" ceremony. The judging committee praised the design philosophy that balances inspection efficiency and reliability, providing an opportunity for our technological and product design capabilities to be widely recognized. *For more details, please feel free to contact us.*

• Other measurement, recording and measuring instruments

We will utilize our independently developed technology and know-how to contribute to the future of society.

Estakaya Electronic Industries Co., Ltd. (formerly known as Sharp Takaya Electronic Industries Co., Ltd., which changed its name on October 1, 2021) has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we also manufacture and sell unique development products utilizing the technology and know-how we have cultivated over many years, as well as sell and provide services for environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.

• Other electronic parts

The complex shape modeling, integrated modeling, lattice/honeycomb structure modeling, porous structure modeling, hybrid structure modeling, direct modeling from 3D data, as well as topology optimization and collaboration with generative design, which were difficult with conventional processing methods and technologies, can lead to the creation of innovative aluminum parts that are not available from traditional or other companies. This includes rapid development, prototyping, and modeling of parts, dramatic reductions in the number of parts, lightweight and compact designs, and significant reductions in manufacturing time, costs, processes, and workforce. In this seminar, pioneering users such as J·3D, ODEC, and the pioneers of white copper, who are utilizing metal 3D printers to rapidly develop, prototype, and manufacture complex aluminum parts, will specifically explain the points and precautions for introduction and utilization, various modeling methods and technologies, next-generation AM technologies developed independently, and groundbreaking modeling examples that significantly differentiate from other companies, sharing both success and failure stories. With the remarkable advancements in metal AM technology, the use of metal 3D printers for aluminum part modeling and manufacturing will become commonplace in a few years. The secrets to success will be discussed by instructors with numerous research achievements and extensive modeling experience, providing clear and concrete lectures for those considering implementation, beginners with interest, and those who have recently started working in this field.

Metal 3D printers are becoming increasingly diverse, with relatively affordable low-cost machines available for several tens of millions of yen, as well as binder jetting methods that enable mass production of parts. High-speed, large machines for creating large parts and products are being continuously introduced to the market, and the production of magnesium parts, which are difficult to manufacture with existing machines, as well as copper parts, has also begun. Metal 3D printers eliminate the need for molds by directly producing products from 3D data. They can create complex shapes that are impossible with traditional processing methods, as well as lattice and porous structures, and hybrid structures. This enables the creation of innovative metal parts and molds that are not available from traditional or other companies, significantly shortens prototyping and manufacturing times, drastically reduces the number of parts, allows for lightweight and compact designs, and reduces manufacturing processes and workforce numbers. Using metal 3D printers, we will provide an easy-to-understand explanation for those considering or interested in developing attractive new products and markets, creating new businesses, differentiating from traditional and competitor products, significantly shortening prototyping and manufacturing times, dramatically reducing the number of parts, and achieving low-cost and lightweight complex-shaped components. The world is energetically investing in metal parts and mold manufacturing as the next generation's mainstay, and mass production of parts has also begun in earnest. Manufacturing parts with metal 3D printers will become commonplace in a few years.

At the beginning of the seminar, the National Institute of Advanced Industrial Science and Technology will discuss the research and development related to ceramics 3D additive manufacturing that they have been working on, focusing on the 3D additive manufacturing process, powder preparation process for molding, debinding and sintering processes, as well as examples of production using ceramics 3D additive manufacturing, particularly with alumina and reaction-sintered silicon carbide. Following that, instructors from Shin-Toh V-Ceramics and As One, who are at the forefront of this field in Japan, will provide an easy-to-understand explanation for beginners about the development trends of various ceramics 3D printers from world-class companies like 3DCeram Sinto and Lithoz, as well as the latest additive manufacturing technologies that enable the creation of innovative parts, rapid part development, prototyping, and manufacturing, significant reductions in the number of parts, lightweight and compact designs, and reductions in manufacturing processes and workforce through complex shapes and integral molding, hollow and porous structures, and lattice structures that are impossible with conventional processing methods. Finally, Canon will introduce the latest trends in their newly developed high-performance ceramics materials that excel in selective laser melting (SLM) for 3D printers, which significantly reduce "shrinkage" during sintering, along with the characteristics of parts that can be produced using this method, additive manufacturing technology, target fields, and contract manufacturing services.

Nagoya Chemical Industry Co., Ltd. will be exhibiting polyimide resins at the booth of Matsuo Sangyo Co., Ltd. during the 'Chemical Material Japan 2025' event held at Tokyo Big Sight. We also plan to showcase our developed products, including soluble polyimide, transparent polyimide, and porous polyimide, so we look forward to seeing you there.

In promoting DX and business reform projects, are your initiatives becoming "system construction first"? While you may have envisioned an ideal, it may not lead to "practical reforms" rooted in the field. For those facing such challenges, this seminar will provide hints for solutions. In this seminar, we will clearly explain the specific approach from "visualizing business processes" to "IT strategy (systemization strategy)" in business reform projects, incorporating case studies and practical steps. We will also introduce the essence of our "business process-focused, supportive consulting." Additionally, details on writing business flows, creating RFPs, and formulating systemization roadmaps will be covered in a separate seminar.