We have issued a press release. Takaya Corporation and Estakaya Electronics Co., Ltd. will exhibit at the 1st [Kansai] Nepcon Japan - Electronics Development and Implementation Exhibition.

2025 Electronics Packaging Society Technical Award Winner!" "55th Mechanical Industry Design Award IDEA Winner!

Takaya Corporation has announced a new model of its flying probe tester, the "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-high-speed inspection. Equipped with cutting-edge inspection technology that can check the placement and connections of fine components with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting the improvement of product quality. Additionally, thanks to the company's unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, it features a user-friendly interface that anyone can intuitively operate, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

• Circuit Board Inspection Equipment

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F is a next-generation flying probe tester that boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards. With its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F-SL is a large model that maintains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long boards up to W985×D610mm. It can accommodate component heights of up to 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*

• Circuit Board Inspection Equipment

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. On July 31, 2025, at the Keidanren Kaikan in Otemachi, Chiyoda-ku, Tokyo, this product received the "Nikkankogyo Shimbun 110th Anniversary Award" at the "55th Mechanical Industry Design Award IDEA" ceremony. The judging committee praised the design philosophy that balances inspection efficiency and reliability, providing an opportunity for our technological and product design capabilities to be widely recognized. *For more details, please feel free to contact us.*

• Circuit Board Inspection Equipment

We will utilize our independently developed technology and know-how to contribute to the future of society.

Estakaya Electronic Industries Co., Ltd. (formerly known as Sharp Takaya Electronic Industries Co., Ltd., which changed its name on October 1, 2021) has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we also manufacture and sell unique development products utilizing the technology and know-how we have cultivated over many years, as well as sell and provide services for environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.

• Other electronic parts

The "International Fermentation and Brewing Food Industry Exhibition" is Japan's only specialized exhibition that brings together ingredients, materials, research equipment, manufacturing facilities, testing equipment, and packaged products related to fermentation and brewing. In 2013, "Washoku" (Japanese cuisine) and in 2024, "Traditional Sake Brewing" were registered as UNESCO Intangible Cultural Heritage, increasing interest in Japan's fermentation and brewing industry. This exhibition will be grandly held at Tokyo Big Sight as a platform to promote the development of the industry and the richness of food culture to the world, and to spread Japan's proud fermented and brewed foods.

Gathering the wisdom of the DOWA Group towards the realization of a decarbonized society! We would like to introduce the initiatives of each DOWA Group company. We look forward to seeing you at our booth!

Heat pipes are passive heat transfer devices that utilize latent heat of vaporization in a two-phase system and do not require driving energy. Heat pipes have very high thermal conductance, with their equivalent thermal conductivity being several hundred times higher than that of a copper rod of the same size. The primary application of heat pipes is in the cooling of computers and electronic products. Recently, AI servers and data centers have gained attention; for example, nVidia's GPUs can reach heat generation of up to 1 kW, employing water-cooled cold plates and 3D vapor chambers. Air cooling is limited to 800 W, while nVidia's Ruben GPU can reach 2 kW, utilizing water-cooled microchannel cold plates, among others. In response to further increases in heat generation, vapor chamber composite cold plates, two-phase pump loop cooling, and impingement cooling have been developed. Additionally, recent cooling cases for batteries, motors, and IGBTs in electric vehicles will be discussed.

In the past, thermal design primarily focused on complex heat transfer through convection and radiation to the atmosphere. However, with the increase in surface-mounted components and power density, the heat dissipation pathways are gradually shifting to thermal conduction through substrates and enclosures. One of the key heat dissipation devices to promote heat transfer in limited spaces is TIM (Thermal Interface Material). A wide variety of TIMs have been developed in the market, and in recent years, key areas where TIMs are widely used include AI data centers and automotive equipment centered around electric vehicles (EVs). In this course, we will first explain the overview of heat dissipation design in AI data centers and automotive equipment, and in the latter half, we will provide a detailed explanation of the thermal and mechanical properties of TIMs in these two fields, as well as important considerations when selecting TIMs.

An explanation of the economic viability, technology, projects, and industry trends and outlook for thermal energy storage and thermoelectric batteries, which are attracting attention for their use in unused heat utilization, energy storage, and renewable energy load leveling. Part 1 Technological and business outlook for thermal energy storage and thermoelectric batteries both domestically and internationally Part 2 Fundamentals, components, technology, and application outlook of thermophotovoltaic (TPV) power generation systems