Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Ozone water for resist stripping! Significant reduction of water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

The peeling of ozone resist has been researched and developed for over 20 years, but the challenge of using ozone, which easily decomposes and diffuses, in the process is high, and the currently practical methods require dedicated ozone process equipment. At Siconnex, we enable the ozone resist peeling process using our unique BATCHSPRAY technology, allowing it to be performed with the same equipment used for other wet processes such as etching and cleaning. This means that multiple processes can be carried out with a single machine, providing a space-saving and process-integrated solution. 【Features】 - Resist peeling is possible with only ozone and water. - No special specifications are required since it is not high-concentration ozone water. - Integration with other wet processes such as etching allows multiple processing steps to be performed without moving the wafers. - Reduces running costs by not using chemicals other than ozone. - Lowers waste disposal costs due to the easy decomposition of ozone. - Can be enhanced with the addition of inorganic chemicals if removal becomes difficult due to resist alteration. - Installation area is less than 2m². - Chambers for 25 or 50 wafers are available. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Remove resin residue after dry etching without using organic solvents!

After dry etching, the polymer residue left on the sidewalls has traditionally been removed using organic solvent-based chemicals, but it is becoming increasingly difficult to procure these due to environmental, safety, and sustainability concerns. Siconnex has developed the 'perc (Post Etch Residue Clean)' process, which uses inorganic chemicals commonly used in semiconductor fabs to remove polymer residues after dry etching. 【Features】 ■ Removes polymer residues using inorganic chemicals ■ Reduces chemical costs and waste disposal costs ■ Installation area of less than 2m² ■ Can be combined with a tank system to perform etching and resist stripping with one unit ■ Chamber capable of processing 25 or 50 wafers in a single batch *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 - Reduces chemical costs by using ozone instead of hydrogen peroxide for conventional RCA cleaning. - No special specifications are required as it does not use high-concentration ozone water. - Integrates with other wet processes such as etching and resist stripping, allowing multiple processing steps to be carried out without moving the wafers. - Ozone decomposes easily, reducing waste disposal costs. - Installation area of less than 2m². - Capable of using chambers for 25 or 50 wafers. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 2-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It is compatible with all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, which not only enhances flexibility but also reduces processing steps. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through tank system ■ Process executable with sic/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Uniformity with less than 1% variation ■ Installation area of less than 2 m² ■ Chemical recirculation through a tank system ■ Process executable with SiC/GaN ■ Usable with chambers for 25 or 50 wafers ■ Extractable process chamber *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimized installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Installation area of less than 2 m² ■ Chemical recirculation via tank system ■ Process executable with SiC/GaN ■ Usable with 25 or 50 wafer chambers ■ Extractable process chamber ■ ATEX safety standards *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automatic equipment.

This two-chamber system is designed for organic solvent-based chemicals for polymer residue and resist stripping. It includes a patented retainer comb processing system for the mixing of chemicals with high precision in the tank. Automatic management of moisture concentration in organic solvents is possible. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ Process execution possible with SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.

This 4-chamber system is characterized by its ability to achieve excellent process results by combining mixed chemicals at the time of use with a patented retainer comb treatment system. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. By continuously supplying new chemicals to the chamber, it eliminates processing variations due to bath liquid degradation, enabling stable high-precision processes. 【Features】 ■ For wet etching, resist stripping, and cleaning processes ■ Throughput of up to 600 wph ■ Four process chambers ■ Installation area of less than 12 m² ■ Chemicals used at low concentrations until depleted ■ No need for sulfuric acid or peroxides *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.

Our company is a manufacturer of equipment for the semiconductor chip manufacturing process (wet etching, resist stripping, cleaning). We offer a variety of products, including the "BATCHSPRAY Clean Autoload" with a maximum throughput of 600 wph and the "BATCHSPRAY Solvent Autoload," which employs a chemical circulation system with a tank system. Please feel free to contact us when you need assistance. 【Reasons to Choose Siconnex】 ■ 100% focus on BATCHSPRAY technology ■ Significant reduction in water, exhaust, and chemicals ■ Cost-efficient processes that support environmental conservation ■ Comprehensive support system (service, parts, processes) ■ Partnership approach with free annual equipment inspections, training, telephone support, and regular maintenance in the first year *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 3-chamber system utilizes a patented retainer comb processing system, accommodating all types of wet etching processes and cleaning applications. The combination of acid/cleaning allows for high process flexibility and high throughput. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. 【Features】 ■ Throughput of up to 400 wph ■ Two cleaning process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ EPD - End Point Detection *For more details, please download the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

[Lecturer] Professor Hiroyuki Kato, Faculty of Sociology, Department of Social Policy Science, Hosei University [Key Lecture Content] In this lecture, I will introduce perspectives on the shipbuilding industry. Japan's shipbuilding industry has a long history and can be seen as a "microcosm" of Japanese industry. Within about ten years after World War II, Japan's shipbuilding industry became the world leader in construction volume, and at one point, the construction volume of the seven major domestic companies accounted for more than half of the world's share. Although it has since been surpassed in construction volume by latecomers such as South Korea and China, it still maintains a certain level of competitiveness. Reflecting on the path taken by the shipbuilding industry, which serves as a "microcosm," the reasons for its continued strength, and the challenges it currently faces may provide insights when considering the future of various Japanese industries. [Lecture Items] 1. Characteristics of the shipbuilding industry 2. Shipyards seen through photos and videos 3. The shipbuilding industry depicted in films 4. Why is it still strong? 5. Points to consider for future developments 6. Q&A / Business card exchange

[Speaker] Maho Tanaka, Manager, Strategy Group, Business Consulting Division, Accenture Japan Ltd. [Key Lecture Content] AI is evolving beyond a mere tool for operational efficiency to become an entity responsible for execution, including information acquisition, comparison, judgment, contracts, and purchasing. As actions initiated by dialogues with general-purpose AI chatbots like ChatGPT become mainstream, corporate information is not reaching users directly, and the structure where decision-making and execution are completed on AI is rapidly expanding. In this lecture, based on this irreversible change, we will organize the reality that the competitive axis of companies is shifting from "appealing to consumers" to "how AI understands, selects, and executes." Furthermore, we will explain the key points of strategic transformation that management should consider in the era of agent-based AI, from organizing the information structure cited by AI to designing touchpoints that reclaim the initiative for judgment and execution for the company. [Lecture Items] 1. The impact of AI on information search and access 2. The impact on corporate marketing and communication 3. The ideal direction for corporate communication in the AI era 4. Introduction of our company’s case studies 5. Q&A session

The overall theme of the webinar is: "The Two Barriers Hindering Automation in Food Factories" "Case Studies on Access Control and AI Image Recognition" Our company will be the first to present. For more details, please visit our website!

[Speaker] Yuki Kobayashi, CEO/Co-Founder of MESON Inc. [Key Lecture Content] In this presentation, we will explore "AI glasses," which have recently begun to attract significant attention as the next-generation user interface, explaining their essence and business impact. We will clarify the differences from previous XR devices and organize representative products currently available, while interpreting why AI glasses are becoming a realistic option against the backdrop of the evolution of generative AI and changes in societal acceptance. Furthermore, through market expansion and case studies primarily overseas, we will demonstrate why the years 2026 to 2028 will be a turning point for technology and business, and discuss the issues and risks that Japanese companies should currently address. [Lecture Items] 1. What are AI glasses? 2. Why AI glasses now? 3. Changes happening globally 4. How AI glasses will change work 5. Experience design as a decisive factor 6. The turning point for Japanese companies (Closing) 7. Q&A / Business card exchange *The content of the lecture may change based on the latest trends.

[Speaker] Andy Mochizuki, Director, Deloitte Tohmatsu TMT Division / Monitor Deloitte [Key Lecture Content] In an era where thinking is commoditized by AI, the source of value is determined not by "information" but by "existence," that is, "the meaning of your being." This course will start from the environmental changes surrounding the AI era, exploring the concept of redesigning work in a purpose-driven manner, the type of thinking required in the AI era (QADI cycle), and delving into the absolute differentiating factor that only humans possess—"embodiment." We will update our sense of purpose in the AI era and our collaborative relationship with AI, initiating a transformation to "live anew" from here. [Lecture Items] 1. Mapping Environmental Changes - "From the Era of Information Asymmetry to the Era of Existence Asymmetry" 2. Redesigning Work in a "Purpose-Driven" Manner 3. The "Thinking Models" Necessary in the AI Era 4. The "Body" as an Absolute Differentiating Factor 5. How to "Live Anew" in the Coming AI Era 6. Q&A / Business Card Exchange