Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Ozone water for resist stripping! Significant reduction of water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

The peeling of ozone resist has been researched and developed for over 20 years, but the challenge of using ozone, which easily decomposes and diffuses, in the process is high, and the currently practical methods require dedicated ozone process equipment. At Siconnex, we enable the ozone resist peeling process using our unique BATCHSPRAY technology, allowing it to be performed with the same equipment used for other wet processes such as etching and cleaning. This means that multiple processes can be carried out with a single machine, providing a space-saving and process-integrated solution. 【Features】 - Resist peeling is possible with only ozone and water. - No special specifications are required since it is not high-concentration ozone water. - Integration with other wet processes such as etching allows multiple processing steps to be performed without moving the wafers. - Reduces running costs by not using chemicals other than ozone. - Lowers waste disposal costs due to the easy decomposition of ozone. - Can be enhanced with the addition of inorganic chemicals if removal becomes difficult due to resist alteration. - Installation area is less than 2m². - Chambers for 25 or 50 wafers are available. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Remove resin residue after dry etching without using organic solvents!

After dry etching, the polymer residue left on the sidewalls has traditionally been removed using organic solvent-based chemicals, but it is becoming increasingly difficult to procure these due to environmental, safety, and sustainability concerns. Siconnex has developed the 'perc (Post Etch Residue Clean)' process, which uses inorganic chemicals commonly used in semiconductor fabs to remove polymer residues after dry etching. 【Features】 ■ Removes polymer residues using inorganic chemicals ■ Reduces chemical costs and waste disposal costs ■ Installation area of less than 2m² ■ Can be combined with a tank system to perform etching and resist stripping with one unit ■ Chamber capable of processing 25 or 50 wafers in a single batch *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 - Reduces chemical costs by using ozone instead of hydrogen peroxide for conventional RCA cleaning. - No special specifications are required as it does not use high-concentration ozone water. - Integrates with other wet processes such as etching and resist stripping, allowing multiple processing steps to be carried out without moving the wafers. - Ozone decomposes easily, reducing waste disposal costs. - Installation area of less than 2m². - Capable of using chambers for 25 or 50 wafers. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 2-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It is compatible with all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, which not only enhances flexibility but also reduces processing steps. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through tank system ■ Process executable with sic/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Uniformity with less than 1% variation ■ Installation area of less than 2 m² ■ Chemical recirculation through a tank system ■ Process executable with SiC/GaN ■ Usable with chambers for 25 or 50 wafers ■ Extractable process chamber *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimized installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Installation area of less than 2 m² ■ Chemical recirculation via tank system ■ Process executable with SiC/GaN ■ Usable with 25 or 50 wafer chambers ■ Extractable process chamber ■ ATEX safety standards *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automatic equipment.

This two-chamber system is designed for organic solvent-based chemicals for polymer residue and resist stripping. It includes a patented retainer comb processing system for the mixing of chemicals with high precision in the tank. Automatic management of moisture concentration in organic solvents is possible. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ Process execution possible with SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.

This 4-chamber system is characterized by its ability to achieve excellent process results by combining mixed chemicals at the time of use with a patented retainer comb treatment system. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. By continuously supplying new chemicals to the chamber, it eliminates processing variations due to bath liquid degradation, enabling stable high-precision processes. 【Features】 ■ For wet etching, resist stripping, and cleaning processes ■ Throughput of up to 600 wph ■ Four process chambers ■ Installation area of less than 12 m² ■ Chemicals used at low concentrations until depleted ■ No need for sulfuric acid or peroxides *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.

Our company is a manufacturer of equipment for the semiconductor chip manufacturing process (wet etching, resist stripping, cleaning). We offer a variety of products, including the "BATCHSPRAY Clean Autoload" with a maximum throughput of 600 wph and the "BATCHSPRAY Solvent Autoload," which employs a chemical circulation system with a tank system. Please feel free to contact us when you need assistance. 【Reasons to Choose Siconnex】 ■ 100% focus on BATCHSPRAY technology ■ Significant reduction in water, exhaust, and chemicals ■ Cost-efficient processes that support environmental conservation ■ Comprehensive support system (service, parts, processes) ■ Partnership approach with free annual equipment inspections, training, telephone support, and regular maintenance in the first year *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 3-chamber system utilizes a patented retainer comb processing system, accommodating all types of wet etching processes and cleaning applications. The combination of acid/cleaning allows for high process flexibility and high throughput. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. 【Features】 ■ Throughput of up to 400 wph ■ Two cleaning process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ EPD - End Point Detection *For more details, please download the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

Cancer Biomarker Discovery 2026 is an online seminar focused on the latest biomarker discovery and analysis technologies in the field of cancer research. Advanced technologies that support the understanding, diagnosis, and treatment research of cancer, such as liquid biopsy, proteomics, and spatial omics analysis, will be introduced. This seminar primarily targets basic and clinical researchers involved in cancer research, as well as those interested in biomarker discovery and analysis. In our section, we will introduce the latest techniques in fluorescent imaging for spatial biology and spatial proteomics research, centered around the Invitrogen EVOS S1000 Spatial Imaging System. Unlike traditional microscopy, which is limited in multiplex immunostaining, our spectral unmixing technology enables simultaneous imaging of up to 9 colors, allowing for rapid data acquisition with minimized sample damage. Additionally, we will explain a practical workflow using direct conjugate antibodies and TSA-based Invitrogen Aluora amplification reagents, proposing high-reproducibility analysis methods that leverage spatial information. For research use only. Not for diagnostic use.

In spatial biology/spatial proteomics research, the coexistence of "high-quality multiplex fluorescence image acquisition" and "reliable quantitative analysis" is becoming increasingly important. This webinar, co-hosted by Thermo Fisher Scientific and Indica Labs, will introduce a practical workflow that allows for a comprehensive understanding from imaging to analysis. Recommended for: - Those interested in spatial biology/spatial proteomics research who want to systematically understand the entire process from imaging to analysis. - Those who are already conducting or considering the implementation of multiplex imaging (multiplex immunostaining). - Those who feel limited by traditional four-color fluorescence observation and wish to engage in higher-dimensional spatial information analysis. This is a free seminar, so please join us. *For research use only. Not for diagnostic use.

[Speaker] Shinya Okimoto, Founder & CEO of Okiwa Studio LLC [Lecture Topics] Part 1: The tectonic shifts in the display industry and the market potential of QDEL Part 2: Business solutions to the "three major technical challenges" for the practical application of QDEL Part 3: Winning strategies for Japanese companies: Targeting the "high value-added components" sector Part 4: Redefining the business portfolio towards 2030 Part 5: Q&A

[Lecturer] Mr. Kenji Kimura, Chief Researcher, Nuclear Group, Power Unit, Japan Energy Economics Research Institute (JEA), and Research Strategy Group, Research Strategy Unit [Key Lecture Content] In recent years, the role of nuclear power has been highlighted in the context of global warming countermeasures and energy security, and more recently, in response to the increased electricity demand due to the use of AI and the expansion of data centers. Under these circumstances, new movements are being observed in countries that utilize nuclear power. In the United States, investments in nuclear power by IT companies are becoming more active, while in Europe, measures are being promoted to enhance the feasibility of new projects. In Japan, the role of nuclear power has been clarified once again, and discussions surrounding specific institutional measures are gradually progressing. This lecture will provide an overview of these movements and organize the trends that should be noted in the future. [Lecture Items] 1. Global Situation and Nuclear Power 2. Trends in Other Countries 3. Trends in New Reactor Development 4. Domestic Trends and Challenges 5. Key Points to Watch After 2026 6. Q&A / Business Card Exchange

At our booth, we will mainly showcase the following products: 〇 Our original product T-Arm 〇 Tecnospiro's product Spider 〇 Knight Global's product Air Balancer 〇 A drone for equipment inspections ▽------------------------------------------------------------▽ From April 8 (Wednesday) to April 10 (Friday) at Port Messe Nagoya ■ Manufacturing World Nagoya (Booth Number: 16-40) https://www.manufacturing-world.jp/nagoya/ja-jp.html ■ Pre-registration for attendance is convenient! https://www.manufacturing-world.jp/nagoya/ja-jp/register.html?code=1603005193330205-52G △------------------------------------------------------------△ We look forward to your visit.