Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Ozone water for resist stripping! Significant reduction of water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

The peeling of ozone resist has been researched and developed for over 20 years, but the challenge of using ozone, which easily decomposes and diffuses, in the process is high, and the currently practical methods require dedicated ozone process equipment. At Siconnex, we enable the ozone resist peeling process using our unique BATCHSPRAY technology, allowing it to be performed with the same equipment used for other wet processes such as etching and cleaning. This means that multiple processes can be carried out with a single machine, providing a space-saving and process-integrated solution. 【Features】 - Resist peeling is possible with only ozone and water. - No special specifications are required since it is not high-concentration ozone water. - Integration with other wet processes such as etching allows multiple processing steps to be performed without moving the wafers. - Reduces running costs by not using chemicals other than ozone. - Lowers waste disposal costs due to the easy decomposition of ozone. - Can be enhanced with the addition of inorganic chemicals if removal becomes difficult due to resist alteration. - Installation area is less than 2m². - Chambers for 25 or 50 wafers are available. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Remove resin residue after dry etching without using organic solvents!

After dry etching, the polymer residue left on the sidewalls has traditionally been removed using organic solvent-based chemicals, but it is becoming increasingly difficult to procure these due to environmental, safety, and sustainability concerns. Siconnex has developed the 'perc (Post Etch Residue Clean)' process, which uses inorganic chemicals commonly used in semiconductor fabs to remove polymer residues after dry etching. 【Features】 ■ Removes polymer residues using inorganic chemicals ■ Reduces chemical costs and waste disposal costs ■ Installation area of less than 2m² ■ Can be combined with a tank system to perform etching and resist stripping with one unit ■ Chamber capable of processing 25 or 50 wafers in a single batch *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 - Reduces chemical costs by using ozone instead of hydrogen peroxide for conventional RCA cleaning. - No special specifications are required as it does not use high-concentration ozone water. - Integrates with other wet processes such as etching and resist stripping, allowing multiple processing steps to be carried out without moving the wafers. - Ozone decomposes easily, reducing waste disposal costs. - Installation area of less than 2m². - Capable of using chambers for 25 or 50 wafers. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 2-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It is compatible with all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, which not only enhances flexibility but also reduces processing steps. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through tank system ■ Process executable with sic/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Uniformity with less than 1% variation ■ Installation area of less than 2 m² ■ Chemical recirculation through a tank system ■ Process executable with SiC/GaN ■ Usable with chambers for 25 or 50 wafers ■ Extractable process chamber *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimized installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Installation area of less than 2 m² ■ Chemical recirculation via tank system ■ Process executable with SiC/GaN ■ Usable with 25 or 50 wafer chambers ■ Extractable process chamber ■ ATEX safety standards *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automatic equipment.

This two-chamber system is designed for organic solvent-based chemicals for polymer residue and resist stripping. It includes a patented retainer comb processing system for the mixing of chemicals with high precision in the tank. Automatic management of moisture concentration in organic solvents is possible. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ Process execution possible with SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.

This 4-chamber system is characterized by its ability to achieve excellent process results by combining mixed chemicals at the time of use with a patented retainer comb treatment system. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. By continuously supplying new chemicals to the chamber, it eliminates processing variations due to bath liquid degradation, enabling stable high-precision processes. 【Features】 ■ For wet etching, resist stripping, and cleaning processes ■ Throughput of up to 600 wph ■ Four process chambers ■ Installation area of less than 12 m² ■ Chemicals used at low concentrations until depleted ■ No need for sulfuric acid or peroxides *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.

Our company is a manufacturer of equipment for the semiconductor chip manufacturing process (wet etching, resist stripping, cleaning). We offer a variety of products, including the "BATCHSPRAY Clean Autoload" with a maximum throughput of 600 wph and the "BATCHSPRAY Solvent Autoload," which employs a chemical circulation system with a tank system. Please feel free to contact us when you need assistance. 【Reasons to Choose Siconnex】 ■ 100% focus on BATCHSPRAY technology ■ Significant reduction in water, exhaust, and chemicals ■ Cost-efficient processes that support environmental conservation ■ Comprehensive support system (service, parts, processes) ■ Partnership approach with free annual equipment inspections, training, telephone support, and regular maintenance in the first year *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 3-chamber system utilizes a patented retainer comb processing system, accommodating all types of wet etching processes and cleaning applications. The combination of acid/cleaning allows for high process flexibility and high throughput. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. 【Features】 ■ Throughput of up to 400 wph ■ Two cleaning process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ EPD - End Point Detection *For more details, please download the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

Advantech Toyo will be exhibiting at the trade show "JASIS 2026," which will be held at Makuhari Messe International Exhibition Hall. At this exhibition, manufacturers of analytical and scientific instruments will gather to showcase cutting-edge scientific and analytical systems and solutions. At our booth, we will display filter products for microbiological testing and environmental analysis, water quality testing products, pure and ultra-pure water production equipment, and culture-related equipment. Additionally, we will also showcase analytical balances from Mettler Toledo, along with equipment from other well-regarded manufacturers in the industry. Our sales and technical staff will be available to assist with product selection, so please feel free to stop by!

[Speakers] Nomura Research Institute, Ltd. Global Manufacturing Consulting Department Group Manager Hirokazu Shimo Senior Consultant Shoki Tokugawa Senior Consultant Wataru Hashimoto Consultant Masaaki Amano Consultant Tomoya Nakamura [Presentation Items] 1. Key Development Themes of Major OEMs 2. Development Approaches of Each OEM 2-1. Toyota 2-2. Tesla 2-3. Suzuki 2-4. Nissan 2-5. Honda 3. Development Approaches of Suppliers 4. Key Points for Strengthening Development Capabilities 5. Q&A / Business Card Exchange

[Speaker] Ayaka Motomura, Consultant, Business Transformation Unit, NTT Data Management Research Institute [Key Lecture Content] With the advancement of Physical AI, telecommunications carriers have the opportunity to evolve from being "companies that provide lines" to companies that connect and control AI and the physical world in real-time. This seminar will organize the changes in communication demand brought about by Physical AI and the business opportunities for telecommunications carriers, while explaining the role of AIOps as the first step towards entry. Furthermore, it will discuss strategies for monetizing in the Physical AI market by deploying the operational intelligence accumulated through AIOps to network APIs and industry-specific services, as well as the layers that telecommunications carriers should hold. [Lecture Topics] Chapter 1: The Competitive Structure of the "Real World" Rewritten by Physical AI Chapter 2: Reasons Why Opportunities for "Reversal" Arise for Telecommunications Carriers in the Era of Physical AI Chapter 3: The First Step Towards Physical AI Chapter 4: Shifting AIOps from "Defense" to "Offense" Chapter 5: The Layers to Hold in the Era of Physical AI [Q&A / Business Card Exchange]

[Instructor] Partner Ryoji Mori, Eichi Law Office [Key Lecture Content] This lecture will explain the revised Personal Information Protection Act of 2028. The three-year review this time is a major revision, and it is essential to first understand where and how the revisions have been made, as well as the overall picture of the amendments. Next, we will explain the individual amendments that are practically important. The key points are as follows, but it is important to note that both the strengthening and relaxation of obligations are occurring simultaneously, increasing overall complexity. At the time of the lecture, it is expected that subordinate laws and guidelines will not yet be published, but we will discuss points that require attention upon publication. We will distinguish between what is necessary across businesses and what varies by industry. [Lecture Items] 1. Expansion of consent exceptions: Relaxation of the difficulty of obtaining consent and expansion of academic research institutions 2. Statistical exceptions: System content and how to read complex provisions (plus learning about acceptability from controversies) 3. Strengthening regulations on biometric information and children's information: Caution required for age verification 4. Contactable personal-related information: Changes in external transmission responses 5. Review of outsourcing regulations: Addition and removal of obligations for contractors 6. Administrative fines: Narrow target range and low amounts (not worth fearing) 7. Q&A / Business card exchange

[Instructor] Innovation Analyst Andy Kondo [Key Lecture Content] *The latest content will be added (changed) as appropriate based on the on-site survey of IAA Transportation 2026.* From September 15 to 20, 2026, the largest commercial vehicle exhibition in Europe, IAA Transportation, will be held in Hanover, Germany. It is a gathering place for manufacturers of commercial vehicles such as trucks and buses, as well as the parts, energy, and software that support them, occurring every two years. The cost structure of logistics, urban transportation and the environment, energy transition, decarbonization efforts, and a microcosm of the industry will reveal the future business environment just a step ahead. In this seminar, an innovation analyst who has been observing major global exhibitions such as CES and Hannover Messe for many years will report shortly after the event based on on-site coverage. Has autonomous driving become the main focus in commercial vehicles? Where is the energy transition for large vehicles settling in terms of batteries, hydrogen, and alternative fuels? How far have Chinese companies come? Based on photos taken at the venue and observations of actual products, the seminar will delve into the implications for Japanese companies.