Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Ozone water for resist stripping! Significant reduction of water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

The peeling of ozone resist has been researched and developed for over 20 years, but the challenge of using ozone, which easily decomposes and diffuses, in the process is high, and the currently practical methods require dedicated ozone process equipment. At Siconnex, we enable the ozone resist peeling process using our unique BATCHSPRAY technology, allowing it to be performed with the same equipment used for other wet processes such as etching and cleaning. This means that multiple processes can be carried out with a single machine, providing a space-saving and process-integrated solution. 【Features】 - Resist peeling is possible with only ozone and water. - No special specifications are required since it is not high-concentration ozone water. - Integration with other wet processes such as etching allows multiple processing steps to be performed without moving the wafers. - Reduces running costs by not using chemicals other than ozone. - Lowers waste disposal costs due to the easy decomposition of ozone. - Can be enhanced with the addition of inorganic chemicals if removal becomes difficult due to resist alteration. - Installation area is less than 2m². - Chambers for 25 or 50 wafers are available. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Remove resin residue after dry etching without using organic solvents!

After dry etching, the polymer residue left on the sidewalls has traditionally been removed using organic solvent-based chemicals, but it is becoming increasingly difficult to procure these due to environmental, safety, and sustainability concerns. Siconnex has developed the 'perc (Post Etch Residue Clean)' process, which uses inorganic chemicals commonly used in semiconductor fabs to remove polymer residues after dry etching. 【Features】 ■ Removes polymer residues using inorganic chemicals ■ Reduces chemical costs and waste disposal costs ■ Installation area of less than 2m² ■ Can be combined with a tank system to perform etching and resist stripping with one unit ■ Chamber capable of processing 25 or 50 wafers in a single batch *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 - Reduces chemical costs by using ozone instead of hydrogen peroxide for conventional RCA cleaning. - No special specifications are required as it does not use high-concentration ozone water. - Integrates with other wet processes such as etching and resist stripping, allowing multiple processing steps to be carried out without moving the wafers. - Ozone decomposes easily, reducing waste disposal costs. - Installation area of less than 2m². - Capable of using chambers for 25 or 50 wafers. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 2-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It is compatible with all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, which not only enhances flexibility but also reduces processing steps. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through tank system ■ Process executable with sic/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Uniformity with less than 1% variation ■ Installation area of less than 2 m² ■ Chemical recirculation through a tank system ■ Process executable with SiC/GaN ■ Usable with chambers for 25 or 50 wafers ■ Extractable process chamber *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimized installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Installation area of less than 2 m² ■ Chemical recirculation via tank system ■ Process executable with SiC/GaN ■ Usable with 25 or 50 wafer chambers ■ Extractable process chamber ■ ATEX safety standards *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automatic equipment.

This two-chamber system is designed for organic solvent-based chemicals for polymer residue and resist stripping. It includes a patented retainer comb processing system for the mixing of chemicals with high precision in the tank. Automatic management of moisture concentration in organic solvents is possible. 【Features】 ■ Throughput of up to 300 wph ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ Process execution possible with SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.

This 4-chamber system is characterized by its ability to achieve excellent process results by combining mixed chemicals at the time of use with a patented retainer comb treatment system. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. By continuously supplying new chemicals to the chamber, it eliminates processing variations due to bath liquid degradation, enabling stable high-precision processes. 【Features】 ■ For wet etching, resist stripping, and cleaning processes ■ Throughput of up to 600 wph ■ Four process chambers ■ Installation area of less than 12 m² ■ Chemicals used at low concentrations until depleted ■ No need for sulfuric acid or peroxides *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.

Our company is a manufacturer of equipment for the semiconductor chip manufacturing process (wet etching, resist stripping, cleaning). We offer a variety of products, including the "BATCHSPRAY Clean Autoload" with a maximum throughput of 600 wph and the "BATCHSPRAY Solvent Autoload," which employs a chemical circulation system with a tank system. Please feel free to contact us when you need assistance. 【Reasons to Choose Siconnex】 ■ 100% focus on BATCHSPRAY technology ■ Significant reduction in water, exhaust, and chemicals ■ Cost-efficient processes that support environmental conservation ■ Comprehensive support system (service, parts, processes) ■ Partnership approach with free annual equipment inspections, training, telephone support, and regular maintenance in the first year *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductor manufacturing equipment

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 3-chamber system utilizes a patented retainer comb processing system, accommodating all types of wet etching processes and cleaning applications. The combination of acid/cleaning allows for high process flexibility and high throughput. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. 【Features】 ■ Throughput of up to 400 wph ■ Two cleaning process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ EPD - End Point Detection *For more details, please download the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

Recently, we held technical training sessions for the MilkoScan FT3 at five locations nationwide. In this training, we provided a wide range of useful information for operating the equipment, including explanations of the principles and structure of the device, how to create measurement products, daily maintenance, and how to respond to issues when they arise. Additionally, this year we introduced new methods for utilizing digital services (such as FossCalibrator and IQX) and also prepared hands-on sessions where participants could experience operating the equipment using a PC. Thank you to everyone who participated. Please feel free to contact us with any questions after the training. ------- At Foss Japan, in addition to training sessions and workshops to ensure you can use our equipment with confidence, we hold many events throughout the year. In seminars and open houses tailored to specific industries and analytical techniques, we showcase Foss's latest analytical solutions. -------

[Lecturers] EY Strategy and Consulting Co., Ltd. Infrastructure Advisory Partner Kenichiro Fukuda Strategy Partner Ken Fujiyama Infrastructure Advisory Director Takashi Matsumura [Key Lecture Content] The water supply and sewage business is facing structural challenges such as facility aging, a shortage of workforce, and a decrease in revenue due to population decline. The government is promoting the introduction of Water PPPs, regional consolidation, and the digital transformation of water supply and sewage systems, marking a significant turning point in the way these businesses are operated. This change is expanding business opportunities for private companies in various areas, including operation and maintenance, pipeline renewal, digital technology, and the utilization of smart meters and data. Additionally, as a means of expanding business domains and enhancing competitiveness, there has been an increase in capital and operational partnerships and M&A between companies, leading to industry restructuring. In this seminar, based on the latest trends in policy and the market, we will introduce business strategies for private companies to enter and expand in the water supply and sewage market, including the use of M&A and capital operational partnerships, drawing on achievements from both public and private support.

[Lecturer] Koichi Iwama, Professor, Faculty of Economics and Management, Wako University / Chairman, Resource Economics Committee, Petroleum Technology Association [Key Lecture Content] In light of the prolonged crisis in the Strait of Hormuz, what will happen to the development of shale gas and shale oil in the United States moving forward? After the midterm elections, what will be the international LNG prices under the Trump administration after winter 2027? How will Japan's business strategies related to LNG projects grow? A leading expert on the shale gas and shale oil revolutions will clearly explain the future outlook.

[Lecture Items] 1. Initiatives for Promoting Smart Cities at the Ministry of Land, Infrastructure, Transport and Tourism Ministry of Land, Infrastructure, Transport and Tourism, Urban Bureau, International and Digital Policy Division, Digital Information Utilization Promotion Office Planning Specialist Mr. Masahiro Kobayashi 1. Initiatives to Promote the Spread of Smart Cities 2. Promotion of the Development and Utilization of 3D Urban Models in Project PLATEAU 3. Q&A / Business Card Exchange 2. Smart Cities in the AI Era - Creating "Light Cities" that Continuously Unleash the Potential of Urban Areas - NTT Urban Solutions Inc., Urban Development Promotion Headquarters, Innovation Promotion Department, Deputy Director NTT Urban Development Corporation, Digital Innovation Promotion Department, Director Mr. Shinya Date 1. Changes in the Environment Surrounding Smart Cities and the Transformation of Urban Development 2. NTT's Vision for Creating "Light Cities" - Urban Development that Continues to Unleash the Potential of Cities 3. Evolution and Value Creation of Smart Cities in an AI-Driven Society 4. Considering Future Urban Models and Co-Creation Possibilities from Social Implementation Cases in Hibiya 5. Q&A / Business Card Exchange

[Speaker] Mitsui & Co., Ltd. Research Institute, Technology and Innovation Information Department Senior Project Manager, Zhao Jian [Key Lecture Content] Low-cost lithium iron phosphate (LFP) lithium-ion batteries are expanding their adoption worldwide. To prepare for future mass emissions, promoting their recycling is essential. However, due to the low material value of LFP batteries, ensuring the profitability of recycling operations has become a challenge. In pursuit of profitability, Chinese companies are seeking economies of scale and integrating battery material manufacturing, while in Europe and other regions, there is a focus on developing high-efficiency and high-purity recovery technologies such as direct recycling. This lecture will explain the current status, challenges, latest trends in technology development, and the impact on the battery supply chain regarding LFP battery recycling. [Lecture Items] 1. The necessity of LFP battery recycling 2. The current status of LFP battery recycling 3. Efforts to improve the profitability of LFP battery recycling 4. Impact on the supply chain & summary 5. Q&A / Business card exchange