Notice of Participation in JAPAN PACK 2025

High-pressure hot air shrink! Temperature management is possible with the digital screen of the heater, making it easy to set temperatures for various types of shrink with high reproducibility.

The shrink packaging machine "EZ-PACK" is equipped as standard with Leister's hot air heater and digital screen temperature control model, enabling precise and easy beautiful shrink wrapping. Since temperature management can be done with digital numbers, it allows for shrink wrapping at the same temperature consistently. It accommodates a wide variety of containers and various materials of shrink film with flexible hot air. 【Features】 - Easy temperature setting for a variety of shrink types with high reproducibility - Minimal thermal impact on contents and containers due to instant heating - Maximum power consumption reduced by 36% compared to conventional models, achieving significant energy savings - Quick startup and shutdown within approximately 5 minutes - Lightweight design with an aluminum frame for easy mobility Starting with the "LEP-IV type (4-direction blowing)" that applies high-pressure hot air from four directions to achieve a beautiful finish without wrinkles or unevenness, we also offer the "LEP-II LR type (2-direction blowing left and right)" and the "LEP-II UD type (2-direction blowing up and down)." We have a proven track record in a wide range of industries including cosmetics, pharmaceuticals, and miscellaneous goods. For more details, please refer to the PDF materials or feel free to contact us.

• Shrink Wrapping Machine
• Other packaging machines

Easily shrink caps at low cost and in a space-saving manner with hot air! Also equipped with an external control interface.

The "EZ-CAP SEAL" is a cap shrink device that can select and adopt a digital temperature control model. It is compact, equipped with casters for easy movement, and can shrink immediately. With a maximum airflow of 900L/min, it minimizes shrinkage unevenness and also allows for airflow adjustment. Furthermore, it heats only the cap area with hot air, making it simple and economical. The thermal impact on the contents is minimized compared to using tunnels or ovens. 【Features】 - The stand frame is made of aluminum and comes with casters for easy mobility. - The heater (hot air machine) is equipped with an auto cool-down function as standard. - Start-up and shutdown take place within approximately 5 minutes. - Individual sales of hot air machines, nozzles, etc., are also available. - A low-cost analog temperature control type hot air generator is also available. We have a demonstration unit prepared at our showroom in Shin-Yokohama and Esaka. If you provide us with sample shrink film and bottles, we can conduct a shrink test. We will select the optimal nozzle based on your cap shape. Please feel free to contact us.

• Shrink Wrapping Machine

Unique protective features, adjustable parameters! Lightweight and ergonomically designed heat gun.

The "Sora no AT, 230V/2300W, EU plug" is a convenient and high-performance heat gun that supports various applications with an output of 2300W and a weight of 750g. It is particularly powerful and lightweight, equipped with many useful features, and has a brushless, long-lasting motor (operating time of 10,000 hours). Additionally, the temperature can be adjusted continuously between 50 and 650°C, providing stable performance for plastic welding, heating, shrinking, or drying. 【Features】 ■ Exceptional durability with a brushless drive motor ■ Eco mode saves 40% energy and achieves 50% noise reduction ■ Active cool-down function ■ Configurable restart protection ■ Wireless communication interface *For more details, please download the PDF or feel free to contact us.

• Other work tools

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

In this seminar, you will learn the following: - The mixing mechanism and examples of Awatori Nentaro - Stirring methods and heat generation countermeasures according to material viscosity - The latest automation models and syringe filling technology using Awatori Nentaro We will provide not only the basic information about Awatori Nentaro but also the latest updates. During the live demonstration, we will clearly explain how actual materials are mixed and the operation screen of the temperature management solution app for Shinky. Additionally, equipment and optional items will be displayed in the venue, allowing you to consult while viewing the actual products. Please register early!

An explanation of the "detailed risk assessment of hazardous areas," which is essential as the first step in promoting "smart security" and "DX transformation" in hazardous material facilities. We will clearly convey the evaluation methods and points to consider in implementation, incorporating comparisons of old and new evaluation methods as well as recent case studies. There will also be a Q&A session on the day. If you have any questions in advance, please fill them out in the participation input form. You are also welcome to ask questions on the day! We look forward to your participation. Date and Time: October 16, 2026 (Friday) 13:30 - 14:30 (Web seminar via eams)

■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies

■Title: "Fundamentals and Applications of Non-Fluorinated Water-Repellent and Oil-Repellent Coatings, Development Trends" In light of the strengthened PFAS regulations, this presentation will clearly explain non-fluorinated water-repellent and oil-repellent coatings, covering the basics of water-repellent and oil-repellent technologies, the trends in PFAS regulations in various countries, and the latest developments in alternative technologies. It will also introduce the characteristics and application examples of various materials such as silicone-based, urethane-based, polyolefin-based, and hybrid materials, providing knowledge that will be useful for product development and material selection. - Basic knowledge of water repellency and oil repellency - Fundamentals of fluorinated water-repellent and oil-repellent coatings - Overview of PFAS regulations in Europe, the United States, and Japan - Technical trends in non-fluorinated water-repellent and oil-repellent coatings - Characteristics and application examples of various non-fluorinated materials - Planning and development personnel considering the adoption of water-repellent and oil-repellent coatings - Engineers involved in products utilizing coatings - Personnel considering fluorinated alternative materials - Young engineers and students who want to learn about water-repellent and oil-repellent technologies