We will exhibit at Monozukuri World Tokyo 2025.

Shape measurement of shafts can be done with a single chuck! Measurement and data collection completed in 30 to 60 seconds. Special shapes are also acceptable.

Our company handles non-contact shaft shape measuring machines manufactured by VICIVISION in Italy. By illuminating the workpiece set inside the machine with LED light and reading the shadow of the workpiece with a CCD sensor on the opposite side, we can measure dimensions and shapes. Various items can be measured with a single chuck, significantly contributing to a reduction in work time. This is recommended not only for sites struggling with measurement time and variability but also for those considering automation with robots. 【Product Lineup】 Techno Series: Compatible with workpieces up to a maximum diameter of 180 mm and a maximum length of 2000 mm. High-precision model Prima Series: Compatible with workpieces up to a maximum diameter of 140 mm and a maximum length of 600 mm. Standard model X Series: High-precision model for small workpieces such as medical implants and watch parts. *For more details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.

• Other measurement, recording and measuring instruments

We measure cylindrical workpieces at high speed and high precision without contact. Optionally, a touch sensor or confocal sensor can be selected for installation.

The optical shaft shape measuring machine Techno series manufactured by VICIVICION in Italy has a diverse product lineup, allowing customers to select the most suitable model according to their needs. Direct dimension management on-site: Workpieces produced by CNC lathes and grinding machines can be measured in just a few seconds. Supports small lots of various types: This machine allows for easy setup changes, enabling a very quick switch to the next batch. One measuring machine for multiple processing machines: Due to the short measurement time, one measuring machine can accommodate multiple processing machines. High resolution: Captures ultra-high resolution images of even the smallest details. Touch sensor: Areas that cannot be measured optically can be measured with the optional touch sensor. Confocal sensor: Spline measurements can also be performed non-contact and at high speed using the optional confocal sensor. *For more details, please refer to the PDF document or feel free to contact us.

• Optical Measuring Instruments

The helical profile grinder ZENITH400 is a machine that represents the pinnacle of HOLROYD's profile grinding technology!

It has grinding capabilities with a maximum work size of 420mm and a maximum work weight of 700kg, offering very high versatility. 【Features】 In addition to being a high-precision helical profile grinding machine, the Zenith 400 achieves a high chip removal rate, and both production rate and precision can be adjusted to meet individual manufacturing requirements. The HPMS (Holroyd Profile Management System) consists of a series of subprograms designed to develop a wide range of helical profiles for screw rotors, vacuum screws, and pump screws, and is offered as an option with some of our grinding technologies. HPMS can also be used to assist in controlling profiles during the manufacturing stage and optimizing meshing conditions during operation.

• Grinding Machine
• Other machine tools

Customizable high-speed finishing machine compatible with fully automated processes.

By simultaneously rotating both the spindle holding the workpiece and the grinding tank, strong grinding force is achieved, enabling high-precision and efficient surface finishing. Complete automation can also be easily constructed, making it suitable for large-scale mass production lines. (High-speed rotating spindle Max. 2,000 rpm) Compared to drag finishing machines, it allows for strong polishing power and short processing times. It supports complete automation and is a customizable machine that can be designed from the axis configuration.

• Other machine tools
• Wafer processing/polishing equipment

Berry Inc. (Headquarters: Taito-ku, Tokyo; CEO: Hiroshi Nakano) will hold a free online seminar titled "Evolved with AI! - A Comprehensive Explanation of eQMS 'QMSmart' from Basics to Latest Updates," which will explain the overall picture and latest updates of the cloud-based eQMS "QMSmart" with a live screen demo, on August 21, 2026 (Friday) from 14:00 to 15:00. This seminar is aimed at those considering the introduction of eQMS, as well as quality assurance, design development, and manufacturing personnel at medical device manufacturers who feel limited by paper and Excel-based QMS operations, as well as management. Participants will be able to see the evolved QMSmart in its entirety in one hour, following this summer's major update.

Takaya Corporation will be exhibiting at the "36th Microelectronics Symposium (MES2026)" held at Osaka University Nakanoshima Center from September 16 (Wednesday) to 18 (Friday), 2026. MES2026 is one of Japan's leading technical symposiums in the field of electronics packaging. The symposium will focus on implementation technologies that support the high functionality, miniaturization, and high reliability of electronic devices, featuring the latest research results and technological trends from universities, research institutions, and companies. Additionally, technical exchanges and information sharing will take place through corporate exhibitions. At our booth, we will introduce the features of the Flying Probe Tester "APT Series" and solutions that contribute to quality improvement, as well as offer consultations regarding inspection processes. We invite you to stop by the Takaya booth during your visit.

In this session, we will thoroughly analyze case studies of three major chemical accidents that occurred in the past! When we unravel the root causes of these accidents, we find a common pattern of "lack of safety management systems" rather than just equipment failure or chemical reactions. We will introduce specific solutions to bridge the three gaps of "Visibility," "Control," and "Preparedness," and discuss Chemwatch's efforts to prevent risks before they occur. For any questions, please contact us at japan@chemwatch.net. We sincerely look forward to your participation.

☆☆☆ Urgent Visit to Japan & Emergency Event Announcement ☆☆☆ Dr. Yuval Levy, CEO of ISCFDC and developer of EPPIC, who has been involved in CFD research at NASA Ames Research Center for about five years, is coming to Japan! He will demonstrate and explain advanced CFD technologies, application cases, and the latest features of EPPIC himself. □ Date and Time □ July 31, 2026 (Friday) 13:00-18:00 (Registration starts at 12:30) <Part 1: Post-Processor Session> 13:00-16:40 <Part 2: Pre-Processor Session> 16:50-17:50 <Networking Event> 18:10-19:40 □ For more details □ Visit the Hulinks page https://www.hulinks.co.jp/seminar/eppic/

While the business utilization of generative AI (such as ChatGPT) is rapidly advancing, the "security risk of confidential information such as on-site data, proprietary manuals, and customer information being sent to the cloud" has become a significant issue. Until now, the high cost of GPU servers and the necessity of relying on the cloud for model intelligence have been challenges. However, this premise is now undergoing a major change. With the emergence of Google's latest open model, 'Gemma4', we have finally entered an era where it is possible to operate with "intelligence equal to or greater than that of the cloud" at "one-third the hardware cost of traditional setups," and within "a secure, company-exclusive server completely isolated from the internet." We will introduce the latest trends in AI implementation along with our company's latest DX solutions.