Announcement of the introduction of Talos F200E

We thoroughly evaluate and verify power devices from every angle.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

• diode
• Transistor

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for analysis - Backside polishing - We accommodate various sample forms. Si chip size: 200um to 15mm square ■ Defective area identification - Backside IR-OBIRCH analysis and backside emission analysis - IR-OBIRCH analysis: Supports up to 100mA/10V and 100uA/25V Emission analysis: Supports up to 2kV * We address a wide range of defect characteristics such as low-resistance shorts, micro leaks, and high voltage breakdown failures. ■ Pinpoint cross-sectional observation of leak areas - SEM/TEM - We select SEM or TEM observation based on the predicted defects and can conduct physical observation and elemental analysis of leak defect areas with precision.

• Transistor
• Analytical Equipment and Devices
• Contract Analysis

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

• Other semiconductors
• Contract Analysis
• Other contract services

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of pseudo-leaks. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.

• Contract Analysis
• Analysis Services

Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

Our company conducts "Backside Emission Analysis of SiC Devices." SiC is a power device with less energy loss compared to conventional Si semiconductors and is attracting attention. However, due to its different physical properties from Si semiconductors, new methods are required for failure analysis. In a case study of backside emission analysis of SiC MOSFETs, an overseas SiC MOSFET was subjected to ESD, creating a G-(D,S) leakage, and numerous emissions indicating the leakage points were detected through emission analysis. When the emission points were observed using TEM, destruction of the SiO2 film and damage to the SiC crystal were noted. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu office in 1993, we have cultivated our own unique analysis and evaluation techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 ■ OBIRCH analysis supports not only Si but also SiC and GaN devices ■ FIB processing is possible from either side ■ Visualization of the depletion layer formed at the PN junction ■ Elemental analysis such as EDS and EELS is also supported *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment
• Contract Analysis
• Analysis Services

Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas quickly, and by finishing the FIB at low acceleration, it is possible to produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Reduced damage layers through low-acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Complete automation of TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

Improved resolution for TEM and STEM! Performance has been significantly enhanced, allowing for EDS analysis with four detectors.

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution of TEM and STEM has improved, and performance has been significantly enhanced, including the capability for EDS analysis with four detectors. Additionally, it is equipped with Drift Corrected Frame Integration (DCFI), which allows for the integration of multiple frames while correcting for drift. 【Specifications (excerpt)】 ■ Acceleration Voltage: 200kV, 80kV ■ TEM Information Limit: ≦0.11nm ■ STEM Resolution: ≦0.14nm ■ Drift Corrected Frame Integration (DCFI) ・Integration of multiple frames while correcting for drift *For more details, please download the PDF or feel free to contact us.

• Other microscopes
• Transmission electron microscope

We are pleased to announce that Tokyo Machine Works Co., Ltd. will be exhibiting at the "INNOVATION EXPO 2025" to be held at Tokyo Big Sight from September 10 (Wednesday) to September 12 (Friday), 2025. 【Exhibited Equipment】 - 1-ton portable autonomous mobile robot (AMR) - 2-ton portable unmanned transport vehicle (AGV) - Shutter-equipped unmanned transport vehicle - Autonomous cleaning robot, etc. 【Booth Number】 - 6-405 You will have the opportunity to see each machine up close, including demonstrations that link the equipment together. We sincerely look forward to your visit during this event. Please note that pre-registration (free of charge) is required to attend the exhibition, so we kindly ask you to register using the link below. https://www.logistech-online.com/jp/registration.php?exhibitor=EX000072 If you would like an invitation, please request it through our contact form.

Contec has added a BTO menu for the Windows 11-based embedded OS - Windows 11 IoT Enterprise LTSC 2024 to its industrial computer "MR4310 series" and has started accepting orders.

Contec has developed the Ethernet wireless converters "RP-WAH-SR12" and "RP-WAH-SR22," which utilize 920MHz sub-gigahertz wireless (IEEE 802.11ah) to enable Ethernet communication wirelessly even at distances of up to 1 km. Sales began on August 21, 2025. The new products are compact IEEE 802.11ah compliant wireless LAN converters that can be installed in various locations. The new Wi-Fi standard "IEEE 802.11ah," which utilizes sub-gigahertz wireless communication, became available in Japan in September 2022. It operates in the 920MHz band without the need for a license and can be used outdoors. Compared to conventional 920MHz wireless communication, it enables high-speed communication and the establishment of long-distance networks, making it expected to be utilized in large factories, plants, and farms. The new Ethernet wireless converters are designed to be lightweight and compact, allowing for installation in various locations such as walls and DIN rails with the included mounting brackets. Additionally, they support external antennas, enabling the construction of flexible wireless LAN systems.

Contec has developed a super compact business computer equipped with the Intel(R) Core(TM) Ultra processor (Series 1), and has started accepting orders for the business computer "LPC-500 Series" (hereinafter referred to as the new product) from August 28, 2025. The new product is a super compact business computer featuring the Intel(R) Core(TM) Ultra 5 processor 125U (Series 1, Meteor Lake-U). It is equipped with "Intel(R) AI Boost," which integrates an NPU into the CPU, allowing for the execution of AI functions such as image recognition and voice processing at high speed and low power consumption while reducing the load on the CPU and GPU. With ultra-compact dimensions of 150(W) × 150(D) × 33(H) mm, it comes with a vertical stand and VESA mounting brackets, enabling installation in tight spaces on desks, behind displays, or inside equipment without restriction. It adopts a BTO (Build to Order) method that allows customers to freely choose memory capacity, storage, OS, and more, enabling the order of a PC with specifications optimal for their needs and budget starting from just one unit.

Thank you very much for your continued support. We would like to inform you that our company will suspend product shipping operations for inventory purposes due to the interim financial closing on the following dates. We apologize for any inconvenience this may cause and appreciate your understanding. Shipping suspension period: Tuesday, September 30, 2025.