Automation Support! Announcement of July WEB Seminar

【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!

The "PCB Cutting Machine Robot Transport System" can accommodate inline PCB cutting by connecting with the preceding and following processes. Additionally, it can handle batch processing by consisting of a magazine for loading PCBs and a magazine for storing the cut PCBs in trays. With the turntable PCB cutting machine (MR2535H2T) and a robot with a traveling axis, it contributes to reducing takt time, while also expanding the flexibility of the line layout and tray packing of printed circuit boards after cutting, thereby aiding in the automation and labor-saving of factory production. 【Features】 - The line configuration can flexibly adapt to factory layouts, including straight, U-shaped, and L-shaped arrangements. - The multi-joint robot allows for the discharge of cut PCBs, enabling the setting of PCB placement positions in the discharge tray, which is effective for PCB positioning in the next automation process. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Other processing machines
• Circuit board processing machine

Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

By being able to prepare the next workpiece in parallel during substrate processing, we can eliminate waiting time during substrate exchanges. Additionally, by shortening the cycle time, productivity can be improved without increasing the number of operators. The entire process of supplying printed circuit boards, cutting the substrates, and palletizing the cut substrates onto discharge trays can also be automated. (Substrate cutting machine + robot transport system) 【Features】 ■ Equipped with a dual-table automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time through Z-axis height settings for each router location ■ Improved operating rate by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector for compact device size *For more details, please download the PDF or contact us. ★ For those interested in the single type, click here▽ https://mono.ipros.com/product/detail/2000569194 ★ Free seminar here▽ http://www.mtco-web.co.jp/products/web_seminar.html

• Printed Circuit Board
• Other processing machines
• Circuit board processing machine

Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

The "MR2535H2" is a device that divides multiple small and complex-shaped circuit boards using a router method. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. By utilizing automation and IT technologies cultivated at Mitsubishi Electric's Nagoya Works for equipment design and manufacturing, it supports improvements in factory productivity and quality. 【Features】 ■ Cuts unnecessary parts of complex-shaped printed circuit boards after mounting using a router bit ■ Improves setup efficiency by widening the opening width of the device's access door ■ Achieves space-saving by incorporating a dust collector within the device's lower section ■ Significantly enhances productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models) ■ Allows for setting the Z-axis position for each cutting point, enabling shorter takt times ■ Supports image teaching functions for setting cutting points on various types of circuit boards *For more details, please download the PDF or contact us.

• Circuit board processing machine

"gPROMS Formulated Products Crystallization Workshop" Target Audience: • For those interested in crystallization modeling with gPROMS Overview ・Date: July 1 (Wednesday) 13:00–17:30 ・Format: Virtual classroom via remote Teams ・Language: Japanese *The text will be in English only. Details will be provided after registration. ・Machine: Exercises will be conducted on a virtual machine using gPROMS. Internet access and a personal laptop are required. Further details will be provided to registered participants later. ・Cost: Free *Registration may be declined for competitors or those using free email addresses.

We regularly conduct training and workshops on our products. The schedule for May to July is as follows: May 29 (Monday) Introduction to ProcessBuilder May 30 (Tuesday) Custom Modeling with gPROMS June 26 (Monday) Introduction to gCRYSTAL July 31 (Monday) Introduction to ProcessBuilder We hope you will join us.

In the manufacturing industry, while a lot of quality and process data has been accumulated, there are still many cases where its value is not fully utilized. In this seminar, two companies will introduce examples of using JMP to engage in data analysis and improvement activities. 【Presentation Overview】 1. "Unraveling the 'Personality' of Batteries!" Utilizing "Raw Data" for "Proactive Quality" Hasegawa Kaoru and Shimada Kohei from Energy With Co., Ltd. 2. Why Can't We Find the Root Cause of Defects? ~Data-Driven Improvement Practiced with JMP~ Tsuji Ikumi from Atfields Technology Co., Ltd. 【Target Audience】 - Individuals involved in quality control, quality assurance, production technology, and manufacturing technology in the manufacturing industry. - Those who want to utilize quality data and process data to work on quality and process improvements. - Anyone interested in data analysis and quality/process improvement using JMP (both JMP users and non-users are welcome). ▼Details & Registration https://www.jmp.com/ja/events/seminars/non-series/2026/09-18-manufacturing

With wisdom and technology, we will pave the way for the future of logistics. We will be exhibiting at the "International Logistics Comprehensive Exhibition 2026." When you visit, please be sure to stop by our booth. We sincerely look forward to your visit. 【Event Period】 September 8 (Tuesday) - September 11 (Friday), 2026 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight (Tokyo International Exhibition Center) Halls East 1-3, 7-8, West 1-4 【Booth Number】 E8-L10 【Admission Method】 This exhibition requires pre-registration for attendance. Please register in advance on the registration page to obtain your visitor badge. Visitors without pre-registration or an invitation will be required to pay an admission fee of ¥3,000.

In order to improve fuel efficiency in automobiles, aerospace, and other fields, the development of manufacturing technologies for materials and components aimed at further weight reduction is becoming more active. In this seminar, we will first explain the principles and characteristics of carbon fiber composite material 3D printers, additive manufacturing (AM) technology, the latest trends of major domestic and international companies and equipment, applications for lightweight structures, the latest research on quality prediction using machine learning, and future directions. After that, we will provide an overview and features of the carbon fiber 3D printer product line from Markforged, the world leader in the development and commercialization of CFRP-compatible 3D printers, including examples of component manufacturing and lightweighting technologies. We will also discuss lightweighting cases through component manufacturing technology and topology optimization at Shinwa Seiko, which was the first in Japan to introduce Markforged's carbon fiber 3D printers. Additionally, UCHIDA, which boasts high technical capabilities in CFRP molding processing, has introduced Japan's first Caracol CFRP-compatible robotic arm large pellet 3D printer, and we will explain the CFRP molding and component manufacturing technologies and manufacturing examples they have utilized, as well as cases that achieved cost reduction through workforce reduction in the molding process, lead time shortening, and recycling of molds after use. We will also compare these with traditional methods and provide examples, as well as discuss efforts to reduce carbon dioxide emissions through material recycling and initiatives toward a circular economy.