Automation Support! Announcement of July WEB Seminar

【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!

The "PCB Cutting Machine Robot Transport System" can accommodate inline PCB cutting by connecting with the preceding and following processes. Additionally, it can handle batch processing by consisting of a magazine for loading PCBs and a magazine for storing the cut PCBs in trays. With the turntable PCB cutting machine (MR2535H2T) and a robot with a traveling axis, it contributes to reducing takt time, while also expanding the flexibility of the line layout and tray packing of printed circuit boards after cutting, thereby aiding in the automation and labor-saving of factory production. 【Features】 - The line configuration can flexibly adapt to factory layouts, including straight, U-shaped, and L-shaped arrangements. - The multi-joint robot allows for the discharge of cut PCBs, enabling the setting of PCB placement positions in the discharge tray, which is effective for PCB positioning in the next automation process. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Other processing machines
• Circuit board processing machine

Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

By being able to prepare the next workpiece in parallel during substrate processing, we can eliminate waiting time during substrate exchanges. Additionally, by shortening the cycle time, productivity can be improved without increasing the number of operators. The entire process of supplying printed circuit boards, cutting the substrates, and palletizing the cut substrates onto discharge trays can also be automated. (Substrate cutting machine + robot transport system) 【Features】 ■ Equipped with a dual-table automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time through Z-axis height settings for each router location ■ Improved operating rate by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector for compact device size *For more details, please download the PDF or contact us. ★ For those interested in the single type, click here▽ https://mono.ipros.com/product/detail/2000569194 ★ Free seminar here▽ http://www.mtco-web.co.jp/products/web_seminar.html

• Printed Circuit Board
• Other processing machines
• Circuit board processing machine

Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

The "MR2535H2" is a device that divides multiple small and complex-shaped circuit boards using a router method. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. By utilizing automation and IT technologies cultivated at Mitsubishi Electric's Nagoya Works for equipment design and manufacturing, it supports improvements in factory productivity and quality. 【Features】 ■ Cuts unnecessary parts of complex-shaped printed circuit boards after mounting using a router bit ■ Improves setup efficiency by widening the opening width of the device's access door ■ Achieves space-saving by incorporating a dust collector within the device's lower section ■ Significantly enhances productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models) ■ Allows for setting the Z-axis position for each cutting point, enabling shorter takt times ■ Supports image teaching functions for setting cutting points on various types of circuit boards *For more details, please download the PDF or contact us.

• Circuit board processing machine

The goal is not to introduce AI. We will explain "standardization of manufacturing processes" to eliminate dependency and maximize the effectiveness of AI! While the spread of generative AI is progressing, there is an increasing number of manufacturing companies that say, "We don't know where to apply AI due to the black box nature of the site," and "Despite implementation, productivity hasn't increased." The cause lies not in the performance of AI, but in the "lack of business organization and standardization before implementation." In this webinar, we will clearly explain business improvement methods (BPMS) and how to properly organize business processes to avoid wasting AI investments, using case studies. [Recommended for those who:] - Are struggling to engage the field due to resistance like "busy" or "it's fine as it is." - Want to eliminate differences in rules between factories and locations, as well as dependency and black box issues with veteran employees. - Are being asked to "utilize AI" but don't know where to start due to disorganized business processes. [Here is the application form] https://www.earthlink.co.jp/seminar/10840/ *Pre-registration required (free) *We will give a "partial excerpt of the presentation materials" to those who respond to the survey after viewing.

[Speaker] Ms. Sayako Sumomo, Director, International Equipment Division, Equipment Policy Department, Acquisition, Technology & Logistics Agency [Key Lecture Content] As the security environment surrounding our country changes at an accelerating pace, the government is promoting defense equipment transfers as an important policy measure to create a desirable security environment for our nation. Promoting defense equipment transfers not only enhances regional deterrence and response capabilities for peace and stability in the Indo-Pacific region but also contributes to strengthening our country's defense production and technological base through market expansion and supply chain cooperation. Furthermore, the development of the defense industry and other industries with dual-use technologies can lead to growth in the Japanese economy. In this lecture, I will explain recent trends in defense equipment transfers, taking into account the recent revisions to the equipment transfer system. [Lecture Topics] 1. Japan's Defense Policy 2. Significance and System of Equipment Transfers 3. Recent Trends in Equipment Transfers 4. Government Initiatives 5. Q&A / Business Card Exchange

[Speaker] Hiroki Hara, Country Lead, Cloud & Service Provider Segment, Schneider Electric Holdings Co., Ltd. [Key Lecture Content] In the era of AI, it is essential to redesign not just the equipment but the very way energy is utilized in data centers. This presentation will organize the approach to power architecture aimed at enhancing competitiveness, taking into account global trends and the constraints of the Japanese market. Additionally, through Schneider Electric's comprehensive portfolio, which includes cooling and operations, we will provide perspectives for selecting optimal options in Japan's increasingly complex power environment, as well as hints for future implementations. [Lecture Items] 1. Introduction to Schneider Electric 2. Global megatrends and the external environment surrounding the data center industry 3. Architecture of data center power infrastructure - Design philosophy necessary for safely delivering electricity 4. Schneider's portfolio connecting power and cooling, design, construction, and operation 5. Unique challenges of the Japanese market and options for optimal solutions 6. Q&A / Business card exchange

[Speaker] Yuya Sato, Director, Innovation Management Co., Ltd. [Lecture Topics] 1. Main challenges in the field of research and development 2. Overview of research and development management 3. How to utilize "roadmaps" for formulating persuasive mid- to long-term strategies 4. How to utilize "technology portfolios" to achieve convincing resource allocation 5. "Gate management" to improve the success rate of highly innovative research and development themes 6. Integrated research and development management process 7. Q&A

Our TL Division will be exhibiting at the "Surface Treatment Processing Technology Exhibition 2026" to be held on June 26 (Friday) at the Osaka Industry Creation Center. We invite you to visit our booth to see our products and technologies. We sincerely look forward to your attendance. ■ Exhibition Name Surface Treatment Processing Technology Exhibition 2026 ■ Date June 26, 2026 (Friday) ■ Venue Osaka Industry Creation Center, 3F Market Plaza / 4F Event Hall ■ Exhibited Technology We will introduce optimal solutions for surface modification composites and ultra-hard coating removal by adding a new coating to Y-Coat, which leads the mold market. New Coating: Y-Coat Type UL Product Introduction Page