September 9 (Tuesday) Webinar "Fundamentals of Chiplet Implementation and Testing/Evaluation Techniques"

Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!

【Features of this Book】 - Characteristics required for glass substrates for semiconductor packages and trends in the development of glass interposers! - Advantages and disadvantages of backside power supply technologies from the three major semiconductor manufacturers, their business strategies, and mass production timelines? - Business strategies of foundries, EMS, fabless companies, OSAT, and semiconductor manufacturing equipment-related companies! - Characteristics and applications of 2D and 3D implementations using chiplets for heterogeneous integration! - Material properties required for 2.5D and 3D packages! Including redistribution layers, encapsulants, underfills, etc.! - Types of manufacturing processes for FOWLP/PLP, related companies, and requirements for package component mounting! - Intensifying global competition for HBM market share and the business opportunities for Japanese companies that accompany it! - Performance and technology trends required for underfills, market forecasts, and company-specific shares explored! - Design and quality requirement levels to accommodate chipletization in the manufacturing of copper-plated wiring! 【Table of Contents Structure】 Part I: Introduction to Chiplets Part II: Advanced Packaging Technologies Part III: Technologies, Materials, and Equipment for Chiplet Packaging *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Happy Japan will exhibit at the "Order Goods Business Show 2025," the largest exhibition in Japan gathering products and manufacturing equipment for the stamp business, apparel printing, and original promotional goods, held from September 30 to October 1, 2025. We will showcase a live demonstration of our industrial single-head embroidery machine. The Order Goods Business Show proposes a multifaceted business that merges processing businesses and promotional goods, featuring manufacturers and dealers related to order goods, providing attendees with the opportunity to encounter new business ventures. We invite you to visit the Happy Japan booth. We sincerely look forward to your attendance. Order Goods Business Show 2025 website: https://ogbs.jp/ Organized by: Order Goods Business Show Executive Committee (within Gendai Publishing Co., Ltd.)

Takaya Corporation will be exhibiting at the "MES2025 35th Microelectronics Symposium," which will be held for three days from September 3 (Wednesday) to September 5 (Friday), 2025, at the Osaka University Nakanoshima Center in Osaka City, Osaka Prefecture. Takaya plans to showcase a panel related to the APT series of flying probe testers. This symposium is a valuable opportunity to gather the latest research results and industry trends regarding electronic device packaging technology. We warmly invite you to visit Takaya's booth when you attend. We look forward to welcoming you.

The "Security Days," which has been held annually since 2013 while expanding in scale, will take place this October in Fukuoka for the first time in several years. Focusing on "cybersecurity measures," one of the important management challenges, we will provide a comprehensive explanation of the latest threat trends through seminars and exhibitions. - Collaborating Speakers - (as of July 28) Kyushu University / QTnet / National Police Agency / Public Security Intelligence Agency / Information-Technology Promotion Agency / Graduate School of Information Security / Ministry of Internal Affairs and Communications / Japan Hacker Association / Fukuoka University / Ministry of Defense / Yokogawa Electric / The Linux Foundation Japan

When considering updates or implementations of core systems, it is not uncommon to struggle with how to handle existing peripheral systems and proprietary business systems. When systems become siloed, issues such as inefficiencies due to duplicate data entry, input errors, and data inconsistencies caused by timing of synchronization are more likely to occur. If you try to connect each system individually, it will require the development of different interfaces for each connection point, which not only increases labor and costs but also poses a risk of needing modifications to existing systems. To address these challenges, utilizing "ASTERIA Warp," which enables data integration without coding, allows for significant reductions in development labor and seamless system integration. In this seminar, we will introduce case studies of data integration from peripheral systems to core systems like SAP, built using ASTERIA Warp. We will specifically explain points to reduce the burden of modifications on the integration parts while leveraging existing peripheral systems, thereby shortening the implementation period for core systems.

"Security Days" will expand in scale this October and will be held in a total of four cities: Tokyo, Osaka, Nagoya, and Fukuoka. We will share the latest trends and countermeasures against increasingly sophisticated and malicious cyber attacks, such as targeted attacks, ransomware, cloud security, and information leakage prevention, through seminars and exhibitions. As there are limited seats for the seminars, please invite your colleagues or relevant section members and make sure to register early! ▼ Recommended Keynote Speeches - The Current State of Cybersecurity and Cybersecurity Policy (tentative) [Ministry of Economy, Trade and Industry] - Trends in Cyber Risks and Security Strategies in the Transportation Sector [Ministry of Land, Infrastructure, Transport and Tourism] ━━━━━━━━━━━━ ★ Special programs unique to the Tokyo venue will be held! ━━━━━━━━━━━━ - Workshops featuring specialists from various fields for more specialized and practical sessions - "Night Sessions" with light meals, making it easy to participate even after work on weekdays - A spacious exhibition area with approximately 60 diverse booths - A "Visitor Campaign" where attendees can win prizes unique to each hosting region on the spot And there are still many more exciting plans in store!