Example of failure analysis of chip resistors
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We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed.
Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant circuit board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, suggesting that the undercoat layer may be exposed.
Next, a cross-sectional sample was prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which showed that the protective film and the resistive element appeared to be melted.
It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface, and it is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive element to melt and the resistance value to change (leading to an open circuit).
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