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  1. Home
  2. Electronic Components and Semiconductors
  3. オルテコーポレーション 本社
  4. We will be exhibiting at the 2nd Semiconductor Industry Exhibition to be held in Kyushu in October 2025.
SEMINAR_EVENT
  • Sep 05, 2025
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Sep 05, 2025

We will be exhibiting at the 2nd Semiconductor Industry Exhibition to be held in Kyushu in October 2025.

オルテコーポレーション オルテコーポレーション 本社
This time, Orte Corporation will exhibit at the "2nd Kyushu Semiconductor Industry Exhibition," continuing from last year. As a specialized manufacturer of collets for chip transport, we will introduce a variety of cutting-edge products that respond to the latest assembly processes, including rubber collets for ionizer countermeasures and patented holder mechanisms that can accommodate high-aspect and large chips. Particularly noteworthy is the rubber collet with a U-shaped recessed type that achieves a contact width of less than 0.1mm between the chip and the collet, utilizing ultra-precision processing technology. It is also compatible with optical devices and bumped chips, making it ideal for high-precision applications that require flatness at the collet tip. We will have sample displays of our products, including collets, so please feel free to stop by our booth. 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)
Date and time Wednesday, Oct 08, 2025 ~ Thursday, Oct 09, 2025
10:00 AM ~ 05:00 PM
Reservation required in advance.
Capital Venue: Marine Messe Fukuoka Hall B, Booth Number: B6-2
Entry fee Free Advance registration required.
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0830メルマガキャンペーン画像2.jpg

Prevention of semiconductor chip removal: "Replaceable Rubber Collet"

Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.

Our company offers "rubber collets" that are less likely to cause semiconductor chip carry-out errors due to their low adhesion and are easy to replace. We have a wide range of standard sizes available and can also accommodate customizations according to your needs. Additionally, we strive for reasonable pricing. Currently, we are giving away product samples to 10 people through a lottery. If you are interested, please feel free to apply via the [Contact Form]. [Features] ■ Available in round, square, and rectangular tip shapes ■ We generally cover the mold costs for custom tip sizes ■ Made of rubber to avoid scratches on chip surfaces ■ Compliant with RoHS directives <Please consider adopting ORUTE as your partner!> (1) We have unique products with excellent functionality and extensive experience and track record. (2) We provide products that can address and solve your company's challenges. (3) We comply with regulations on chemical substances contained in products, such as RoHS. *For more details, please refer to the comprehensive catalog of our products available for download. *Our company will be exhibiting at the "1st Semiconductor Industry Exhibition" held at Marine Messe Fukuoka B Hall on September 25 (Wednesday) to 26 (Thursday).

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Electronic Components and Semiconductors
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ROAD 2026

ROAD 2026: The 7th Roundtable on the Purpose of Autonomous Driving, Japan

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About ROAD: The "Roundtable on the Purpose of Autonomous Driving (ROAD)" conference series has evolved into a unique platform for interdis-ciplinary dialogue and international collaboration in the field of autonomous driving and autonomous mobility. Established in 2016, ROAD has brought together researchers, industry leaders, and public sector stakeholders from six countries across three continents. Based on this background, the upcoming ROAD 2026 will focus on "safety” and "driving AI”—the final pieces of the autonomous driving puzzle—to advance discussions on establishing the foundational framework for ensuring safety quality and obtaining regular-tory approval for autonomous driving. We also intend to discuss the international commonalities and differences regarding the social value brought about by ADS vehicles in terms of automation, intelligent driving, and mobility. We have established a total of five compelling themes for the Round Workshops, consisting of two topics related to “The Last Piece” and three topics related to the social value of ADS, as shown below. 1) Round Workshop 1 - Horizons of E2E Driving AI → Can AI Understand the Driving Environment Like Humans? 2) Round Workshop 2 - Beyond the Unknown: Safety Cases for ADS → Can Safety Ever Be Proven? 3) Round Workshop 3 - Envisioning Smart City Mobility → Can Smart City Mobility Bridge the Mobility Divide? 4) Round Workshop 4 - Logistics Enhancement Through Autonomous Tracking → Will Logistics Become Human-Free? 5) Round Workshop 5 - The Evolution of CASE: SDV/AIDV → Will Automakers Become AI Companies? We hope you’ll all join us!

Jun 28, 2026

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[Seminar] Practical Implementation of Liquid Cooling Design and Energy-saving Operations for AI Data Centers

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[Speaker] Masashi Sugita, President and CEO of LEX Style Co., Ltd. [Key Lecture Content] The power consumption of AI servers used in data centers has significantly increased, making traditional air cooling insufficient for operation. This lecture will organize the requirements for introducing a liquid cooling system into air-cooled data centers and explain the implementation method using free cooling with specific design details. When handling high-density AI servers, energy efficiency is required, and the widely used energy efficiency indicator, as well as the Ministry of Economy, Trade and Industry's Resource and Energy Agency's PUE regulation of "1.3 or below," will be explained along with practical operational insights. [Lecture Items] 1. Heat dissipation methods for high-density, high-heat AI servers 2. Basics and importance of PUE/pPUE 3. PUE regulation of "1.3 or below" by the Ministry of Economy, Trade and Industry's Resource and Energy Agency 4. AI server implementation and requirements for new data centers 5. Summary and future outlook 6. Q&A / Business card exchange

Jun 26, 2026

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[Seminar] Measures for Promoting SAF and the Frontlines of Aviation Decarbonization

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[Key Lecture Content] 1. Promotion of SAF Introduction Yasushi Yamashita, Director, Carbon Neutral Promotion Office, Aviation Bureau, Ministry of Land, Infrastructure, Transport and Tourism 1. Importance of SAF in the decarbonization of the aviation sector 2. Initiatives to promote the introduction of SAF 3. Q&A / Business card exchange 2. Japan Airlines' Challenge Towards Net Zero CO2 Emissions by 2050 Kazuki Hirotani, Group Leader, GX Planning Group, Sustainability Promotion Department, Japan Airlines Co., Ltd. 1. Introduction of our five initiatives for CO2 emission reduction 2. Initiatives for reducing fuel consumption (introduction of fuel-efficient aircraft, operational improvements) 3. Initiatives for fuel transition (sustainable aviation fuel SAF) 4. Initiatives for reductions outside the value chain (carbon credits, new removal technologies) 5. Initiatives to deepen collaboration with society 6. Q&A / Business card exchange

Jun 26, 2026

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[Seminar] Design and Operation of Civil Liability and Governance in AI Development and Use

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[Instructor] Yuichiro Kabushiki, Partner Lawyer at TMI Comprehensive Law Office [Key Lecture Content] With the spread of AI, there is growing attention on the civil liability of developers, providers, and users of AI. The Ministry of Economy, Trade and Industry will publish "Guidelines on the Interpretation and Application of Civil Liability in AI Utilization" in April 2026, and the Ministry of Justice will also establish an expert meeting to examine civil liability related to unauthorized use of images and voices generated by AI in the same month. As the full enforcement of the AI Promotion Act and the revision of AI guidelines are underway, it is necessary to design and operate governance based on the potential responsibilities that may arise retrospectively. In this seminar, based on the guidelines from the Ministry of Economy, Trade and Industry and drawing on litigation practice experience as a judge and lawyer, we will organize the basic framework for assessing civil liability and explain fundamental methods for designing and operating governance based on risk analysis. Furthermore, we will examine the framework for civil liability and the design and operation of governance using hypothetical cases that are likely to pose practical issues.

Jun 26, 2026

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Winning Through Era-Defining On-Site Improvements! AI Utilization Seminar for Automotive Parts Suppliers in Manufacturing Sites

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In this seminar, we will welcome Mr. Satoru Hayami from Waseda University, who will explain the latest trends in AI utilization in manufacturing, as well as the evolution of technologies such as agent-based AI and physical AI, and the opportunities and key points for practical application in the manufacturing industry. Furthermore, Mr. Tsubasa Shibata, representative of Next Opt, will introduce processes aimed at practical implementation, incorporating actual case studies from manufacturing sites. We hope you will envision the "potential for AI utilization in your company" and take home hints that will lead to improvements in your operations starting tomorrow. We look forward to your participation.

Jun 26, 2026

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