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  3. Daitron Co., Ltd.
  4. Notice of participation in the 'Monozukuri ODM/EMS Exhibition Osaka' from Wednesday, October 1, 2025, to Friday, October 3, 2025.
SEMINAR_EVENT
  • Sep 17, 2025
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Sep 17, 2025

Notice of participation in the 'Monozukuri ODM/EMS Exhibition Osaka' from Wednesday, October 1, 2025, to Friday, October 3, 2025.

Daitron Co., Ltd. Daitron Co., Ltd.
Daitron Co., Ltd. will be exhibiting at the "Monozukuri ODM/EMS Exhibition Osaka." This exhibition features companies from around the world dealing with IT, DX products, components, equipment, devices, and measurement products, and it serves as a platform for active business discussions with professionals from the design, development, manufacturing, production technology, purchasing, and information systems sectors of domestic and international manufacturing industries. We will also have demo units and samples available, so please visit our booth. < Monozukuri ODM/EMS Exhibition > - Dates: October 1 (Wednesday) to 3 (Friday), 2025 10:00 AM to 5:00 PM - Venue: Intex Osaka - Booth Number: Hall 5, 32-21 < Online Exhibition > You can view the exhibition content online. For details, please check the link at the bottom of the page (yellow booth). < Seminar Announcement > During the exhibition period, we will hold a session by our engineers at the venue. They will provide detailed explanations about the "Environmental Measurement Compact Sensors & Visualization System" that we are showcasing, so we encourage you to participate.
Date and time Wednesday, Oct 01, 2025 ~ Friday, Oct 03, 2025
10:00 AM ~ 05:00 PM
Capital Intex Osaka Manufacturing NEXT Seminar Venue 6 (Building 6 A)
Entry fee Free
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Notice of the Manufacturing ODM/EMS Exhibition [Osaka] Online Exhibition

The exhibits at this exhibition can also be viewed online.

No registration is required, so please feel free to take a look.

  • Switching Power Supply

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Ultra-Low Noise Power Supply Series

An ultra-low noise/low noise AC-DC switching power supply suitable for replacing linear power supplies!

Our "Ultra Low Noise Power Supply Series" achieves the compactness, lightweight, and high efficiency characteristic of switching power supplies while maintaining noise performance equivalent to linear power supplies. This significantly reduces the man-hours required for noise countermeasures across the entire customer system and alleviates the burden on design. It can be widely used from measurement and analysis equipment to semiconductor manufacturing equipment. 【Features】 ■ Ultra-low output ripple noise of 1mV (RFS series) ■ Super low output ripple noise of 10mV (LFS, PFS series) ■ Low noise terminal voltage (input feedback noise), low noise electric field strength (radiated noise) ■ Low leakage current ■ Significant reduction in output common mode noise (RFS series) *For more details, please refer to the PDF document or feel free to contact us.

  • Switching Power Supply

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Hermetic Connector "HMSB Series"

This is a through bulkhead type glass hermetic connector that fits the MIL-DTL-5015 plug, which has excellent airtightness.

【Features】 - Can be used as current introduction terminals for vacuum containers, pressure vessels, etc. - The shell is made of stainless steel, eliminating concerns about corrosion. - Sealed with glass, it offers excellent airtightness (below 1×10^-10Pa·m3/sec). It also has superior heat resistance and vibration resistance, making it suitable for use in harsh environments. - Waterproof and drip-proof structure (when fitted), allowing for outdoor use. 【Structure and Surface Treatment】 - The flange part of the shell is machined with an O-ring groove. - The shell has a nickel-plated finish.

  • Other Connectors

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Custom UPS contract

Numerous implementation results and proprietary know-how! We offer optimal proposals for enclosure design, battery placement, and more.

Daitron utilizes analog and digital technology resources to customize UPS (Uninterruptible Power Supply) systems that match our customers' needs. We have numerous implementation records in semiconductor manufacturing equipment, medical diagnostic devices, and various inspection and measurement devices, and we possess unique know-how. The output variations are approximately 3kW for AC and approximately 3kW for DC. Additionally, we support both lead-acid batteries and lithium-ion batteries. 【Features】 - Optimal proposals for chassis design and battery placement - Output variations: - AC: approximately 3kW - DC: approximately 3kW - A wide selection of batteries - Communication with external devices mainly via RS232C, I2C, CAN, etc. *For more details, please refer to the related links or feel free to contact us.

  • Contract manufacturing

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Related catalog(2)

Daitron Co., Ltd. Exhibited Products - Monozukuri Osaka 2025

Daitron Co., Ltd. Exhibited Products - Monozukuri Osaka 2025

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

  • NEW
  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

  • NEW
  • SEMINAR_EVENT

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

  • NEW
  • SEMINAR_EVENT

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

  • NEW
  • SEMINAR_EVENT

Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

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[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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