高機能素材Week 「第5回 サステナブル マテリアル展」に出展します

"The convenience of plastic and the eco-friendliness of biomass" biomass compound resin containing wood-derived cellulose that contributing to sustainability.

"The convenience of plastic and the eco-friendliness of biomass" - GREEN CHIP CMF is a biomass compound resin contains wood-derived cellulose fiber, contributing to sustainability - Our GREEN CHIP CMF contains 55% wood-derived cellulose fiber, significantly reducing the use of petroleum-derived plastics - When using GREEN CHIP CMF, which contains 55% cellulose fiber, the amount of total CO2 emissions, from manufacturing to incineration, can potentially be reduced by approximately 20%*1 compared to petroleum-derived resins. *1: By our own calculations based on the Ministry of the Environment's "Guidelines for the Utilization and Application of Cellulose Nanofiber Towards the Decarbonization and Achievement of a Circular Economy" - GREEN CHIP CMF has obtained the Biomass Mark in Japan and TUV AUSTRIA OK biobased certification in Europe - No need to replace currently used molds. Moldability is the same level as conventional resin. - Tensile strength, flexural strength, flexural modulus and heat resistance (load deflection temperature) are improved compared with unreinforced polypropylene resin (PP resin), so it is possible to make molded products thinner - Recyclable: Materials with low attenuation (damping) rate of properties compared to glass fiber compounds - Cellulose fibers can be blended with resins other than polypropylene resin

• Composite Materials

Highly filled composite material sheet containing inorganic fibers and powders, developed using advanced papermaking technology refined over many years

[Features] - Thin inorganic fiber sheet holding functional powder - Excellent low thermal conductivity and high thermal insulation - Thinness available to be combined with other sheet materials [Application] - Measures against ignition and heat generation for various batteries - Partial insulation of industrial equipment

• Secondary Cells/Batteries
• Lithium-ion battery

Enable usage in environments up to 1600°C

These products are sheets made by adding a small amount of organic binder to various inorganic (ceramic) fibers such as rock wool, AES (alkali Earth Silicate) fiber, alumina fiber, and others. It equipped with cushioning and flexibility and can be customized to a range of thicknesses and hardness levels. * Since these products contains an organic binder, smoke or gas may be generated during initial heating.

• Ceramics

Since pulp fibers are used, it provides excellent cushioning and can effectively embed into uneven surfaces. It can also be used with cards and tags equipped with IC chips.

"We want to simplify the production process for Cards and tags with embedded IC chips." Do you have any such concerns? Conversion sheets are made by blending pulp fibers with resin fiber. Due to the use of pulp fibers, these products are highly cushioned and exhibit excellent ability to fill in uneven surfaces. Therefore, when electronic components (such as IC chips) are sandwiched and laminated with heat, it is easy to create planar shapes. [Other Features] Temperature processing from 80 ℃ is possible Before heating, the material is flexible and can be easily processed like paper. When heat is applied, it exhibits property changes similar to plastic sheets while maintaining water and heat resistance. With a pulp fiber content of over 51%, it contributes to plastic reduction. [Application] - IC cards - IC Tag - Reduces environmental impact as a substitute for plastic products, etc.

• Paper and pulp products

We will be exhibiting at the "43rd Nano Testing Symposium (NANOTS2023)" held at the Senri Life Science Center in Toyonaka City, Osaka Prefecture! We will be introducing our latest analytical technology services, so please stop by! We sincerely look forward to your visit.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

We will be exhibiting at JAPAN PACK 2025 (Japan Packaging Industry Exhibition)! Please be sure to visit us. [Exhibited Products] Pineapple suction project Live demonstration of a collaborative robot hand 5kg dual-sided gripper Comparison of compressed air ejectors with other companies 【Gripper Sale】 We will be selling the following two products at a discounted price at our booth. Please inquire about the special price at the venue. ■ 'KENOS Gripper KVGL.400.100, N214.FR6.S2' URL: https://www.youtube.com/watch?v=HsNRwrDtjW0 ■ 'Collaborative Robot Hand KCS.Q110.N301.110.FR6.SX422.V1.X.X' URL: https://www.youtube.com/watch?v=GFKg3blZzdQ These products are ideal not only for actual applications but also for use as test machines. How about taking this opportunity?

"We want to digitize paper documents within the company, but we don't know which service to choose" and "We can't keep up with the changes in the Electronic Bookkeeping Law and the legal revisions in the construction and manufacturing industries." For those individuals, we have an announcement. The electronic contract and document management service, paperlogic, will be exhibiting at the event 'Serious DX & AI Strategy 2025' held on October 15 (Wednesday) at Sogo Yokohama. This time, there will also be a seminar led by our representative, certified public accountant and tax accountant Koichi Yokoyama. We will also be conducting product demonstrations at the exhibition, so please come and visit us. ● Our representative, Yokoyama, will also give a lecture! Luxurious Seminar At 'Serious DX & AI Strategy 2025', Koichi Yokoyama, the representative of Paperlogic Inc., will be speaking in [Seminar B Course]. On that day, he will introduce key points of laws including the revised Construction Industry Law, which will be enforced by December 2025, and related document management, from the perspective of a certified public accountant and tax accountant. Additionally, there will be seminars that are useful for utilizing AI and DX. For more details, please check the event website.

This is the announcement for the second part of the Op-Amp Classroom Series, "Op-Amp Classroom - DC Characteristics and AC Characteristics." We will explain the DC and AC electrical characteristics as the basics of op-amps. Since we will start with an introduction to fundamental functions, those who have not participated in Op-Amp Classroom 1 are also welcome to join. The difficulty level is beginner to intermediate, so whether you are new to analog ICs or have specific issues, we encourage you to participate! ● Target Audience - Engineers who are new to analog circuit design - Board evaluators and test engineers - Those who are newly responsible for component purchasing ● Agenda 1. Electrical Characteristics of Op-Amps (DC Characteristics) - Input offset voltage / Input bias current - Common-mode input voltage range and input stage configuration - Output inversion of dual-supply op-amps - What are sink/source currents? - Crossover distortion 2. Electrical Characteristics of Op-Amps (AC Characteristics) - What is slew rate? - What is gain-bandwidth product (GBW)? 3. Oscillation of Op-Amps We look forward to your participation!