We exhibited at the New Technology Creation Exchange Meeting 2025.

VGA-capable compact ToF AI smart camera.

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a maximum resolution of 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

2 million pixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

8-megapixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of processing images with resolutions up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

A compact AI smart camera with dual lenses capable of measuring distance and acquiring RGB information.

A compact AI smart camera that integrates a high-quality image sensor and image processing. It uses a SONY ToF sensor and an onsemi GS sensor. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of processing images with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

AI smart camera (edge AI) equipped with EVS that detects changes in brightness.

This is a compact and lightweight AI smart camera that adopts Prophesee's EVS (Event-Based Vision Sensor). The EVS captures only changes and events within the scene, achieving extremely high temporal resolution (equivalent to 10K frames) and a wide dynamic range compared to traditional frame-based image sensors, while also reducing data bandwidth. It can be utilized for applications such as spatter/drip monitoring, high-speed motion capture, and intrusion detection under harsh lighting conditions. The core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing at resolutions up to 13M (including AWB, AE, etc.). *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• High Speed Camera

A lineup of 2M, 4K, ToF, ToF+RGB, and EVS sensors! Suitable for various applications such as drones, embedded robots, logistics, and security.

The "SCM Series" is a compact smart camera that integrates high-quality image sensors and image processing. By combining the image sensor and image processing, it enables real-time processing within the camera, making it an edge AI camera. At the core of the system is the AI processor "i.MX 8M Plus" from NXP Semiconductors, which features up to four 1.8GHz Arm Cortex A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with resolutions up to 13M (including AWB, AE, etc.). Due to these specifications and its compact size, it can be utilized in various applications such as drone payloads, embedded robotics, logistics, and security, where payload is a priority. 【Features】 ■ Models equipped with 2M, 4K, ToF, ToF+RGB, and EVS (Event Vision Sensor) are available. ■ Equipped with the AI processor "i.MX 8M Plus." *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Color camera

USB3.2 5Gbps 3 million pixels high-speed imaging model

This is a camera series that adopts a USB 5Gbps interface. - Image transmission, camera control, and power supply are possible with a single USB cable. - Thoroughly designed for low power consumption, achieving a small product size. - Offers both monochrome and color models in the lineup.

• Monochrome camera

We will be exhibiting at the J AGRI (J Agri) / Agricultural Materials EXPO held at Gran Messe Kumamoto from May 22 (Wednesday) to May 24 (Friday), 2024. 【Booth Number】: B1-43 Outdoor Exhibition Area Japan's largest comprehensive exhibition for agriculture and livestock, Agricultural WEEK, will be renamed J AGRI starting in 2024. This is a place where you can actually see, touch, and compare products. At our booth, we will showcase our lightweight resin flooring boards "JULIGHT / SUPER JULIGHT / RAKURAKUBAN" along with new products. Starting with the agricultural-specific flooring board "RAKURAKUBAN," which can be easily laid in various scenes such as around greenhouses, agricultural work sites, temporary parking lots, for the movement of agricultural machinery and light trucks, and for protecting truck beds, there are various ways to use the lightweight resin flooring boards "JULIGHT / SUPER JULIGHT series." We offer a variety of sizes and protrusion shapes tailored to customer needs, and they are lightweight enough to be carried by hand, with excellent impact resistance, as well as superior water resistance, weather resistance, and durability, providing outstanding features not found in plywood or steel plates. We sincerely look forward to your visit.

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the 28th INTERPHEX Week Tokyo. At the exhibition, we will be showcasing 100% inspection equipment compliant with Container Closure Integrity Testing (CCIT) standards, as well as sampling inspection machines. We sincerely invite you to visit our booth at this opportunity and would greatly appreciate your attendance despite your busy schedule. Yours sincerely, [Dates] May 20 (Wed) - 22 (Fri), 2026 10:00-17:00 (JST) [Venue] Makuhari Messe, Japan 8 Hall Booth No. 41 - 36

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the AUTOMOTIVE ENGINEERING EXPOSITION 2026 YOKOHAMA. At this exhibition, we will be showcasing testing equipment such as Air Leak Tester for EV and Equipment Mounted Type Hydrogen Leak Detector. We sincerely hope you will take this opportunity to visit us. Yours sincerely, [Official Site] https://aee.expo-info.jsae.or.jp/en/yokohama/ [DATES] Wednesday, May 27, through Friday, May 29, 2026 10:00 a.m. - 5:00 p.m. [VENUE] PACIFICO Yokohama, Exhibition Hall, Booth No. ２７４ ※Online Exposition Website：Tuesday, May 19, through Tuesday, June 9, 2026

[Speaker] Toshio Fujimura, Ph.D. (Engineering) Representative, Touson Automotive Strategy Research Institute Automotive and Environmental Technology Strategy Analyst Visiting Professor, Aichi Institute of Technology [Former Toyota Motor Corporation] [Lecture Topics] <Chapter 1> Urgent Issue: CO2 Reduction Cannot Wait! <Chapter 2> Achieving a 48% Reduction in CO2 by 2030 Compared to 2019 is Impossible Without Carbon Neutrality in Fuels as Well as Electricity <Chapter 3> Technical Challenges in Electrification <Chapter 4> Pathways to Achieve a 48% Reduction in CO2 Emissions from Owned Vehicles by 2030 <Chapter 5> The Intentions Behind Electrification Strategies of Various Governments (Mainly in Europe, the U.S., and China) <Chapter 6> Electrification Strategies of Major Global Automakers and Sales Trends in Different Regions: Which Manufacturers Will Survive by 2030? <Chapter 7> Conclusion

[Speaker] Masayuki Sawada, Director of Sawada Masayuki Engineering Office [Lecture Topics] 1. The battle in Ukraine is the first large-scale drone war in history. 2. The battle in Iran also sees drones shifting the paradigm of strategy and tactics. 3. Efforts by major European countries (producing drones in Ukraine and collaborating with Ukrainian drone manufacturers). 4. Efforts by the United States (providing intercept drones and other support to Ukraine). 5. Efforts by Taiwan (producing drones in collaboration with U.S. manufacturers that have combat experience in Ukraine). 6. Efforts by Japan's Ministry of Defense (establishing a multi-layered coastal defense system using drones [SHIELD]). 7. Efforts by Japan's Terra Drone Corporation (collaborating with Ukrainian drone manufacturers). 8. Q&A / Business card exchange.