We exhibited at the New Technology Creation Exchange Meeting 2025.

VGA-capable compact ToF AI smart camera.

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a maximum resolution of 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

2 million pixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

8-megapixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of processing images with resolutions up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

A compact AI smart camera with dual lenses capable of measuring distance and acquiring RGB information.

A compact AI smart camera that integrates a high-quality image sensor and image processing. It uses a SONY ToF sensor and an onsemi GS sensor. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of processing images with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

AI smart camera (edge AI) equipped with EVS that detects changes in brightness.

This is a compact and lightweight AI smart camera that adopts Prophesee's EVS (Event-Based Vision Sensor). The EVS captures only changes and events within the scene, achieving extremely high temporal resolution (equivalent to 10K frames) and a wide dynamic range compared to traditional frame-based image sensors, while also reducing data bandwidth. It can be utilized for applications such as spatter/drip monitoring, high-speed motion capture, and intrusion detection under harsh lighting conditions. The core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing at resolutions up to 13M (including AWB, AE, etc.). *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• High Speed Camera

A lineup of 2M, 4K, ToF, ToF+RGB, and EVS sensors! Suitable for various applications such as drones, embedded robots, logistics, and security.

The "SCM Series" is a compact smart camera that integrates high-quality image sensors and image processing. By combining the image sensor and image processing, it enables real-time processing within the camera, making it an edge AI camera. At the core of the system is the AI processor "i.MX 8M Plus" from NXP Semiconductors, which features up to four 1.8GHz Arm Cortex A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with resolutions up to 13M (including AWB, AE, etc.). Due to these specifications and its compact size, it can be utilized in various applications such as drone payloads, embedded robotics, logistics, and security, where payload is a priority. 【Features】 ■ Models equipped with 2M, 4K, ToF, ToF+RGB, and EVS (Event Vision Sensor) are available. ■ Equipped with the AI processor "i.MX 8M Plus." *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Color camera

USB3.2 5Gbps 3 million pixels high-speed imaging model

This is a camera series that adopts a USB 5Gbps interface. - Image transmission, camera control, and power supply are possible with a single USB cable. - Thoroughly designed for low power consumption, achieving a small product size. - Offers both monochrome and color models in the lineup.

• Monochrome camera

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

In this webinar, we will explain "Why packed columns continue to be chosen today" from a practical perspective of gas analysis. We will also introduce the various types and characteristics of packing materials offered by Restek, along with application examples, and share insights on how to make optimal choices based on analytical objectives. Furthermore, we will discuss the differences in hardware passivation techniques and how to differentiate their use, as well as examples of custom packed column designs tailored to specific purposes. Topics covered in the webinar: ✅ Types of packing materials for packed columns and their characteristics ✅ Differences in separation selectivity based on analytical examples for each packing material ✅ Examples of custom packed column designs Benefits: For beginners: You will gain an understanding of separation selectivity based on differences in packing materials and the basics of column selection. For intermediate and advanced users: You will gain a concrete understanding of how to select packing materials and the usefulness of custom packed columns to improve separations that do not satisfy with existing columns. Participant benefits: We will provide a collection of packed column applications that are not publicly available.

Nitto Kohki will exhibit at the "30th Mechanical Components Technology Exhibition [Tokyo]" held at Makuhari Messe Hall 5 from July 9 (Wednesday) to July 11 (Friday). [Booth Number: Hall 5 31-32] At this exhibition, we will showcase a variety of products, including the electric suction hand "e-VEE" with a built-in pump that does not require compressed air, a cordless belt sander, the electric driver "Delvo" that can be mounted on robots, and the "Flow Monitor" that allows for easy visualization of the flow of cooling water in molds and other applications.

In "The Principles of Mixing and Defoaming and Key Points for Recipe Setting," we will explain the mechanism of the self-rotating and orbiting mixer, Awatori Nentaro, and the principles of mixing and defoaming in an easy-to-understand manner for beginners. ◇ Why do materials mix just by combining centrifugal force? ◇ What does it mean that mixing and defoaming can be processed simultaneously? ◇ How do the materials inside the container move during operation? This content is recommended for those who usually use Awatori Nentaro in their work but have never heard about its mechanism or principles and want to learn about it on this occasion. We will also explain temperature management based on material viscosity and considerations for operating conditions with examples. Additionally, in the "Legal Self-Inspection and Basic Maintenance Training," participants will have the opportunity to experience basic maintenance such as round belt replacement and legal self-inspection (regular self-inspection) using actual equipment. The capacity for each seminar is different, so please apply early! ◆ Date and Time: April 24, 2026 (Friday) 13:00 - 16:30 ◆ Venue: Hiroshima Convention Hall