Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?

From investigating the mechanisms of failures and malfunctions to proposing improvement measures and verifying their effectiveness, our expert engineers provide total support!

Eurofins FQL provides failure analysis for a variety of products, from circuit components such as semiconductors, printed circuit boards, and connectors to OEM and ODM products. If you have concerns such as "I want to conduct failure analysis but do not have sufficient equipment" or "I have doubts about the manufacturer's failure analysis report," please feel free to contact us. 【Leave it to us】 ■ Investigation Plan: Understanding failure phenomena and planning analysis methods to confirm usage conditions ■ Non-destructive Analysis: Narrowing down abnormal areas non-destructively ■ Destructive Analysis: Estimating causes through observation and analysis of the occurrence of abnormalities ■ Summary of Results: Summarizing analysis results and proposing improvements *For more details, please refer to the PDF materials or feel free to contact us.

• Capacitor
• Contract Analysis
• Other contract services

Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.

• inverter
• Contract Analysis
• UPS/Uninterruptible Power Supply

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

• Microcomputer
• Contract Analysis
• Other contract services

We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.

In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.

• Microcomputer
• Other semiconductors
• Contract Analysis

We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!

We provide high-quality circuit processing and wiring processing services using FIB, including cutting and changing connection points of fine wiring in the lower layers, processing fine wiring located beneath wide power wiring, and the urgent delivery of functioning LSI. - Both AL wiring and Cu wiring can be processed. - We accept orders starting from just one piece. - We will propose the optimal processing points during consultations. - We can accommodate special sample shapes. Please consult with us.

• Microcomputer
• Semiconductor inspection/test equipment
• Semiconductors and ICs

Reliability evaluation of power modules and power devices. We offer proposals from the construction of test environments tailored to your power cycle specifications to investigation and analysis!

When power semiconductors and power modules are repeatedly turned ON and OFF, the self-heating and cooling of the components and modules cause distortion due to the differences in expansion of the bonding materials, leading to a deterioration in bonding reliability. We offer power cycle testing that takes into account the heating operation due to repeated self-heating and cooling cycles. ■ Components, units, and devices where the adoption of power semiconductors and power modules is progressing: - Traction inverters for electric vehicles (EVs) and hybrid electric vehicles (HEVs) - On-board chargers and DC-DC converters - Motor control, robots, machine tools, elevators - Industrial inverters and uninterruptible power supplies (UPS) - Solar power generation systems and wind power generation systems

• inverter
• Engine parts
• UPS/Uninterruptible Power Supply

We offer a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests!

Our company offers "reliability evaluation/environmental testing" services. We own over 100 testing machines and chambers, including thermal shock testers and gas corrosion testers. We can accommodate a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests, as well as providing rental of testing chambers and conducting customized tests. Please feel free to contact us. 【Available Reliability Tests / Environmental Tests (partial list)】 ■ Thermal Shock Test (Gas Chamber / Liquid Chamber) ■ High Temperature and High Humidity Storage Test ■ Gas Corrosion Test ■ Accelerated Weather Resistance Test ■ Vibration Test ■ Salt Spray Test ■ Safety Tests (Crush Test, Heating Test, Charge/Discharge Test)

• Environmental Test Equipment
• Contract Inspection
• Other contract services

We would like to introduce 'Slim 4' handled by FCR & Bio Co., Ltd. This product is a jacket tube with a rack lid lock and anti-rotation function (compatible capacity 4.1ml). It is autoclavable and suitable for DMSO and vapor phase of liquid nitrogen. Additionally, it features a screw cap that does not use O-rings, packing, or gaskets. 【Features】 ■ Polypropylene ■ Autoclavable ■ DMSO compatible ■ Suitable for vapor phase of liquid nitrogen *For more details, please download the PDF or feel free to contact us.

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!