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  4. Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?
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  • Nov 05, 2025
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Nov 05, 2025

Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?

ユーロフィンFQL ユーロフィンFQL
The spread of 5G communication, the electrification of the automotive industry, the intensification of US-China trade friction represented by certain semiconductor manufacturers leading to supply stoppages, and the rapid increase in digital products due to the impact of the COVID-19 pandemic are various social phenomena that are increasing the demand for semiconductors. Along with these developments, the acceleration of semiconductor supply risks is progressing. In addition to the adoption of new products, evaluation of existing and distributed products is also necessary... However, the personnel involved in new adoption and product evaluation are limited. Do you have any of these concerns? - Lack of know-how to evaluate semiconductor components - Want to evaluate alternative products but lack personnel and equipment - Want to use stock items and market products but have concerns about reliability - Unable to determine whether the delivered semiconductor products are counterfeit or genuine At Eurofins FQL, we leverage our years of experience in component evaluation and failure analysis to provide not only semiconductor evaluations but also failure analysis services. Additionally, we offer evaluations of distributed products to assist in determining the authenticity of counterfeit, imitation, or long-term stored items. Please feel free to contact us.
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Failure analysis of electronic devices and components

From investigating the mechanisms of failures and malfunctions to proposing improvement measures and verifying their effectiveness, our expert engineers provide total support!

Eurofins FQL provides failure analysis for a variety of products, from circuit components such as semiconductors, printed circuit boards, and connectors to OEM and ODM products. If you have concerns such as "I want to conduct failure analysis but do not have sufficient equipment" or "I have doubts about the manufacturer's failure analysis report," please feel free to contact us. 【Leave it to us】 ■ Investigation Plan: Understanding failure phenomena and planning analysis methods to confirm usage conditions ■ Non-destructive Analysis: Narrowing down abnormal areas non-destructively ■ Destructive Analysis: Estimating causes through observation and analysis of the occurrence of abnormalities ■ Summary of Results: Summarizing analysis results and proposing improvements *For more details, please refer to the PDF materials or feel free to contact us.

  • Capacitor
  • Contract Analysis
  • Other contract services

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Destructive analysis | Power module package opening (decap)

Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.

  • inverter
  • Contract Analysis
  • UPS/Uninterruptible Power Supply

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Destructive analysis | Package opening (decapping)

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

  • Microcomputer
  • Contract Analysis
  • Other contract services

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Non-destructive analysis and non-destructive testing (lock-in thermography, ultrasonic testing)

We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.

In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.

  • Microcomputer
  • Other semiconductors
  • Contract Analysis

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LSI circuit correction

We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!

We provide high-quality circuit processing and wiring processing services using FIB, including cutting and changing connection points of fine wiring in the lower layers, processing fine wiring located beneath wide power wiring, and the urgent delivery of functioning LSI. - Both AL wiring and Cu wiring can be processed. - We accept orders starting from just one piece. - We will propose the optimal processing points during consultations. - We can accommodate special sample shapes. Please consult with us.

  • Microcomputer
  • Semiconductor inspection/test equipment
  • Semiconductors and ICs

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Power Cycle Test | Reliability Evaluation of Power Modules and Power Devices

Reliability evaluation of power modules and power devices. We offer proposals from the construction of test environments tailored to your power cycle specifications to investigation and analysis!

When power semiconductors and power modules are repeatedly turned ON and OFF, the self-heating and cooling of the components and modules cause distortion due to the differences in expansion of the bonding materials, leading to a deterioration in bonding reliability. We offer power cycle testing that takes into account the heating operation due to repeated self-heating and cooling cycles. ■ Components, units, and devices where the adoption of power semiconductors and power modules is progressing: - Traction inverters for electric vehicles (EVs) and hybrid electric vehicles (HEVs) - On-board chargers and DC-DC converters - Motor control, robots, machine tools, elevators - Industrial inverters and uninterruptible power supplies (UPS) - Solar power generation systems and wind power generation systems

  • inverter
  • Engine parts
  • UPS/Uninterruptible Power Supply

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Reliability evaluation test / environmental test

We offer a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests!

Our company offers "reliability evaluation/environmental testing" services. We own over 100 testing machines and chambers, including thermal shock testers and gas corrosion testers. We can accommodate a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests, as well as providing rental of testing chambers and conducting customized tests. Please feel free to contact us. 【Available Reliability Tests / Environmental Tests (partial list)】 ■ Thermal Shock Test (Gas Chamber / Liquid Chamber) ■ High Temperature and High Humidity Storage Test ■ Gas Corrosion Test ■ Accelerated Weather Resistance Test ■ Vibration Test ■ Salt Spray Test ■ Safety Tests (Crush Test, Heating Test, Charge/Discharge Test)

  • Environmental Test Equipment
  • Contract Inspection
  • Other contract services

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Power Cycle Testing Service

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Power module resin opening analysis service

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Observation of polished surface FIB processing

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Destructive analysis | Semiconductor package opening (decap)

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Ultrasonic flaw detection (C-SAM, SAT)

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[Failure Analysis Case] Introduction to Lock-In Heat Generation Analysis Method

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Technical Data | Reliability, Functionality, and Safety Evaluation Service Menu

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

  • NEW
  • PRODUCT

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Mar 23, 2026

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YONEX Co., Ltd. Badminton Motion Capture Experience Report

  • NEW
  • COMPANY

From July 15 (Tuesday) to July 20 (Sunday), 2025, the "42nd Daihatsu Japan Open 2025 Badminton Championships" was held at the Tokyo Metropolitan Gymnasium. We would like to report on the motion capture experience session conducted by Yonex Co., Ltd. at the venue. During the experience session, participants were asked to swing three different types of rackets from different generations, focusing on whether there were differences in their top speeds. The measurement was conducted using the same Raptor-12HS system utilized at the Yonex Performance Innovation Center (Blue Lab). This was a valuable opportunity to experience the research equipment that is not currently open to the public and to see what kind of measurements are being conducted! ---[Yonex Co., Ltd. Experience Session Report Here]--- https://info.nacinc.jp/report_yonex_badminton_motioncapture -------------------------------------------------------------------------

Mar 23, 2026

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Hyper CLT flooring panel (NETIS number: TH-250021-A)

Fully circular temporary materials contributing to CO2 reduction (NETIS number: TH-250021-A)

  • NEW
  • PRODUCT

Hello, this is the public relations department of KAITAKU Co., Ltd. in Okayama City, Okayama Prefecture! Recently, our wooden lightweight hyper CLT sheet has been officially registered with the Ministry of Land, Infrastructure, Transport and Tourism (NETIS number: TH-250021-A). The decisive difference between hyper CLT sheets and conventional temporary materials lies in the "exit" after their durability period ends. The hyper CLT sheet (NETIS number: TH-250021-A) is not discarded after its role on site is finished; instead, it is reused as chip fuel for biomass power generation. • Made: It is made from **wood (thinned timber)**, resulting in low environmental impact. • Used: It significantly contributes to reducing CO2 on site. • Converted to energy: Once its durability period is over, it becomes chip fuel for biomass power generation, ensuring that no resources are wasted. In this way, a **"complete circular" system** is established that connects materials to energy. Additionally, these initiatives can serve as a strong appeal for creativity related to construction performance. Please try the hyper CLT sheet (NETIS number: TH-250021-A)!

Mar 23, 2026

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Hotron Group Case Page

[Case Study] Hotron pursues sensor technology and creates products that generate safe and comfortable living spaces. We would like to introduce Hotron products that support people's lives throughout the city.

  • NEW
  • PRODUCT

We will introduce the implementation results of the sensor technology developed by the Hotron Group, which has been cultivated over more than half a century, through customer case studies. In addition to automatic door sensors, we also offer a wide range of vehicle detection sensors and nursing/care sensors. Many implementation examples are also presented, so please take a look at the case study page.

Mar 23, 2026

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■■ Air Leak Tester | FLA-0200 / FLA-0201 series ■■ Fukuda's new flagship model. Equipped with mastering correction function, it enables high-precision measurements in a short time.

  • NEW
  • PRODUCT

Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

Mar 23, 2026

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