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  3. ユーロフィンFQL
  4. Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?
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  • Nov 05, 2025
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Nov 05, 2025

Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?

ユーロフィンFQL ユーロフィンFQL
The spread of 5G communication, the electrification of the automotive industry, the intensification of US-China trade friction represented by certain semiconductor manufacturers leading to supply stoppages, and the rapid increase in digital products due to the impact of the COVID-19 pandemic are various social phenomena that are increasing the demand for semiconductors. Along with these developments, the acceleration of semiconductor supply risks is progressing. In addition to the adoption of new products, evaluation of existing and distributed products is also necessary... However, the personnel involved in new adoption and product evaluation are limited. Do you have any of these concerns? - Lack of know-how to evaluate semiconductor components - Want to evaluate alternative products but lack personnel and equipment - Want to use stock items and market products but have concerns about reliability - Unable to determine whether the delivered semiconductor products are counterfeit or genuine At Eurofins FQL, we leverage our years of experience in component evaluation and failure analysis to provide not only semiconductor evaluations but also failure analysis services. Additionally, we offer evaluations of distributed products to assist in determining the authenticity of counterfeit, imitation, or long-term stored items. Please feel free to contact us.
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Failure analysis of electronic devices and components

From investigating the mechanisms of failures and malfunctions to proposing improvement measures and verifying their effectiveness, our expert engineers provide total support!

Eurofins FQL provides failure analysis for a variety of products, from circuit components such as semiconductors, printed circuit boards, and connectors to OEM and ODM products. If you have concerns such as "I want to conduct failure analysis but do not have sufficient equipment" or "I have doubts about the manufacturer's failure analysis report," please feel free to contact us. 【Leave it to us】 ■ Investigation Plan: Understanding failure phenomena and planning analysis methods to confirm usage conditions ■ Non-destructive Analysis: Narrowing down abnormal areas non-destructively ■ Destructive Analysis: Estimating causes through observation and analysis of the occurrence of abnormalities ■ Summary of Results: Summarizing analysis results and proposing improvements *For more details, please refer to the PDF materials or feel free to contact us.

  • Capacitor
  • Contract Analysis
  • Other contract services

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Destructive analysis | Power module package opening (decap)

Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.

  • inverter
  • Contract Analysis
  • UPS/Uninterruptible Power Supply

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Destructive analysis | Package opening (decapping)

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

  • Microcomputer
  • Contract Analysis
  • Other contract services

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Non-destructive analysis and non-destructive testing (lock-in thermography, ultrasonic testing)

We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.

In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.

  • Microcomputer
  • Other semiconductors
  • Contract Analysis

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LSI circuit correction

We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!

We provide high-quality circuit processing and wiring processing services using FIB, including cutting and changing connection points of fine wiring in the lower layers, processing fine wiring located beneath wide power wiring, and the urgent delivery of functioning LSI. - Both AL wiring and Cu wiring can be processed. - We accept orders starting from just one piece. - We will propose the optimal processing points during consultations. - We can accommodate special sample shapes. Please consult with us.

  • Microcomputer
  • Semiconductor inspection/test equipment
  • Semiconductors and ICs

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Power Cycle Test | Reliability Evaluation of Power Modules and Power Devices

Reliability evaluation of power modules and power devices. We offer proposals from the construction of test environments tailored to your power cycle specifications to investigation and analysis!

When power semiconductors and power modules are repeatedly turned ON and OFF, the self-heating and cooling of the components and modules cause distortion due to the differences in expansion of the bonding materials, leading to a deterioration in bonding reliability. We offer power cycle testing that takes into account the heating operation due to repeated self-heating and cooling cycles. ■ Components, units, and devices where the adoption of power semiconductors and power modules is progressing: - Traction inverters for electric vehicles (EVs) and hybrid electric vehicles (HEVs) - On-board chargers and DC-DC converters - Motor control, robots, machine tools, elevators - Industrial inverters and uninterruptible power supplies (UPS) - Solar power generation systems and wind power generation systems

  • inverter
  • Engine parts
  • UPS/Uninterruptible Power Supply

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Reliability evaluation test / environmental test

We offer a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests!

Our company offers "reliability evaluation/environmental testing" services. We own over 100 testing machines and chambers, including thermal shock testers and gas corrosion testers. We can accommodate a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests, as well as providing rental of testing chambers and conducting customized tests. Please feel free to contact us. 【Available Reliability Tests / Environmental Tests (partial list)】 ■ Thermal Shock Test (Gas Chamber / Liquid Chamber) ■ High Temperature and High Humidity Storage Test ■ Gas Corrosion Test ■ Accelerated Weather Resistance Test ■ Vibration Test ■ Salt Spray Test ■ Safety Tests (Crush Test, Heating Test, Charge/Discharge Test)

  • Environmental Test Equipment
  • Contract Inspection
  • Other contract services

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Reliability Assessment and Environmental Testing Services

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Power Cycle Testing Service

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Power module resin opening analysis service

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LSI failure analysis service

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Observation of polished surface FIB processing

Observation of polished surface FIB processing

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Destructive analysis | Semiconductor package opening (decap)

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Ultrasonic flaw detection (C-SAM, SAT)

Ultrasonic flaw detection (C-SAM, SAT)

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[Failure Analysis Case] Introduction to Lock-In Heat Generation Analysis Method

[Failure Analysis Case] Introduction to Lock-In Heat Generation Analysis Method

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Technical Data | Reliability, Functionality, and Safety Evaluation Service Menu

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[Cast Iron Repair] We will repair cracks that have occurred in metal equipment without applying heat.

  • NEW
  • CATALOG

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

May 08, 2026

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[Cast Iron Crack Repair] We repair cracks in metal products without applying heat.

  • NEW
  • COMPANY

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

May 08, 2026

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Aluminum prototype: Lost wax casting sand mold layered 3D printer prototype.

  • NEW
  • COMPANY

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

May 08, 2026

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[To the design office] Are you struggling to explain "safety" to the client using only drawings?

  • NEW
  • CATALOG

Are you struggling to explain "safety" to the client using just drawings? - The risks in blind spots are difficult to convey to the client through drawings alone. - Safety measures often become a target for cost reduction, making it hard to communicate their necessity. - There is a concern that the client might say, "It's more dangerous than I thought," after completion. Risks that are visible to design professionals are not easily understood intuitively by clients who are outside the field. This document is not just a simple explanation of sensor functions; it is a guide to visually explain "why sensors are necessary in that location." It can be used directly as explanatory material for the client. Here are three key points for utilizing this document: 1. Visualization of Risks Blind spots during vehicle departure and contact risks within the site are illustrated clearly. 2. Clarification of Selection Criteria A comparison table outlines the differences between complex sensor types such as infrared, ultrasonic, and loop coils. 3. Diagram of System Configuration It illustrates not just the sensors alone, but how they combine with components like rotating lights and control panels, providing practical assistance for electrical equipment design. Please make use of this to prevent "rework after completion" and "accident risks."

May 08, 2026

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[Free Catalog Distribution] Measures against "Near Misses" in Nursing and Care Settings. Prevent tripping and disconnection with codes! Wireless Series Bed Exit Sensors Linked to Nurse Call Systems.

  • NEW
  • CATALOG

In facilities operating nurse call systems, we have made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call system. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. This helps prevent accidents caused by falls, slips, or wandering, contributing to the efficiency of medical operations. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call system. ○ Up to 5 transmitters can be registered with a single receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

May 08, 2026

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