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  6. Destructive analysis | Power module package opening (decap)

Destructive analysis | Power module package opening (decap)

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last updated:Jul 24, 2025

ユーロフィンFQL
ユーロフィンFQL
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Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.

    inverterContract AnalysisUPS/Uninterruptible Power Supply
500x500

Destructive analysis | Power module package opening (decap)

500x500 decap.png
500x500 decap.png
  • Special site - Product/service details - https://pr.mono.ipros.com/eurofinsFQL/product/

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Upon request, we can provide post-opening analysis, evaluation, and other responses such as: - Visual inspection - SEM observation - SEM-EDX analysis, etc.

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Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?

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The spread of 5G communication, the electrification of the automotive industry, the intensification of US-China trade friction represented by certain semiconductor manufacturers leading to supply stoppages, and the rapid increase in digital products due to the impact of the COVID-19 pandemic are various social phenomena that are increasing the demand for semiconductors. Along with these developments, the acceleration of semiconductor supply risks is progressing. In addition to the adoption of new products, evaluation of existing and distributed products is also necessary... However, the personnel involved in new adoption and product evaluation are limited. Do you have any of these concerns? - Lack of know-how to evaluate semiconductor components - Want to evaluate alternative products but lack personnel and equipment - Want to use stock items and market products but have concerns about reliability - Unable to determine whether the delivered semiconductor products are counterfeit or genuine At Eurofins FQL, we leverage our years of experience in component evaluation and failure analysis to provide not only semiconductor evaluations but also failure analysis services. Additionally, we offer evaluations of distributed products to assist in determining the authenticity of counterfeit, imitation, or long-term stored items. Please feel free to contact us.

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ユーロフィンFQL

ユーロフィンFQL

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Eurofins FQL Co., Ltd. has its origins in the analysis division of Fujitsu Laboratories Ltd. and the quality assurance department of Fujitsu Ltd. It has long engaged in activities aimed at improving product quality, not only in material analysis, reliability evaluation, safety assessment, and failure analysis, but also in supplier quality management and manufacturing plant audits. Additionally, it contributes to solving challenges faced by organizations responsible for quality through the development and educational support of personnel involved in quality, as well as the construction and improvement of quality management, product chemical substance management systems, and software development processes. ■ Reliability Evaluation and Environmental Testing Various reliability evaluations, safety verification of secondary batteries and power supplies, etc., including smoke and fire hazards. Evaluation of special environments such as weather resistance and gas corrosion. ■ Failure Analysis Failure analysis of electronic components and devices, confirmation of characteristics related to materials, and detailed analysis of defects. ■ Support for Building and Improving Quality-Related Systems and Processes To achieve QCD (Quality, Cost, Delivery) goals, we support the improvement of development processes using models such as CMMI and Automotive SPICE. ■ Quality-Related Education Customized educational programs tailored to specific challenges, such as "I want to revitalize the organization," "I want to cultivate a quality mindset," and "I want to provide quality education for new employees."

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