Notice of Participation in SEMICON JAPAN 2025

Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors
• Wafer
• Other measurement, recording and measuring instruments

Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments
• Optical Measuring Instruments

Thickness measurement is possible from thick wafers to ultra-thin wafers (less than 1μm).

Non-contact measurements with high precision are achieved without damaging the measured object. Thickness measurements can be performed with extremely high resolution on all types of surfaces and materials, including highly reflective surfaces. The NCG-R system, equipped with a dedicated optical sensor, is designed with high protection performance (such as an enclosure compliant with IP standards), making it suitable for a wide range of applications from post-manufacturing inspections to in-process inspections. Thickness measurements of thin films, coatings, and nano-layers are the standout features of the NCG-R system, demonstrating exceptional performance. The NCG-R controller (visible light type) is compatible with all types of sensor heads, achieving optimized performance tailored to the measurement range and operating environment (such as working distance and spot size).

• Coating thickness gauge

Using interferometric (interferometer) technology, it is possible to measure the thickness of transparent and opaque films.

This is a series of controllers designed to measure thickness and distance in conjunction with optical sensor heads. Utilizing interferometric (interferometer) technology and a dedicated data processing software package, it provides a solution for accurate measurements even in situations where contact with the target area is not possible. With high precision and stability at the sub-micron level, it guarantees reliable measurements with excellent repeatability and accuracy. Additionally, it supports inline process control with real-time monitoring, contributing to improved production efficiency.

• Coating thickness gauge

It is possible to produce high-quality work without damaging delicate work and without destructive testing. It is a fully synchronized system that is resilient to variations in work and environment.

Sensors and controllers using chromatic confocal measurement technology. We offer various options tailored to your work and environment. They are utilized in industries such as automotive, semiconductor, and glass worldwide. <Advantages> - Non-contact technology suitable for measuring soft or opaque materials (e.g., aluminum rolls, copper rolls, lithium-ion battery separators) - Capable of measuring layer thickness from 5µm - Wide measurement range suitable for inline use - High sensitivity and high precision (the reproducibility range of total thickness in actual applications is within 1µm) - Provision of measurement forks or a complete set of gauging equipment - Quick-SPC software option enables statistical processing and data transfer If you have the following challenges, please download the PDF and consult with us. - Variations in work or environment - Synchronization using multiple sensors - Mechanical alignment (tilt or misalignment) - Detailed understanding of measurements - Special applications requiring customization *For more details, please refer to the PDF document or feel free to contact us.

• Sensors

Yamawa Manufacturing Co., Ltd. will exhibit at "JIMTOF 2026, the 33rd Japan International Machine Tool Fair," which will be held at Tokyo Big Sight from October 26 (Monday) to October 31 (Saturday), 2026. We will be showcasing two new products from our highly acclaimed ultimate professional tool "Z-PRO," optimized for machining! Don’t miss this opportunity to visit our booth. 【Highlights】 We will display two new products from the "Z-PRO" brand. We have prepared many short videos to solve tapping troubles! We will thoroughly explain examples of failures and successes in tapping. Live demonstrations using the precision tapping machine 'TTTsystem' will be available.

[Speaker] Masanori Hayashi Evangelist, NTT Docomo Business, Inc. Visiting Researcher, GLOCOM, International University [Key Lecture Content] The application areas of AI are expanding from generative AI to AI agents and physical AI, while the main battlefield of AI infrastructure is shifting from learning-centric to inference-centric. Against the backdrop of rapidly growing AI demand, investments and entries into AI data centers by various businesses are accelerating. However, new challenges are emerging, such as increasing power and cooling demands, responses to data sovereignty, and the utilization of GX strategy regional systems for data center aggregation. This lecture will overview the latest trends in the AI data center market and investment trends, as well as organize technological innovations such as GPUs, liquid cooling, and all-optical networks, along with policy and institutional trends and industrial challenges. Furthermore, it will envision the future of a decentralized AI infrastructure that connects AI factories, data centers, and the edge, and discuss new industrial foundations and future competitive axes through watt-bit collaboration.

[Speaker] Ren Taro Hayashi, Senior Manager, Environmental, Energy, and Resource Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Lecture Items] 1. Overview of Data Centers 2. Impact of Data Centers on the Power Industry 3. Policy Trends in Data Centers and Power (1) GX2040 Vision (2) Watt-Bit Collaborative Public-Private Discussion (3) GX Industry Location Working Group (4) Japan Growth Strategy 4. Future Approaches to Power Procurement for Data Center Development 5. Q&A / Business Card Exchange

This year, we will be holding the large exhibition "Wood and Living Expo" organized by Nice! Approximately 150 domestic housing and building material manufacturers will gather to showcase the latest equipment and noteworthy new products. Additionally, many specialized seminars will be held to learn about the latest industry trends and future outlooks! It will be a two-day event filled with business tips and seeds for new proposals. We sincerely look forward to your visit. ■ Dates: October 15, 2026 (Thursday) 10:00-17:00 October 16, 2026 (Friday) 10:00-16:00 ■ Venue: Pacifico Yokohama, Hall C&D ■ Organized by: Nice Co., Ltd., Wood and Housing Research Association, and the Trustworthy Renovation Promotion Association ■ Official website: https://woodlivingfair.jp/ ■ Pre-registration: https://www.tenjikai-uketsuke.com/form/wood-living-expo-2026/ *Pre-registration is required for attendance. When registering, please select "R&D Center" as the Nice department.

In November 2025, the revised "Good Manufacturing Practice (GMP) for Medical Devices" in China will be announced, with implementation scheduled for November 2026. Local experts will provide a clear explanation of the key points for compliance. < Seminar Topics > - Overview of China's new GMP - Differences from ISO 13485:2016 - New requirements that require particularly careful measures - Anticipated inspection styles