Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'

A detailed explanation of specific approaches to surface treatment that are key to maximizing the quality of semiconductor resin encapsulation!

Semiconductor devices, which function as the brains of various electronic devices ranging from smartphones, automobiles, to home appliances that are essential in our daily lives, are supported by their high reliability. One of the key technologies that ensure this reliability is "resin encapsulation." The process of covering and solidifying semiconductor chips with resin is indispensable for protecting them from external environments and maintaining stable performance over long periods. However, as products require higher reliability, there are increasing cases where simply solidifying with resin is not sufficient. To fully realize the true performance of resin encapsulation, it is extremely important how well the surfaces of the semiconductor chips and substrates to be encapsulated are prepared, which is referred to as "surface design." *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

• Other semiconductors
• Other semiconductor manufacturing equipment
• Semiconductors and ICs

Introducing the mechanism of "silent degradation" that leads to the destruction of electronic devices without being noticed!

This document systematically organizes the mechanisms behind the deterioration of insulation properties and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. It examines the technical background of why the fundamental aspects of "ensuring insulation" and "resin bonding strength," which should have already been technically resolved, have become issues once again. If you wish to learn about the concepts of surface design to prevent silent kill, please take a moment to read this. 【Contents (partial)】 ■ Introduction ■ A New Frontier in Insulation ■ Technical Challenges Due to High-Functionality Materials ■ Objectives and Effects of Resin Sealing *For more details, please download the PDF or feel free to contact us.

• Other semiconductors
• Other semiconductor manufacturing equipment
• Semiconductors and ICs

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)