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  6. Why did 'silent degeneration' occur? - The correlation between insulation properties and resin bonding strength -

Why did 'silent degeneration' occur? - The correlation between insulation properties and resin bonding strength -

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last updated:Dec 10, 2025

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Introducing the mechanism of "silent degradation" that leads to the destruction of electronic devices without being noticed!

This document systematically organizes the mechanisms behind the deterioration of insulation properties and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. It examines the technical background of why the fundamental aspects of "ensuring insulation" and "resin bonding strength," which should have already been technically resolved, have become issues once again. If you wish to learn about the concepts of surface design to prevent silent kill, please take a moment to read this. 【Contents (partial)】 ■ Introduction ■ A New Frontier in Insulation ■ Technical Challenges Due to High-Functionality Materials ■ Objectives and Effects of Resin Sealing *For more details, please download the PDF or feel free to contact us.

    Other semiconductorsOther semiconductor manufacturing equipmentSemiconductors and ICs
「静かなる退化」はなぜ生じたのか.png

Why did 'silent degeneration' occur? - The correlation between insulation properties and resin bonding strength -

「静かなる退化」はなぜ生じたのか.png
「静かなる退化」はなぜ生じたのか.png
  • Related Link - https://www.zestron.com/jp/download/technical-arti…
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【Other Published Content】 ■Challenges of Resin Bonding Technology ■Ensuring Insulation and Cleaning to Improve Surface Condition - Our Cleaning Agent Technology - ■The Future of Cleaning - The Era of "Optimization" and "Surface Design Process" in Electronic Device Cleaning - *For more details, please download the PDF or feel free to contact us.

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Why did 'silent degeneration' occur? - The correlation between insulation properties and resin bonding strength -

Why did 'silent degeneration' occur? - The correlation between insulation properties and resin bonding strength -

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Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'

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"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.

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Zestron is a global standard "flux cleaning agent manufacturer" based in Germany, with eight locations worldwide. Our cleaning agents are primarily environmentally friendly water-based cleaners that achieve a balance between cleaning performance and safety, while also enabling the reduction of organic solvents, VOCs, and overall usage to lower costs. At our technical center in Kanagawa, customers can choose from inline and batch-type spray cleaning equipment, as well as jet and ultrasonic devices, tailored to their needs, allowing them to test work cleaning under conditions equivalent to those in production environments. In parallel with the cleaning tests, we analyze cleanliness at our analysis center. Utilizing digital microscopes, FT-IR, ion chromatography, and SEM-EDX/EDS, we can detect flux residues that are often overlooked by visual inspection. After the tests are completed, our engineers will provide a technical report detailing recommended processes. *We generally offer support for cleaning process issues free of charge. If you have any requests or challenges related to flux cleaning, please feel free to contact us.

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