Added heat-dissipating silicone adhesive "TIA0330" to AD-Chemi.
Momentive's "TIA0330" is a non-corrosive, fast-drying, heat-dissipating one-component room temperature curing silicone adhesive with reduced low molecular siloxanes. It reacts with moisture (water) in the air to cure into a rubber-like elastomer that excels in heat resistance, cold resistance, electrical insulation, weather resistance, and water resistance. It requires no mixing or heating, significantly simplifying the process from application to curing. Its semi-fluidity makes it suitable for automatic dispensing and it has excellent conformability to complex shapes. It is ideal for a wide range of electronic devices where heat dissipation is critical, such as automotive ECUs, inverters, communication base stations, and servers/PCs. At Adachi New Industries, we provide consistent technical support from material selection based on application to optimization of application conditions and prototype follow-up. If you have concerns regarding heat dissipation design or adhesive challenges, please feel free to consult us.
*About the corrosion mechanism of general silicones
Corrosion of copper-based metals by silicone occurs when moisture-curing silicones react with water vapor in the air, releasing by-products such as acetic acid and alcohol. When these components come into contact with the copper surface, they undergo a chemical reaction, forming copper oxide and corrosive compounds. Corrosion accelerates, especially in energized environments or high humidity, leading to poor conductivity and contact degradation.

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