We will exhibit at the Jointing Expo in Osaka.
FUJI is a leading company in atmospheric pressure plasma devices.
In recent years, the introduction of atmospheric pressure plasma as a pre-treatment device to improve adhesive strength and quality has been advancing in manufacturing sites.
FUJI's plasma device, Tough Plasma, has world-class processing capabilities and allows for high-speed continuous processing. At this exhibition, we will showcase the latest model of the Tough Plasma series, "ATOM," which operates solely on air and electricity. Please come and see its world-class capabilities, quality, and safety monitoring features.
During the event, our engineers will be stationed at the booth. They will be happy to answer any questions you may have, from basic knowledge of plasma to the types of materials that can be processed and processing speed estimates, so please feel free to visit us.
You can complete your pre-registration through the link below [Details & Application].

| Date and time | Wednesday, May 13, 2026 ~ Friday, May 15, 2026 10:00 AM ~ 05:00 PM |
|---|---|
| Capital | Intex Osaka, Hall 4, K9-35B |
| Entry fee | Free Entry requires prior registration. |
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Details & Registration




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