4/8 Webinar "AI Data Center Heat Dissipation/Cooling Technology"
■Title: Heat Dissipation/Cooling Technology for AI Data Centers
■Date and Time: April 8, 2026 (Wednesday) 10:30 AM - 4:30 PM
■Target Audience for the Seminar
Electronic equipment designers (assembly design, mechanical design, circuit design, board design), heat dissipation device/material developers, quality assurance, and quality control departments
■Knowledge Gained from the Seminar
- Basic knowledge of heat transfer
- Knowledge of heat dissipation in component and board design
- Common methods for thermal design of forced air cooling and natural air cooling equipment
- Thermal design methods for heat sinks, etc.

| Date and time | Wednesday, Apr 08, 2026 10:30 AM ~ 04:30 PM |
|---|---|
| Entry fee | Charge 55,000 yen |
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