April 21 Venue Seminar: C3 Thinking Method and AI Utilization

Focusing on high-speed optical communication technologies and materials for AI data center applications, analyzing industry and market trends!

**Features of this Book** - Comparison of transmission distances between boards, within and between data centers, and long distances! - Investigation of Co-Packaged Optics (CPO) due to the growing demand for high-speed transmission driven by AI proliferation! - Research on the technological trends of E polymers used in optical modulators and optical switches! - Trends and background of optical module light sources using VCSEL chips for data centers! - Characteristics of glass substrates that are compatible with optical transmission and the development of glass interposers? - Investigation of development trends for silicon photonics-based receivers and electro-optic modulators! - Unique polymer waveguide manufacturing methods developed by companies and the required waveguide materials! - Key points, types, and trends of adhesives used for optics/optical fibers? - Methods and challenges of connecting optical fibers and the integration of silicon photonics with optical fibers! **Table of Contents** Part 1: Optical Fibers Part 2: Optical Fiber Components Part 3: Optoelectronic Integration Part 4: Adhesives and Bonding *For a detailed table of contents, please refer to the related link URL.*

• Technical and Reference Books
• others

Focusing on cooling technologies and materials for AI data centers with increasing demand, analyzing industry and market trends!

**Features of this Book** - Industry analysis of DLC, liquid immersion cooling, and hybrid cooling methods! Market forecast up to 2030! - Research on the characteristics of single-phase and two-phase immersion cooling systems, the companies adopting them, their backgrounds, and the industry! - What are the reasons for the increasing adoption of mineral oil as a cooling fluid? An analysis of the strategies of entering companies! - What are the strategies of various companies regarding the non-use of fluorine and low content after 3M's announcement of withdrawal from PFAS manufacturing? - Research on bio-based coolants, silicone oils, their characteristics, and the companies and industries involved! - Industry analysis of cooling equipment such as chillers, cooling towers, heat exchangers, and CDU, along with the features of each company's products! - Advantages and disadvantages of container-type data centers, and the background supporting their use in AI development! **Structure of this Book** Part 1: Cooling Systems Part 2: Liquid Cooling Part 3: Equipment and Devices Part 4: Analysis of Trends in Countries, Companies, and Products *For a detailed table of contents, please refer to the related link URL.*

• server
• Server Cooler
• others

Covers everything from the basics of first-principles calculations to materials informatics, as well as simulations other than first-principles calculations and their application examples.

This book covers everything from the basics of first-principles calculations to materials informatics, simulations beyond first-principles calculations, and their application examples. Additionally, we have received cooperation from experts who are conducting cutting-edge research and applied research in materials informatics. We believe that readers will gain an understanding of both the fundamentals of first-principles calculations and the forefront of materials informatics. We encourage those interested in materials informatics, companies considering its application, and students who wish to learn about materials informatics to read this book. 【Features of this book】 ➢ From the basics of first-principles calculations to the forefront of materials informatics ➢ Written by experts engaged in cutting-edge research and applied research ➢ Rich examples of AI, MI, and computational science relevant to battery research ➢ Includes a foundational section (first-principles calculations and machine learning) for beginners

• Secondary Cells/Batteries

A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

- The data center cooling market in 2030 is expected to expand to ● billion yen, a ●% increase compared to 2023! Investigating the background! - Researching the technology trends of silicon photonics and the background for the adoption of PIC! - Exploring market forecasts for Si, SiC, GaN, and Ga2O3 semiconductors, their backgrounds, and developments in various applications! - Why are NVIDIA and AMD adopting CoWoS technology? What are the challenges? What is TSMC's strategy? - Advantages and disadvantages of interposers, industry trends, and movements of TSMC, Intel, and Samsung! - The intensifying global HBM market share competition and the business opportunities for Japanese companies that accompany it! - Investigating the required performance and technology trends for underfill, market forecasts, and company-specific shares! - The market for FC-BGA substrates for AI servers/data centers, company-specific shares, and corporate strategies! 【Table of Contents】 Part I: AI Data Centers Part II: Cooling and Thermal Management Part III: Optical Communication Related Part IV: Next-Generation Semiconductors Part V: Packaging Technology Part VI: High-Multilayer Substrates and Low-Dielectric Resins *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Database
• EAI/ETL/WEB application server

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the 28th INTERPHEX Week Tokyo. At the exhibition, we will be showcasing 100% inspection equipment compliant with Container Closure Integrity Testing (CCIT) standards, as well as sampling inspection machines. We sincerely invite you to visit our booth at this opportunity and would greatly appreciate your attendance despite your busy schedule. Yours sincerely, [Dates] May 20 (Wed) - 22 (Fri), 2026 10:00-17:00 (JST) [Venue] Makuhari Messe, Japan 8 Hall Booth No. 41 - 36

Creating 3D Plots Using Igor Pro ~3D Scatter Plots and Surface Plots~ This document introduces how to create a 3D scatter plot from a point cloud data given in XYZ coordinates using Igor Pro, as well as how to create a surface plot using the same data. 1. Overview of 3D Plots 2. Operation Demo: Creating a Scatter Plot 3. Operation Demo: Creating a Surface Plot

To address questions such as "I have never talked to a small and medium-sized enterprise consultant," "I don't know what they can do for me," and "I would like to have a simple consultation about management issues first," we have started offering a "Simple Management Diagnosis Service" that can be used for free for the first time. It is scheduled to be conducted via "WEB conference" for about one hour. Please feel free to use this service (we also accept on-site consultations, subject to travel expenses).

In addition to the lecture by Mr. Eddy Dascotee from DDS, it has been decided that Professor Okubo, an emeritus professor at Chuo University, will also speak. Professor Okubo is globally recognized in the field of precision mechanical engineering, particularly in "vibration and mode analysis," and has made significant contributions to the noise reduction and high performance of automobiles and machinery. He received the "Order of the Rising Sun, Gold and Silver Rays" last year. He will talk for about 20 minutes about his activities and introduce the seminar. This is a rare opportunity to hear the "real insights" from Mr. Dascotee, who is at the forefront of the industry, and Professor Okubo, who has been active in the field for many years. We encourage everyone to come to the venue on May 21 (Thursday). (Application deadline has been changed to May 21, the day of the event.) "Does your CAE align with reality?" How can experimental data (MEscope) be accurately fed back into the analysis model (FEMtools) to connect the cycle of design, experimentation, and analysis? The latest world-standard methods will be elucidated by the developers themselves.

Sekisui Filler Co., Ltd. will exhibit at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Automotive Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coatings - Optical adhesives We sincerely look forward to your visit.