April 21 Venue Seminar: C3 Thinking Method and AI Utilization

Focusing on high-speed optical communication technologies and materials for AI data center applications, analyzing industry and market trends!

**Features of this Book** - Comparison of transmission distances between boards, within and between data centers, and long distances! - Investigation of Co-Packaged Optics (CPO) due to the growing demand for high-speed transmission driven by AI proliferation! - Research on the technological trends of E polymers used in optical modulators and optical switches! - Trends and background of optical module light sources using VCSEL chips for data centers! - Characteristics of glass substrates that are compatible with optical transmission and the development of glass interposers? - Investigation of development trends for silicon photonics-based receivers and electro-optic modulators! - Unique polymer waveguide manufacturing methods developed by companies and the required waveguide materials! - Key points, types, and trends of adhesives used for optics/optical fibers? - Methods and challenges of connecting optical fibers and the integration of silicon photonics with optical fibers! **Table of Contents** Part 1: Optical Fibers Part 2: Optical Fiber Components Part 3: Optoelectronic Integration Part 4: Adhesives and Bonding *For a detailed table of contents, please refer to the related link URL.*

• Technical and Reference Books
• others

Focusing on cooling technologies and materials for AI data centers with increasing demand, analyzing industry and market trends!

**Features of this Book** - Industry analysis of DLC, liquid immersion cooling, and hybrid cooling methods! Market forecast up to 2030! - Research on the characteristics of single-phase and two-phase immersion cooling systems, the companies adopting them, their backgrounds, and the industry! - What are the reasons for the increasing adoption of mineral oil as a cooling fluid? An analysis of the strategies of entering companies! - What are the strategies of various companies regarding the non-use of fluorine and low content after 3M's announcement of withdrawal from PFAS manufacturing? - Research on bio-based coolants, silicone oils, their characteristics, and the companies and industries involved! - Industry analysis of cooling equipment such as chillers, cooling towers, heat exchangers, and CDU, along with the features of each company's products! - Advantages and disadvantages of container-type data centers, and the background supporting their use in AI development! **Structure of this Book** Part 1: Cooling Systems Part 2: Liquid Cooling Part 3: Equipment and Devices Part 4: Analysis of Trends in Countries, Companies, and Products *For a detailed table of contents, please refer to the related link URL.*

• server
• Server Cooler
• others

Covers everything from the basics of first-principles calculations to materials informatics, as well as simulations other than first-principles calculations and their application examples.

This book covers everything from the basics of first-principles calculations to materials informatics, simulations beyond first-principles calculations, and their application examples. Additionally, we have received cooperation from experts who are conducting cutting-edge research and applied research in materials informatics. We believe that readers will gain an understanding of both the fundamentals of first-principles calculations and the forefront of materials informatics. We encourage those interested in materials informatics, companies considering its application, and students who wish to learn about materials informatics to read this book. 【Features of this book】 ➢ From the basics of first-principles calculations to the forefront of materials informatics ➢ Written by experts engaged in cutting-edge research and applied research ➢ Rich examples of AI, MI, and computational science relevant to battery research ➢ Includes a foundational section (first-principles calculations and machine learning) for beginners

• Secondary Cells/Batteries

A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

- The data center cooling market in 2030 is expected to expand to ● billion yen, a ●% increase compared to 2023! Investigating the background! - Researching the technology trends of silicon photonics and the background for the adoption of PIC! - Exploring market forecasts for Si, SiC, GaN, and Ga2O3 semiconductors, their backgrounds, and developments in various applications! - Why are NVIDIA and AMD adopting CoWoS technology? What are the challenges? What is TSMC's strategy? - Advantages and disadvantages of interposers, industry trends, and movements of TSMC, Intel, and Samsung! - The intensifying global HBM market share competition and the business opportunities for Japanese companies that accompany it! - Investigating the required performance and technology trends for underfill, market forecasts, and company-specific shares! - The market for FC-BGA substrates for AI servers/data centers, company-specific shares, and corporate strategies! 【Table of Contents】 Part I: AI Data Centers Part II: Cooling and Thermal Management Part III: Optical Communication Related Part IV: Next-Generation Semiconductors Part V: Packaging Technology Part VI: High-Multilayer Substrates and Low-Dielectric Resins *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Database
• EAI/ETL/WEB application server

We will hold an online seminar as follows. The corporate perspective on the introduction of monitoring systems is changing year by year. We will explain the monitoring systems for machine tools that are currently needed, using various case studies to discuss the changes in the industry environment, what challenges customers perceive, their expectations for monitoring systems, and the effects of their implementation. This seminar will provide insights into specific approaches for your company's introduction of monitoring systems. Date and Time: February 12, 2025 (Thursday) 14:00 - 15:00 Instructor: Monitoring System Representative, ARTIS (MARPOSS Corporation Sales Development Department) Target Audience: - Customers considering the introduction of monitoring systems who want to know the specific process leading to implementation. - Customers interested in what challenges other companies have identified that led to the introduction of monitoring systems. - Customers researching the latest trends in monitoring systems for machine tools. We sincerely look forward to your participation.

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)

■Title: "Fluorine-Free Water and Oil Repellent Treatment Technology Achievable - Guidelines and Examples for Surface Design to Improve Wetting Fundamentals and Liquid Sliding Properties" As PFAS regulations accelerate, surface designs that achieve water and oil repellency without fluorine are gaining attention. This seminar will systematically explain the fundamentals of wetting, dynamic wettability evaluation, design guidelines for improving sliding properties, and the latest examples of fluorine-free surface treatments by leading researchers. ■Date and Time: April 14, 2026 (Tuesday) 13:30 - 16:30 ■Target Audience for the Seminar - Individuals engaged in surface treatment and modification operations - Those involved in research and development related to imparting water and oil repellency, stain resistance, and anti-adhesion properties to various substrate surfaces - Individuals engaged in research and development of fluorine (PFAS) alternative technologies and fluorine-free surface treatment and modification technologies ■Knowledge Gained from the Seminar - Fundamental knowledge/theory regarding wettability - Correct knowledge of wettability evaluation techniques (static/dynamic contact angle, contact angle hysteresis, sliding/falling angle) - Know-how for creating surfaces/interfaces with excellent water and oil repellency, stain resistance, and anti-adhesion properties without fluorine

The "Jumbo Surprise Exhibition," which solves the challenges faced by the manufacturing industry all at once, will be held again this year. In the FA zone, the latest FA equipment, control and drive devices, and energy-saving and labor-saving proposals will be displayed all in one place. You can experience concrete solutions that are immediately useful on-site, such as automation, productivity improvement, equipment renewal, and maintenance efficiency. Representatives from each manufacturer will be available to provide direct explanations, making it a great opportunity to learn about the latest trends and case studies. If you are looking for hints to solve your challenges or considering new equipment investments, please come and visit us. We will provide encounters that will lead your business to the next stage.

■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar 　Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar 　・Basic properties required for FPC substrates 　・Reasons for using LCP and polyimide films in FPCs 　・Key technologies for LCP multilayering 　・Points to consider when processing LCP films 　・Examples of hybridization methods between LCP and low-dielectric materials