[Event Announcement] Information on Exhibiting at the "Industrial Open Network Exhibition 2026"

CC-Link IE TSN low-profile PCI Express add-in card, also installable in standard height.

AdEXP1589 is an intelligent CC-Link IE TSN manager/local board of the low profile PCI Express add-in card type. CC-Link IE TSN adopts TSN (Time-Sensitive Networking) technology in CC-Link IE to achieve more accurate time synchronization and high-speed, high-precision control, while also enabling excellent real-time communication even in networks with multiple mixed protocols. It is installed in a PCI Express slot and functions as a CC-Link IE TSN manager/local station. The CPU on this board provides offloading capabilities for CC-Link IE TSN, minimizing the increased load on the host CPU due to the implementation of CC-Link IE TSN communication. By changing the bracket, it can be installed in both low profile and standard height slots. *Note: AdEXP1589 is a product under development.

• Embedded Board Computers

ExpEther HBA PCI Express add-in card

■ 1G ExpEther Host Bus Adapter ■ ExpEther Bridge (Master) ■ 1000BASE-T ■ 2-Port Redundant Configuration ■ Maximum Cable Length of 100m ■ PCI Express Add-in Card ■ Can be implemented in slim PCs due to low profile ■ Operating Temperature Range: -40 to 85°C (Extended Temperature Product) ■ OS Independent

• Embedded Board Computers

ExpEther Slave CompactPCI Board

■1G ExpEther Slave Adapter ■ExpEther Bridge (Slave) ■1000BASE-T ■2-Port Redundant Configuration ■Maximum Cable Length of 100m ■3U CompactPCI Board ■Operating Temperature Range: -40 to 85°C (Extended Temperature Product) ■OS Independent

• Other network tools

Intelligent PCI Express EtherCAT Master Board

AdEXP1572 is a PCI Express board with EtherCAT master communication capabilities. It uses the ARM Cortex-A9 processor embedded in the Xilinx Zynq and functions as an intelligent PCI Express bus slave board. The EtherCAT master protocol stack is equipped with "EC Master" from acontis technologies and is Class A compliant. It also supports cable redundancy and hot connect as a feature pack. This board is controlled by the PCI Express bus master (host CPU). Data transfer is conducted via shared memory installed on this board. As it functions as an intelligent slave, it enables EtherCAT master communication without burdening the host CPU. For more details, please contact us or download the catalog.

• Embedded Board Computers

Equipped with TI's ARM Cortex-A8, EtherCAT slave board.

■TI Corporation's Sitara AM3357 processor equipped (ARM Cortex-A8 single core) ■EtherCAT slave ■Equipped with expansion ports such as SPI, I2C, UART, GPIO, etc. ■High connectivity with 2.54mm pitch connectors and optional HIROSE FX20 connectors ■Supports wide input power supply DC5V±5% or DC15–40V (optional) ■Compact size 70mm x 75mm

• Other electronic parts

Eplan, the comprehensive electrical design CAD used by customers worldwide. We will hold a real event called "EPLAN Operation Experience Session," where you can actually experience operating EPLAN. In the morning session, we will explain the overview of EPLAN, and in the afternoon session, you will have the opportunity to operate the actual equipment and gain hands-on experience. You can participate in just one of the seminars, or you can join both and experience EPLAN in one day. You can experience the operation and features of EPLAN P8 and Pro Panel at three locations: the EPLAN Shin-Yokohama office, the Osaka office, and the Osaka office. Participation is free! Please come and check out the feel of operating Eplan.

[Speaker] Hidetoshi Amano, Senior Manager, New Business Strategy Team, Fortience Consulting Co., Ltd. [Key Lecture Content] "Data Monetization," which transforms accumulated data within companies into revenue and profit. In recent years, the evolution of generative AI has significantly changed the methods of achieving this. While the potential for extracting meaning from non-structured data such as documents, images, and drawings, which were previously difficult to utilize, is expanding while reducing the burden of data organization, AI is now taking on roles in analysis, proposal, and even action. In this lecture, we will organize the basic patterns and success principles of data monetization, discuss what changes generative AI brings, and explain how companies should build a system to "earn with data," incorporating the latest case studies and practical knowledge.

[Speaker] Yusuke Hironaka, Second Department, Mobility and Energy Device Division, Fuji Keizai Co., Ltd. [Key Lecture Content] As the market for lithium-ion batteries (LiB) continues to expand, developments are being made to improve LiB performance, including enhancements in safety, energy density, and operating temperature range. Among these, all-solid-state batteries, which replace the liquid electrolyte of LiB with solid electrolytes, are expected to achieve performance improvements while reducing the risk of fire associated with LiB, leading to future practical applications and market expansion. However, there are many challenges to the practical application and market expansion of all-solid-state batteries, and one of the technologies being developed to address these challenges in the short term is semi-solid batteries. In this lecture, against the backdrop of the aforementioned market trends, I will explain the current status of semi-solid batteries, their performance and application suitability compared to liquid-state LiB and all-solid-state batteries, as well as future prospects.

[Speaker] Hideo Tagami, Director of Telecom Sales, NVIDIA Corporation, Strategic Account Division [Key Lecture Content] The rapid development of generative AI has made it urgent to establish AI data centers for Agentic AI and Physical AI, as well as high-speed, wide-bandwidth communication networks. Attention is increasing towards the distributed AI infrastructure concept "AI GRID." In this lecture, we will explain the approach for telecom operators to realize AI GRID by utilizing base stations and communication facilities along with next-generation networks, transforming into sovereign AI platform providers. We will also consider the challenges and solutions related to AI implementation and data governance faced by user companies utilizing these technologies. [Lecture Items] 1. Background of the emergence of AI GRID 2. Approach to AI GRID by telecom operators 3. NVIDIA's full-stack solution supporting AI GRID 4. Benefits of AI GRID for user companies 5. Approaches from both providers and users 6. Q&A / Business card exchange

In the automotive industry, the importance of quality and process improvement in system and software development is increasingly recognized, and it is becoming standard practice to ensure that even partial controller controls comply with Automotive SPICE as software. In this webinar, we will explain the basics of Automotive SPICE for those who are considering or interested in compliance with Automotive SPICE in the future. [Program] - The background of why Automotive SPICE has become necessary - The main elements of the structure of Automotive SPICE: process dimension and capability dimension - How to read the Automotive SPICE model - Preparations to be made when undergoing an Automotive SPICE assessment We will provide explanations in as simple terms as possible. We look forward to your participation!