[Event Announcement] Information on Exhibiting at the "Industrial Open Network Exhibition 2026"

CC-Link IE TSN low-profile PCI Express add-in card, also installable in standard height.

AdEXP1589 is an intelligent CC-Link IE TSN manager/local board of the low profile PCI Express add-in card type. CC-Link IE TSN adopts TSN (Time-Sensitive Networking) technology in CC-Link IE to achieve more accurate time synchronization and high-speed, high-precision control, while also enabling excellent real-time communication even in networks with multiple mixed protocols. It is installed in a PCI Express slot and functions as a CC-Link IE TSN manager/local station. The CPU on this board provides offloading capabilities for CC-Link IE TSN, minimizing the increased load on the host CPU due to the implementation of CC-Link IE TSN communication. By changing the bracket, it can be installed in both low profile and standard height slots. *Note: AdEXP1589 is a product under development.

• Embedded Board Computers

ExpEther HBA PCI Express add-in card

■ 1G ExpEther Host Bus Adapter ■ ExpEther Bridge (Master) ■ 1000BASE-T ■ 2-Port Redundant Configuration ■ Maximum Cable Length of 100m ■ PCI Express Add-in Card ■ Can be implemented in slim PCs due to low profile ■ Operating Temperature Range: -40 to 85°C (Extended Temperature Product) ■ OS Independent

• Embedded Board Computers

ExpEther Slave CompactPCI Board

■1G ExpEther Slave Adapter ■ExpEther Bridge (Slave) ■1000BASE-T ■2-Port Redundant Configuration ■Maximum Cable Length of 100m ■3U CompactPCI Board ■Operating Temperature Range: -40 to 85°C (Extended Temperature Product) ■OS Independent

• Other network tools

Intelligent PCI Express EtherCAT Master Board

AdEXP1572 is a PCI Express board with EtherCAT master communication capabilities. It uses the ARM Cortex-A9 processor embedded in the Xilinx Zynq and functions as an intelligent PCI Express bus slave board. The EtherCAT master protocol stack is equipped with "EC Master" from acontis technologies and is Class A compliant. It also supports cable redundancy and hot connect as a feature pack. This board is controlled by the PCI Express bus master (host CPU). Data transfer is conducted via shared memory installed on this board. As it functions as an intelligent slave, it enables EtherCAT master communication without burdening the host CPU. For more details, please contact us or download the catalog.

• Embedded Board Computers

Equipped with TI's ARM Cortex-A8, EtherCAT slave board.

■TI Corporation's Sitara AM3357 processor equipped (ARM Cortex-A8 single core) ■EtherCAT slave ■Equipped with expansion ports such as SPI, I2C, UART, GPIO, etc. ■High connectivity with 2.54mm pitch connectors and optional HIROSE FX20 connectors ■Supports wide input power supply DC5V±5% or DC15–40V (optional) ■Compact size 70mm x 75mm

• Other electronic parts

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will be exhibiting at "EdgeTech+ 2026," which will be held at Pacifico Yokohama from November 18 (Wednesday) to November 20 (Friday). This time, we will showcase our new product, the Renesas RZ/G3L equipped SMARC module, as well as motherboards and slim industrial computers that utilize this module. We will introduce solutions aimed at improving development efficiency through a common platform, as well as considerations for mass production and long-term operation. Additionally, we will display a wide range of products, including various embedded boards, IoT gateways, edge AI computers, short-depth 19-inch servers, and CRA-compliant products, along with examples of custom development aimed at solving customer challenges. We invite you to stop by our booth during this opportunity! ■Booth Number: Pacifico Yokohama Exhibition Hall 3-8 ■For more details: https://www.advanet.co.jp/mec-events/edgetech2026/

[Speaker] Hideo Ishihara, Specially Appointed Professor at Gifu University, National University Corporation Tokai National Higher Education and Research System Former Head of Semiconductor Division at Denso [Lecture Topics] 1. The Discovery of Quantum Mechanics and the Invention of Semiconductor Technology 2. Advanced Semiconductor Manufacturing (TSMC, Kumamoto JASM, Chitose Rapidus in Hokkaido, and Global Trends) 3. A 100-Year History of Computers and AI Semiconductors (CPU, GPU, NPU, Photonic-Electronic Integration) 4. A 100-Year History of Mobility and Semiconductors 5. Mobility (Autonomous Driving) and Semiconductors (Edge AI, Chiplets) 6. Mobility (Electrification) and Semiconductors (IGBT, SiC, GaN, Ga2O3, Diamond) 7. The Impact of Nobel Prize Research on "Quantum Entanglement" and "Bell's Inequality" 8. The Transformation of Future Society Seen from AI to AGI: Where is Humanity's Place? Living with Dreams 9. Q&A

[Key Lecture Content] 1. Circular Economy Policy Centered on Plastic Resource Circulation Strategy Keiko Osawa, Deputy Director, Resource Circulation Economy Division, GX Group, Ministry of Economy, Trade and Industry - Transition to a circular economy against the backdrop of economic security and decarbonization - Trends in system development through the Plastic Resource Circulation Promotion Act and others - Formation of the recycled plastic market and strengthening the competitiveness of the resource circulation industry - Progress and achievements of the plastic resource circulation strategy so far - Future policy directions towards realizing a circular economy and expectations for the private sector - Q&A / Business card exchange 2. JEPLAN's Initiatives in PET Chemical Recycling and Future Prospects Masaki Takao, President and CEO, JEPLAN Inc. - Domestic and international trends and challenges surrounding PET resource circulation - Features of JEPLAN's PET chemical recycling technology - Efforts towards achieving bottle-to-bottle recycling - Funding from the GX Promotion Organization and business expansion - Future prospects towards realizing resource circulation and a decarbonized society - Q&A / Business card exchange

[Key Lecture Content] 1. Direction of Bioindustry Policy and Future Priorities Ayako Yukawa, Deputy Director (General) of the Biological Chemistry Industry Division, Ministry of Economy, Trade and Industry 1. Global Trends Surrounding the Bioindustry 2. Japan's Strengths and Challenges to Overcome 3. Direction of Bioindustry Policy at the Ministry of Economy, Trade and Industry 4. Q&A / Business Card Exchange 2. The Future of Bio-Manufacturing Opened by Industrial Smart Cells - Industrial Transformation through Integrated Biofoundry Akihiko Kondo, CEO of Bacchus Bioinnovation 1. Trends in Bio-Manufacturing and the Potential of Industrial Smart Cells 2. Creation of Smart Cells through AI, Robotics, and Data-Driven Biofoundries 3. Comprehensive Technological Foundation from Microbial Breeding to Manufacturing Process Development 4. Resource Utilization of CO2 and Untapped Biomass and Prospects for Industrial Transformation 5. Q&A / Business Card Exchange