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  3. 日本技術情報センター
  4. Large resin, metal, and ceramic parts are manufactured quickly using 3D printers. <Zoom Online Seminar> - High-speed and large 3D printers for resin, metal, and ceramics are being developed one after another, enabling the rapid production of large parts at low cost, actively contributing to the manufacturing of components for aerospace, automotive, and other applications, as well as for part and mold repairs and recycling.
SEMINAR_EVENT
  • Jul 19, 2026
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Jul 19, 2026

Large resin, metal, and ceramic parts are manufactured quickly using 3D printers. <Zoom Online Seminar> - High-speed and large 3D printers for resin, metal, and ceramics are being developed one after another, enabling the rapid production of large parts at low cost, actively contributing to the manufacturing of components for aerospace, automotive, and other applications, as well as for part and mold repairs and recycling.

日本技術情報センター 日本技術情報センター
Recently, next-generation large-scale resin, metal, and ceramic 3D printers that achieve astonishing high-speed molding, low-cost, and high-precision molding have been developed and launched in the market one after another. These printers are rapidly being adopted and utilized by advanced companies in fields such as aerospace, automotive, industrial machinery, plants, defense, and social infrastructure for the manufacturing of large parts and large products, production of components for large resin molds, as well as for parts and mold repairs and reverse engineering. In this seminar, we will provide a clear and concrete explanation for beginners about the development trends, features, and utilization technologies of the latest advanced machines from Lobotics, a leading company in large resin 3D printers, along with domestic and international case studies and challenges. We will also cover the overview and features of the large ceramic 3D printer from SKEFINE, which can create the world's largest large parts, as well as its short-term molding technology and utilization examples. Additionally, we will discuss the short-time molding technology and case studies of Fuji High Frequency Industry, which is vigorously utilizing the rapidly growing large metal 3D printer from Meltio, along with examples of low-cost and material reduction achieved through topology optimization. Lastly, we will look at the latest molding technologies and case studies from Sanko Gosei, which has been using a large hybrid 3D printer from Matsuura Machinery for eight years to produce various high-functionality and high-quality components for large resin molds, including mass production examples using those molds.
Date and time Friday, Aug 28, 2026
01:00 PM ~ 05:00 PM
Capital
Entry fee Charge 19,000 yen
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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 15, 2026

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Awatori Rentaro Seminar: Understanding Stirring Techniques and Heat Generation Measures According to Viscosity Through Case Studies

[11/13 Osaka] Awatori Rentaro Seminar: Understanding Stirring Methods and Heat Generation Countermeasures According to Viscosity Through Case Studies

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In this seminar, you will learn the following: - The mixing mechanism and examples of Awatori Nentaro - Stirring methods and heat generation countermeasures according to material viscosity - The latest automation models and syringe filling technology using Awatori Nentaro We will provide not only the basic information about Awatori Nentaro but also the latest updates. During the live demonstration, we will clearly explain how actual materials are mixed and the operation screen of the temperature management solution app for Shinky. Additionally, equipment and optional items will be displayed in the venue, allowing you to consult while viewing the actual products. Please register early!

Oct 13, 2026

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10/16 [Free Web Seminar] Detailed Risk Assessment of Hazardous Areas

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An explanation of the "detailed risk assessment of hazardous areas," which is essential as the first step in promoting "smart security" and "DX transformation" in hazardous material facilities. We will clearly convey the evaluation methods and points to consider in implementation, incorporating comparisons of old and new evaluation methods as well as recent case studies. There will also be a Q&A session on the day. If you have any questions in advance, please fill them out in the participation input form. You are also welcome to ask questions on the day! We look forward to your participation. Date and Time: October 16, 2026 (Friday) 13:30 - 14:30 (Web seminar via eams)

Oct 13, 2026

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11/10 Webinar Advanced Semiconductor Packaging Technology

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■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies

Oct 13, 2026

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11/10 Webinar Non-fluorinated Water and Oil Repellent Coating

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■Title: "Fundamentals and Applications of Non-Fluorinated Water-Repellent and Oil-Repellent Coatings, Development Trends" In light of the strengthened PFAS regulations, this presentation will clearly explain non-fluorinated water-repellent and oil-repellent coatings, covering the basics of water-repellent and oil-repellent technologies, the trends in PFAS regulations in various countries, and the latest developments in alternative technologies. It will also introduce the characteristics and application examples of various materials such as silicone-based, urethane-based, polyolefin-based, and hybrid materials, providing knowledge that will be useful for product development and material selection. - Basic knowledge of water repellency and oil repellency - Fundamentals of fluorinated water-repellent and oil-repellent coatings - Overview of PFAS regulations in Europe, the United States, and Japan - Technical trends in non-fluorinated water-repellent and oil-repellent coatings - Characteristics and application examples of various non-fluorinated materials - Planning and development personnel considering the adoption of water-repellent and oil-repellent coatings - Engineers involved in products utilizing coatings - Personnel considering fluorinated alternative materials - Young engineers and students who want to learn about water-repellent and oil-repellent technologies

Oct 13, 2026

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  • 技術・製品展示会 新技術創出交流会2026 入場無料 来場登録受付中 開催日時10月22日木・23日金 会場東京たま未来メッセ
  • 脱炭素×高出力×軽量 天吊式・人感センサ付 速暖式工場用暖房機
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