August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology.
【Event Overview】
■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45
■ Format: Recorded distribution (Zoom)
■ Duration: Approximately 30 minutes
【Recommended for】
- Those involved in new business or new product development in the semiconductor and electronic device industry
- Those interested in flexible substrates and next-generation packaging technologies
- Those who want to learn about printed electronics and FHE
- Engineers and researchers from electronic components, materials, and packaging-related companies
- Those who want to understand trends in the next-generation electronics market
【What you will learn in this webinar】
- Basic knowledge of flexible hybrid electronics
- Benefits of integrating semiconductor and printing technologies
- Latest global market trends and future potential
- Product development examples utilizing flexible substrates
- New possibilities for next-generation device development
★ How to Register ★
Pre-registration (free) is required to participate in the webinar.
Click the "Details & Registration Button" below!

| Date and time | Wednesday, Aug 05, 2026 ~ Thursday, Aug 06, 2026 02:00 PM ~ 02:45 PM |
|---|---|
| Entry fee | Free |
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