We will exhibit at "Highly-functional Material Week 6th Sustainable Material Expo"

"The convenience of plastic and the eco-friendliness of biomass" - Bio-based composite resin blended with wood-derived cellulose that contributes to sustainability

*During the process from resin manufacturing to incineration, the CO2 emissions of GREEN CHIP CMF, containing 55% cellulose fiber, are expected to be reduced by approximately 35% compared with petroleum-derived ABS resin and by approximately 20% compared with petroleum-derived PP resin. (*1, *2). *Cellulose fiber functions as a reinforcing material, improving tensile strength, flexural strength, flexural modulus, and heat resistance (heat load deflection temperature) compared with unreinforced PP resin. This makes it possible to make molded products thinner and, therefore, contributes to weight reduction. *By adding GREEN CHIP CMF to recycled resin as a modifier, physical properties such as strength, elastic modulus, and heat deflection temperature can be improved, thereby contributing to increased use of recycled resin. *Despite containing 55% cellulose fiber, it achieves flowability equivalent to PP resin and delivers excellent moldability. Existing molds can be used, and the material exhibits low molding shrinkage and excellent dimensional stability. *1 Calculated in-house based on the results report of commissioned work to Osaka University by the Ministry of the Environment (FY2019). *2 Calculated in-house based on the Ministry of the Environment’s "Guidelines for the Utilization of Cellulose Nanofibers."

• Composite Materials

Since pulp fibers are used, it provides excellent cushioning and can effectively embed into uneven surfaces. It can also be used with cards and tags equipped with IC chips.

"We want to simplify the production process for Cards and tags with embedded IC chips." Do you have any such concerns? Conversion sheets are made by blending pulp fibers with resin fiber. Due to the use of pulp fibers, these products are highly cushioned and exhibit excellent ability to fill in uneven surfaces. Therefore, when electronic components (such as IC chips) are sandwiched and laminated with heat, it is easy to create planar shapes. [Other Features] Temperature processing from 80 ℃ is possible Before heating, the material is flexible and can be easily processed like paper. When heat is applied, it exhibits property changes similar to plastic sheets while maintaining water and heat resistance. With a pulp fiber content of over 51%, it contributes to plastic reduction. [Application] - IC cards - IC Tag - Reduces environmental impact as a substitute for plastic products, etc.

• Paper and pulp products

Highly filled composite material sheet containing inorganic fibers and powders, developed using advanced papermaking technology refined over many years

[Features] - Thin inorganic fiber sheet holding functional powder - Excellent low thermal conductivity and high thermal insulation - Thinness available to be combined with other sheet materials [Application] - Measures against ignition and heat generation for various batteries - Partial insulation of industrial equipment

• Secondary Cells/Batteries
• Lithium-ion battery

Improved adhesion strength and sealing properties without curing process by mold temperature and sealability during resin molding. Surface modification and potting are not required

[Features] - Improving sealing and adhesive performance without curing process due to mold temperature and heat during resin injection molding - Because the tape itself is slightly sticky, temporary lamination with metal insert materials is possible at room temperature - No surface modification or potting - Applicable to various materials Metals: Aluminum, stainless steel, copper, steel, etc. Resin: PPS, PBT, PA, etc. [Application] - Insert molded products such as connectors, bus bars, and terminal blocks - Resin and metal composite parts such as car interior panels

• Vehicle body parts
• Other Auto Parts

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

We will exhibit at Highly-functional Material Week – 6th Sustainable Material Expo from Sep. 30 (Wed) - Oct.2(Fri), 2026. We look forward to seeing you at our booth. [Exhibited Products] - Cellulose fiber compounded resin “GREEN CHIP CMF” - A Sheet that Changes from Paper to Plastic When Heated “Conversion Sheet” - 1000°C Fireproof Thin Sheet “Thermal Barrier/Flame Spread Prevention Sheet” - Improving sealability and adhesion between metals and resins for integral molding “Sealing Tape HT56 for Insert Molding” - Eco-Friendly Kraft Paper Tape “RICA TAPE” /Self-Adhesive Tape “RICA SELF” - Reusable “Load Stability Cover” for Preventing Load Shifting

We will hold a "3D Manufacturing Individual Consultation Meeting" at creative centers across various locations. On the day, we will be available to discuss "3D modeling machines." A dedicated staff member will be present, allowing for in-depth discussions unlike at exhibitions. Each session is limited to one company, and we will provide careful, one-on-one support. As seating is limited, please apply early. All of our staff sincerely look forward to your visit. Recommended for customers like these: ■ Using a 3D printer but dissatisfied with accuracy or finish ■ Wanting to create mock-ups closer to the final product ■ Looking to in-house production of jigs ■ Interested in utilizing it in educational institutions Capacity: Limited to one company per session Application deadline: 17:00 on the business day before each event date.

Date and Time: Thursday, July 23, 2026, 13:30 – 16:45 This seminar is recommended for those who use "Gaussian," the de facto standard for quantum chemistry calculations, and "GaussView6," which is essential for creating input files and visualizing results, but want to learn more effective settings and convenient features. We also offer a free attendance benefit for those who have contracted paid support. Please make use of this for advanced research and data-driven development! For more details, click here (to the Hulinks page) https://www.hulinks.co.jp/seminar/gaussian-gaussview-intermediate/

Nitto Kohki will exhibit at "BATTERY JAPAN - Secondary Battery Exhibition" held at Makuhari Messe Hall 7 from September 9 (Wednesday) to September 11 (Friday), 2026. [Booth Number: E22-6] ■ Introduction of Exhibited Products At this exhibition, we will showcase rapid fluid couplings that can quickly connect and disconnect piping for various fluids such as air, water, oil, and chemical solutions. Highlighted products include the "Zero Spill Coupler," which significantly reduces liquid dripping during disconnection and contributes to improving the working environment, as well as the new "Large Diameter Zero Spill Coupler." Additionally, we offer over 100 varieties in the "High Coupler" series, categorized by body material and mounting size.