Exhibition Participation: Manufacturing Fair 2026

We support the restoration and redesign of discontinued parts, as well as product prototyping and mass production.

Our company will solve these challenges with the technical skills and know-how we have cultivated over many years! We will flexibly respond to our customers' needs, from parts procurement and alternative part selection to prototype production and mass production. Are you facing any of the following situations? - Circuit diagrams or design data are lost or damaged - There is a shortage of in-house designers - Alternative parts cannot be found - It is difficult to respond due to unique circuit designs For more details, please refer to the related links and feel free to contact us.

• Circuit board design and manufacturing
• EMS
• Other contract services

We provide a consistent production system for the design and manufacturing of electronic components and electronic devices (ODM/OEM).

JOHNAN DMS Corporation provides a comprehensive service from product development and prototyping to mass production. ■Features - Integrated production of electronic components, electronic devices, and equipment, with strong quality control and improvement capabilities - Ownership of a mass production factory equipped with a clean room - Design and manufacturing of labor-saving equipment and tools - Capable of semiconductor assembly, circuit board mounting, equipment assembly, and inspection For more details, please refer to the related links.

• Circuit board design and manufacturing
• EMS
• Contract manufacturing

We expand the possibilities of your product design with the implementation of paper materials!

The paper substrate assembly service is a service that enables the assembly of substrates onto paper materials by creating substrates from regular paper and mounting components. Paper substrates are thin, lightweight, and flexible, allowing for shape changes such as bending or transforming into cylindrical shapes. ■ Service In the assembly of LED components on paper substrates, we have achieved automation using SMT assembly machines with conductive adhesives. This ensures improved productivity and stable assembly quality for products. - Accurate positioning of components - Uniform adhesive application is possible ■ Introduced in a video ~ What is paper substrate assembly? ~ https://www.youtube.com/watch?v=7ktq1tLHnRk ~ [Paper Substrate Assembly] Introducing the manufacturing process of glowing fans! ~ https://www.youtube.com/watch?v=52X7W0PGWu8 For more details, please refer to the related links.

• Circuit board design and manufacturing

Proposals from various perspectives, such as product manufacturing method suggestions, review of manufacturing processes, and improvement of production efficiency!

We would like to introduce our "design and manufacturing contract services for electronic components and devices (ODM/EMS)." We provide a one-stop solution from material procurement to design, assembly, processing, inspection, and shipping. Additionally, we offer improvement proposals and implementations from various perspectives on productivity and quality enhancement, providing the necessary manufacturing space and human resources. We respond to a wide range of needs through collaboration with partner companies. 【Features】 ■ Consistent production of devices and electronic equipment ■ Improvement proposals for productivity and quality enhancement ■ Provision of necessary manufacturing space and human resources ■ Conducting mass production prototypes before full-scale production *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing

We provide implementation services for hot melt molding, wearable devices, and stretchable films.

JOHNAN DMS Corporation is currently developing a new technology called "implementation technology for functional films" to expand the possibilities of miniaturization and thinness of products, which are in demand across various industry sectors. This technology enables implementation onto films with elasticity, allowing for adaptation to various shapes such as curves. Using this technology, we provide implementation services for "hot melt molding," "wearable devices," and "stretchable films." You can find detailed information about each service on our company website.

• Other mounting machines

0201 implementation contributes to manufacturing products for ultra-high-density mounting, module mounting, and embedded component substrates with a minimum gap of 0.1mm.

JOHNAN DMS Corporation contributes to our customers' manufacturing through product miniaturization and modularization. We provide a consistent system from product conceptual design to circuit board assembly, product assembly, and quality inspection. We can accommodate customer requests from implementation technology development to contract manufacturing. We also have a manufacturing base in Thailand and offer EMS services. ■ SMT Mounting Capability (Surface Mount Technology) 【Precision】 Reflow: chip 0201, chip 0402 Reflow & Flow (Bond Mounting): chip 0603 and above 【Supported Chips】 BGA, SOP, QFP, LED, QFN, etc. 【Supported Sizes】 Maximum size: 250mm × 330mm, board thickness: 0.5mm to 1.6mm (MAX: 5.0mm) ■ Chip Mounting 0201 chip mounting, 0201 mounting with a minimum gap of 0.1mm. High effectiveness is expected for ultra-high-density mounting, module mounting, and component-integrated circuit board mounting. ■ COB Mounting (Chip On Board) 【Mounting Capability】 0.2mm to 10mm Post-mounting of COB substrates. Cream solder application is possible using a dispenser. For more details, please refer to the related links.

• Circuit board design and manufacturing

We provide COB (Chip On Board) implementation services.

JOHNAN DMS Corporation offers COB (Chip On Board) assembly services. Our assembly technology supports 0201 chips and minimum 0.1mm gap assembly, enabling product miniaturization and complex design requirements. 【Mounting Capability】0.2mm to 10mm 【Wiring】Gold wire (20μ to 38μ), aluminum wire (100μ to 400μ) *Post COB assembly on COB substrates. Cream solder application by dispenser is possible. For more details, please feel free to contact us by phone or through our website.

• Other electronic parts

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

We will be exhibiting at "CEATEC 2026," which will be held at Makuhari Messe from October 13 to 16. We provide information technology and process informatics (PI) that optimize "how to create" by utilizing physical simulations, AI, and machine learning in process development. We look forward to your visit to our booth. 【Seminar Information】 "Process Informatics for Exploring Optimal Manufacturing Conditions" Date and Time: October 16, 2026 (Friday) 12:45 - 13:00 Venue: Makuhari Messe Exhibition Hall 4 P Stage Speaker: CEO Takaishi Please check the link below for details on our exhibition.