Notice of Participation in the 27th Advanced Implementation Technology and Packaging Exhibition (2013 Microelectronics Show)

Well, Inc., a semiconductor advanced packaging solution provider specializing in test chips, will exhibit at the 27th Advanced Packaging Technology and Packaging Exhibition eX-tech2013, which will be held from June 5 (Wednesday) to June 7 (Friday), 2013, at Tokyo Big Sight.
■ Overview of the 27th Advanced Packaging Technology and Packaging Exhibition (eX-tech2013)
[Dates] June 5 (Wednesday) to June 7 (Friday), 2013 - 3 days
[Opening Hours] 10:00 AM to 5:00 PM
[Venue] Tokyo Big Sight (3-21-1 Ariake, Koto-ku, Tokyo)
[Booth] 3N-12
[Exhibit Contents]
- High-density radical atmospheric pressure plasma equipment
- TSV-equipped TEG chips for advanced packaging evaluation
- TSV & MEMS processing services
- Bump processing services
≪For inquiries regarding this matter≫
Well, Inc. Implementation Solutions Sales Department
2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennoz Tower 2F
Tel: 03-5715-3501
Fax: 03-5715-3502
info@welljp.co.jp
http://well-plasma.jp/

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