Atmospheric Pressure Plasma Device MyPL Series

Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/

Well, Inc., a semiconductor advanced packaging solution provider specializing in test chips, will exhibit at the 27th Advanced Packaging Technology and Packaging Exhibition eX-tech2013, which will be held from June 5 (Wednesday) to June 7 (Friday), 2013, at Tokyo Big Sight. ■ Overview of the 27th Advanced Packaging Technology and Packaging Exhibition (eX-tech2013) [Dates] June 5 (Wednesday) to June 7 (Friday), 2013 - 3 days [Opening Hours] 10:00 AM to 5:00 PM [Venue] Tokyo Big Sight (3-21-1 Ariake, Koto-ku, Tokyo) [Booth] 3N-12 [Exhibit Contents] - High-density radical atmospheric pressure plasma equipment - TSV-equipped TEG chips for advanced packaging evaluation - TSV & MEMS processing services - Bump processing services ≪For inquiries regarding this matter≫ Well, Inc. Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennoz Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/

Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/

Well, Inc. (Headquarters: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 41st InterNepcon Japan, which will be held at Tokyo Big Sight from January 18 (Wednesday) to January 20 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (reducing CO2 emissions) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, offering both low capital investment and low running costs, which are its greatest economic advantages. On the day of the event, we will conduct demonstrations using the compact tabletop MyPL-Auto150, allowing attendees to experience actual large-area plasma irradiation. We sincerely look forward to your visit. http://well-plasma.jp/news20111115.aspx 【Contact for inquiries】 Well, Inc. Packaging Solutions Sales Department tel: 03 (5715) 3501 mail: info@welljp.co.jp