Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions

Flip chip assembly contract service

We offer a contract assembly service specialized in flip chip assembly that can achieve high-density implementation at low cost. We support prototype flip chip assembly from rigid substrates to COF, COG substrates, and Si interposer substrates, as well as 3D assembly prototypes using TSV electrodes.

• Processing Contract
• Contract measurement
• Other analyses

Implementation Solution Service

Well, we provide turnkey solutions from the development of flip chip implementation methods using TEG chips as our core business to the prototyping of implementations using various methods, including bumping for flip chips, re-wiring processing, and 3D implementation wafer MEMS processing (cavity and through-via processing).

• Bonding Equipment
• Other semiconductor manufacturing equipment
• Circuit board processing machine

High-density plasma is generated over a large area by the unique reactor head!

Facilitates the construction of mass production inline systems for large workpieces (such as glass substrates) from semiconductor IC pad cleaning to FPC substrates and LCD glass substrates, achieving reductions in capital investment and running costs! Simple plasma unit equipped with a manual stage Compatible with build-in for various devices.

• Molding Equipment
• Circuit board processing machine
• Plasma surface treatment equipment

High-density plasma is generated over a large area by a unique reactor head!

Facilitating the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving reductions in capital investment and running costs!

• Molding Equipment
• Circuit board processing machine
• Plasma surface treatment equipment

High-density plasma is generated over a large area by the unique reactor head!

Facilitates the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving a reduction in capital investment and running costs!

• Molding Equipment
• Circuit board processing machine
• Plasma surface treatment equipment

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.