Implementation Solution Service
Well, we provide turnkey solutions from the development of flip chip implementation methods using TEG chips as our core business to the prototyping of implementations using various methods, including bumping for flip chips, re-wiring processing, and 3D implementation wafer MEMS processing (cavity and through-via processing).
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basic information
Well, as our core business, we provide turnkey solutions for the development of TEG chips for flip chip mounting technology, including bump and redistribution processing for flip chips, 3D packaging wafer MEMS processing (cavity and through-via processing), and prototype mounting using various methods.
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Applications/Examples of results
Service Flow Bump, Rewiring, MEMS Processing → BG, Dicing Processing → Flip Chip Mounting → Various Mounting Reliability Tests
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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