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  3. ウェル
  4. Announcement of Participation in the 41st InterNepCon Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions.
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  • Dec 29, 2011
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Dec 29, 2011

Announcement of Participation in the 41st InterNepCon Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions.

ウェル ウェル
Well, Inc. (Headquarters: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 41st InterNepcon Japan, which will be held at Tokyo Big Sight from January 18 (Wednesday) to January 20 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (reducing CO2 emissions) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, offering both low capital investment and low running costs, which are its greatest economic advantages. On the day of the event, we will conduct demonstrations using the compact tabletop MyPL-Auto150, allowing attendees to experience actual large-area plasma irradiation. We sincerely look forward to your visit. http://well-plasma.jp/news20111115.aspx 【Contact for inquiries】 Well, Inc. Packaging Solutions Sales Department tel: 03 (5715) 3501 mail: info@welljp.co.jp
Atmospheric pressure plasma device
Atmospheric pressure plasma device
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Well Co., Ltd. Company Profile
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Flip chip assembly contract service

Flip chip assembly contract service

We offer a contract assembly service specialized in flip chip assembly that can achieve high-density implementation at low cost. We support prototype flip chip assembly from rigid substrates to COF, COG substrates, and Si interposer substrates, as well as 3D assembly prototypes using TSV electrodes.

  • Processing Contract
  • Contract measurement
  • Other analyses

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Implementation Solution Service

Implementation Solution Service

Well, we provide turnkey solutions from the development of flip chip implementation methods using TEG chips as our core business to the prototyping of implementations using various methods, including bumping for flip chips, re-wiring processing, and 3D implementation wafer MEMS processing (cavity and through-via processing).

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Circuit board processing machine

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Atmospheric Pressure Plasma Device MyPL Series

High-density plasma is generated over a large area by the unique reactor head!

Facilitates the construction of mass production inline systems for large workpieces (such as glass substrates) from semiconductor IC pad cleaning to FPC substrates and LCD glass substrates, achieving reductions in capital investment and running costs! Simple plasma unit equipped with a manual stage Compatible with build-in for various devices.

  • Molding Equipment
  • Circuit board processing machine
  • Plasma surface treatment equipment

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Atmospheric Pressure Plasma Device MyPL-Auto Series

High-density plasma is generated over a large area by a unique reactor head!

Facilitating the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving reductions in capital investment and running costs!

  • Molding Equipment
  • Circuit board processing machine
  • Plasma surface treatment equipment

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ilp1500.png

Atmospheric Pressure Plasma Device ILP-Inline Series

High-density plasma is generated over a large area by the unique reactor head!

Facilitates the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving a reduction in capital investment and running costs!

  • Molding Equipment
  • Circuit board processing machine
  • Plasma surface treatment equipment

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Flip chip assembly contract service

Flip chip assembly contract service

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Atmospheric pressure plasma surface modification device

Atmospheric pressure plasma surface modification device

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■■ Air Leak Tester | FLA-0200 / FLA-0201 series ■■ Fukuda's new flagship model. Equipped with mastering correction function, it enables high-precision measurements in a short time.

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  • PRODUCT

Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

Apr 14, 2026

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[Cast Iron Crack Repair] We repair cracks in metal products without applying heat.

  • NEW
  • COMPANY

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Apr 14, 2026

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[Free Catalog Distribution] Measures against "Near Misses" in Nursing and Care Settings. Prevent tripping and disconnection with codes! Wireless Series Bed Exit Sensors Linked to Nurse Call Systems.

  • NEW
  • CATALOG

In facilities operating nurse call systems, we have made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call system. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. This helps prevent accidents caused by falls, slips, or wandering, contributing to the efficiency of medical operations. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call system. ○ Up to 5 transmitters can be registered with a single receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

Apr 13, 2026

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Non-contact light beam touch sensor "HA-T Series"

【Catalog now available!】Energy-saving automatic door sensors "HA-T401/HA-T520"

  • NEW
  • CATALOG

The "HA-T Series" is an energy-saving automatic door sensor that opens only for those who wish to enter, whether on a busy street or in a narrow passageway. The automatic door opens simply by bringing your hand close, addressing hygiene concerns even in facilities used by a large number of people. You can choose between "Non-vision Mount Type/HA-T401" and "Non-vision Built-in Type/HA-T520" depending on the application and installation location. 【Recommended for such places!】 ☑ Entrance facing a busy corridor ☑ Presence of counters or signs near the door ☑ Buildings facing narrow passages ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors 【Features】 ● Adaptable to various door types with four detection spot settings ● Reduces unnecessary opening and closing, contributing to energy-saving by minimizing wasteful power consumption ● Equipped with a light touch function, allowing the door to open and close just by waving your hand, ensuring hygiene ● Can also be used as a wide detection range non-vision infrared sensor ◎ For more details, please download the materials or contact us.

Apr 13, 2026

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[Cast Iron Repair] We will repair cracks that have occurred in metal equipment without applying heat.

  • NEW
  • CATALOG

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Apr 13, 2026

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