Announcement of Participation in the 41st InterNepCon Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions.

Well, Inc. (Headquarters: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 41st InterNepcon Japan, which will be held at Tokyo Big Sight from January 18 (Wednesday) to January 20 (Friday), 2012.
Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (reducing CO2 emissions) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, offering both low capital investment and low running costs, which are its greatest economic advantages.
On the day of the event, we will conduct demonstrations using the compact tabletop MyPL-Auto150, allowing attendees to experience actual large-area plasma irradiation. We sincerely look forward to your visit.
http://well-plasma.jp/news20111115.aspx
【Contact for inquiries】
Well, Inc.
Packaging Solutions Sales Department
tel: 03 (5715) 3501
mail: info@welljp.co.jp

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