Notice of Participation in the 'Implementation and Assembly Process Technology Exhibition 2026 Kyoto' from November 26 (Thursday) to November 27 (Friday), 2026.

We offer X-ray stereo 3D X-ray inspection devices, high-magnification X-ray inspection devices, and more!

Aibit Inc. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2026 Kyoto" held at the Miyakomesse in Kyoto City. This exhibition focuses on automation in the later stages of production, gathering advanced equipment manufacturers aimed at labor reduction and specialized manufacturers in manufacturing and procurement. We plan to showcase the X-ray stereo 3D X-ray inspection system "FX-400tRX," the high-magnification X-ray inspection system "FX-300tR2," and the inline X-ray inspection system combining 3D CT and X-ray stereo methods "ILX-1000j/1100/2000." We sincerely look forward to your visit. 【Event Overview】 ■ Date: November 26 (Thursday) to 27 (Friday), 2026 ■ Time: 10:00 AM to 5:00 PM (Last admission at 4:00 PM) ■ Admission Fee: Free ■ Venue: Miyakomesse, Kyoto City, 2nd Exhibition Hall *For more details, please download the PDF or feel free to contact us.

• X-ray inspection equipment
• Exhibition

Fully utilize CT functions with easy operation! Achieving high resolution of 2μm while being a sealed X-ray device.

The "FX-400tRX" is a 3D X-ray stereo inspection device capable of obtaining clear X-ray images with a geometric magnification of 500 times. It can also inspect the connection points of IC wire bonding and copper wires. Additionally, it can inspect through-holes inside printed circuit boards. With a high output of 110kV and 200μA, it has become possible to penetrate materials such as 3mm thick copper plates. 【Features】 ■ High output X-ray source of 110kV and 200μA allows penetration of copper plates (3mm) ■ High resolution of 2μm enables image acquisition of fine details ■ High magnification imaging with geometric magnification of 500 times ■ X-ray stereo method allows separation of the front and back surfaces of the mounted circuit board (approximately 4 seconds) ■ X-ray stereo CT method enables acquisition of 500 horizontal cross-sections of the mounted circuit board *For more details, please download the PDF or feel free to contact us.

• X-ray inspection equipment

X-ray stereo method! The resolution has improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section.

This product is an X-ray inspection device that can slice a printed circuit board from the top surface to the bottom surface into 300 layers using X-ray stereo technology (our proprietary technology). The resolution has increased threefold from the conventional 100-layer cross-section to a 300-layer cross-section. The X-ray output is 110kV, 200μA, with a resolution of 2μm. It comes standard with a chip counter function and allows selection from three types of CT methods. 【Features】 ■ X-ray stereo technology (our proprietary technology) ■ Slices the printed circuit board from the top surface to the bottom surface into 300 layers ■ Resolution improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section ■ X-ray output of 110kV, 200μA, with a resolution of 2μm ■ Three types of CT methods (V-CT, diagonal CT, stereo CT) *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment

3D X-ray stereo method! The two-layer solder separation inspection of power devices has been realized!

The product has the capability to separately inspect the solder under the chip and the solder under the insulating substrate using the "X-ray stereo method." When using the X-ray transmission principle in the X-ray stereo method, the solder joint under the chip and the solder joint under the insulating substrate appear in the same position, causing the front and back to overlap, which prevents accurate inspection. The X-ray stereo method is a groundbreaking inspection device that allows for the separation and individual inspection of each solder joint. 【Features】 ■ High-output X-ray capable of penetrating a 5mm copper plate with 130kV, 0.5mA, and 39W (FX-500tRX) ■ Achieves high resolution with high output of 110kV, 0.2mA, 20W and spatial resolution of 2μm (FX-400tRX) ■ Enables two-layer separation inspection using 3D X-ray stereo method ■ Reduction in running costs due to the adoption of a long-life, 1.3 million pixel, 14-bit (16384 gradation) X-ray flat panel ■ Compact inspection machine body with traceability support through QR code recognition *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment

It is a sealed X-ray device that achieves a high resolution of 2μm! A 3D X-ray stereo observation device.

The "FX-400tRX/LL" is an X-ray observation device that enables the acquisition of clear X-ray images with a high resolution of 2μm and a geometric magnification of 500 times. It can inspect the connection points of IC wire bonding and copper wires, as well as observe through-holes inside printed circuit boards. Additionally, with a high output of 110kV and 200μA, it is now possible to penetrate materials such as 3mm thick copper plates. 【Features】 ■ High output X-ray source of 110kV and 200μA allows penetration of copper plates (3mm) ■ High resolution image acquisition of fine details with a resolution of 2μm ■ High magnification imaging with a geometric magnification of 500 times ■ X-ray stereo method allows separation of the surface and back side of the mounted board (approximately 4 seconds) ■ X-ray stereo CT method enables acquisition of 300 horizontal cross-sections of the mounted board (approximately 50 seconds) *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices

Compact yet achieving a geometric magnification of 900 times! A cost-effective X-ray observation device.

The "FX-300tR2" is an X-ray observation device that allows for the comparison and observation of current images against registered good quality images. Despite being a compact and small X-ray device, it achieves a geometric magnification of 900 times. The flat panel can be tilted at 60° for observation, and it automatically follows the observation position for diagonal viewing. It achieves a real resolution of 5μm, and the L-size device can accommodate substrates of 600×600. 【Features】 ■ Geometric magnification: 900 times ■ Monitor magnification: 5,400 times ■ X-ray output: 90kV ■ X-ray focal diameter: 5μ, 15μ (switchable) *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment

Compact yet achieving a geometric magnification of 900 times! A cost-effective X-ray observation device!

This product is a cost-effective X-ray observation device that achieves a geometric magnification of 900 times while being compact. You can register good quality images and compare them with current images, and it is possible to observe with the flat panel tilted at 60°. Target to sample distance is 0.5mm, target to X-ray camera distance is 450mm: 450/0.5=900. The L-size device is compatible with substrates of 600×600mm. 【Features】 ■ Equipped with various measurement functions ■ Ability to register good quality images and compare them with current images ■ Flat panel can be tilted at 60° for observation ■ Automatic tracking of observation position for diagonal observation (points do not shift even if the camera is tilted) ■ Inspection functions can be added as an option ■ CT function and L-size compatibility can be added as options *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment

Both sample inspection on the inspection tray and reel-to-reel inspection are supported!

We would like to introduce our high-magnification X-ray observation device, the 'FX-300tR2', along with its reel observation function. This product is a device that inspects electronic components and semiconductor components on a reel, one by one as they are unwound. With a single X-ray device, it is now possible to conduct inspections both by arranging ICs on a conventional inspection table and by unwinding the reel. Please feel free to contact us if you have any inquiries. 【Features】 ■ Geometric magnification: 900x ■ Monitor magnification: 5,400x ■ X-ray output: 90kV ■ X-ray focal diameter: 5μ, 15μ (switchable) *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment

Thank you very much for visiting our booth at JIMTOF2026. The entire sales team is very pleased. You can view the exhibited products at the following URL: ▼JIMTOF2026 Somax Co., Ltd. Product Highlights https://www.somax.co.jp/notice02/ We are currently offering free demonstrations, including in our cleaning test room! Please feel free to contact us!

Our company will be exhibiting at the "Hokuriku Yarn Fair 2026" held at the Ishikawa Industrial Exhibition Hall. At our booth, we will showcase the Whole Garment Flat Knitting Machine <SWG091N2>, which knits products in three dimensions, along with a variety of knit samples as examples of its applications. Additionally, we will conduct a demonstration of the design software <APEXFiz Design> and introduce <yarnbank>, a service that allows users to search and utilize yarn information from around the world, as well as <SHIMA Datamall>, a digital content web service that enables users to search, view, and purchase digital data useful for planning, production, and sales of fashion items. We will propose solutions to support the digitalization from planning to development and production. The overview of our exhibition content is as follows: Exhibition Content: SWG091N2 (Whole Garment Flat Knitting Machine) APEXFiz Design (Design Software) yarnbank (Comprehensive Web Service for Yarn Information) SHIMA Datamall (Digital Content Web Service) Knit Samples Cut Samples <Contact Information> Sales Division, Kinoshita TEL: 073-474-8231

We will hold a seminar on the theme "Key Points for Success in Core System Renewal Projects as Described by Food Ingredient Manufacturers." We will welcome the former President of Organofoodtech Co., Ltd., a food ingredient manufacturer that has actually renewed its core system, to share insights from the perspective of someone directly involved in the project. ■ Date and Time: November 12, 2026 (Thursday) 14:00–14:30 (Connection starts at 13:50) ■ Location: Web Seminar (held via Webex) ■ Theme: "Key Points for Success in Core System Renewal Projects as Described by Food Ingredient Manufacturers" ■ Overview: This is a case study presentation featuring the former President of Organofoodtech Co., Ltd., a food ingredient manufacturer that has successfully renewed its core system. The presentation will cover the background that led to the renewal, the process of selecting the system, challenges faced during implementation, and the effects observed after implementation, all from the perspective of someone directly involved in the project. This 30-minute session will be a valuable reference for those considering core system renewal or vendor selection. Even if you have not attended the first or second seminars for the food-related industry, you are welcome to join from the third session, so please feel free to participate.

Art Screw Co., Ltd. will be exhibiting at the "Next Generation Manufacturing Infrastructure Technology Industry Exhibition" held at Port Messe Nagoya, Hall 1. The Next Generation Manufacturing Infrastructure Technology Industry Exhibition is a manufacturing exhibition that brings together technologies that create the future. It aims to widely showcase the excellent technologies of small and micro-manufacturers with unique processing techniques, special materials, and high-precision parts, which possess niche and advanced technical capabilities, and to create new business opportunities. Our company plans to exhibit the anti-loosening screw "Motion Tight." We sincerely look forward to your visit.

We are considering refreshing our ERP system, but we have many add-ons, customizations, and unique business processes in our current system, which makes us anxious about whether we can truly adapt to a Fit to Standard approach." This is a challenge faced by many companies considering a core system refresh. In this seminar, we will explain the approach of "Fit to 'Japan' Standard" as a realistic solution for standardization, taking into account the unique business processes of Japanese companies. We will organize the business processes that should be standardized and those that should remain unique, aiming for a feasible Fit to Standard by viewing ERP, peripheral systems, and data integration as a whole. We will introduce specific approaches towards this realization, leveraging the strengths of three companies. <Fujisoft> As the "guide" for the entire project, we will explain the key points for promoting the project to achieve Fit to Standard. <Works Applications> We will introduce standardization suitable for Japanese companies using the domestic ERP "HUE." <Asteria> We will present the concept of loosely coupling ERP with existing and peripheral systems using the data integration tool "ASTERIA Warp.