Product presentation of PERFECTRON and INNODISK.

Compact PC for machine, factory, and building automation.

Features ■ Width 391 × Height 65 × Depth 216 mm, 5.49 liters ■ Atom D2550 1.86GHz CPU, fanless operation ■ DDR3 800/1066MHz x 2 (maximum 4GB) ■ 2 x 2.5" SATA HDD/SSD ■ 2 x Mini PCIe expansion slots ■ Multi-display 1 x VGA, 1 x DVI-D ■ Extended temperature support -40 to 70℃ (UT) ■ Wide DC input 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation.

Features ■ Width 342 × Height 65 × Depth 216 mm, 4.8 liters ■ Atom D2550 1.86GHz CPU, fanless operation ■ DDR3 800/1066MHz x 2 (maximum 4GB) ■ 2 x Mini PCIe expansion slots ■ Multi-display 1 x VGA, 1 x DVI-D ■ Extended temperature range -40 to 70℃ (UT) ■ Wide DC input 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation

Features ■ Width 195 × Height 51 × Depth 230 mm, 2.29 liters ■ Atom N2800 1.86GHz CPU, fanless operation ■ DDR3 800/1066MHz x 1 (maximum 2GB) ■ 1 x Mini PCIe expansion slot ■ Extended temperature support -40 to 70℃ (optional) ■ Wide DC input 9V to 30V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation.

Features ■ Width 370 × Height 77 × Depth 240 mm, 6.84 liters ■ 3rd generation Core i7/i5/i3 CPU, fanless operation ■ DDR3 1333/1600MHz x 2 (up to 16GB) ■ 2 x 2.5" SATA HDD/SSD ■ 2 x Mini PCIe expansion slots ■ Multi-display: 1 x VGA, 1 x DVI-D, 1 x HDMI ■ Extended temperature range: -40 to 70℃ (UT) ■ Wide DC input: 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation.

Features ■ Width 370 × Height 122 × Depth 246 mm, 11.1 liters ■ 3rd generation Core i7/i5/i3 CPU, fanless operation ■ DDR3 1333/1600MHz x 2 (up to 16GB) ■ 2 x 2.5" SATA HDD/SSD ■ 1 x Mini PCIe, 1 x PCI, 1 x PCIe[x1] expansion slots ■ Multi-display: 1 x VGA, 1 x DVI-D, 1 x HDMI ■ Extended temperature range -40 to 70℃ (UT) ■ Wide DC input 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Mini-ITX motherboard equipped with Atom D2550 1.86GHz.

Features ■ Atom D2550 1.86GHz support ■ DDR3 800/1066 MHz SO-DIMM x 2 (up to 4GB) ■ Supports VGA, LVDS, DVI ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom D525 1.8GHz equipped, Mini-ITX motherboard

Features ■ Atom D525 1.8GHz support ■ DDR3 800/1066 MHz SO-DIMM x 1 (up to 4GB) ■ VGA + LVDS compatible ■ Extended temperature range -20 to 70℃ compatible

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Socket G2, Mini-ITX motherboard compatible with Core i7/i5/i3

Features ■ Supports 3rd Gen Core i7/i5/i3 ■ DDR3 1333/1600 MHz SO-DIMM x 2 (up to 16GB) ■ Supports VGA, LVDS, DVI, HDMI ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

LGA1155 Core i7/i5/i3 compatible Mini-ITX motherboard

Features ■ Supports 3rd Gen Core i7/i5/i3 ■ DDR3 1333/1600 MHz SO-DIMM x 2 (up to 16GB) ■ Supports VGA, LVDS, DVI, HDMI ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Socket G2, Mini-ITX motherboard compatible with Core i7/i5/i3

Features ■ Supports 3rd Gen Core i7/i5/i3 ■ DDR3 1333/1600 MHz SO-DIMM x 2 (up to 16GB) ■ Supports VGA, LVDS, DVI, HDMI ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom N2600 1.6GHz equipped, Mini-ITX motherboard

Features ■ Atom N2600 1.6GHz support ■ DDR3 800/1066 MHz SO-DIMM x 1 (maximum 2GB) ■ Supports VGA, DVI-D, LVDS ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

LGA1155 compatible with Core i7/i5/i3 CPUs, ATX motherboard

Features ■ Supports LGA1155 Core i7/i5/i3 CPUs ■ DDR3 1066/1333/1600MHz 240-pin DIMM x 4 (up to 32GB) ■ VGA, DVI-D, HDMI compatible ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

LGA1155 compatible with Xeon E3/Core i3, ATX motherboard

Features ■ Supports LGA1155 Xeon E3/Core i3/Pentium CPUs ■ DDR3 1066/1333/1600MHz 240-pin ECC/Non-ECC DIMM x 4 (up to 32GB) ■ Supports VGA, DVI-D, HDMI ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU equipped, 3.5" CPU board

Features ■ Equipped with 3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU ■ DDR3 1333/1600MHz 204-pin SO-DIMM x 1 (up to 8GB) ■ Supports VGA, LVDS, DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU equipped, 3.5" CPU board

Features ■ Equipped with 3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU ■ DDR3 1333/1600MHz 204-pin SO-DIMM x 1 (up to 8GB) ■ Supports VGA, LVDS, DVI-I ■ Operating temperature range -40 to 85℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

StackPC Carrier Board EPIC Form Factor

Features ■Supported Module: StackPC ■VGA + DisplayPort ■Extended Temperature Range: -40 to 85℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom N455 CPU equipped, StackPC CPU board

Features ■ Equipped with Atom N455 1.66GHz CPU ■ 1 x DDR3 800MHz DIMM (up to 2GB) ■ VGA + LVDS ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom D525 CPU equipped, StackPC CPU board

Features ■ Equipped with Atom D525 1.8GHz CPU ■ 1 x DDR3 800MHz DIMM (up to 4GB) ■ VGA + LVDS ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Third generation Core i7/i3 CPU equipped, StackPC CPU board

Features ■ Equipped with 3rd generation Core i7/i3 CPU ■ 2 x DDR3 1333/1600MHz XR-DIMM with ECC (up to 8GB) ■ VGA + LVDS ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom N2600 1.6GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom N2600 1.6GHz CPU ■ DDR3 800/1066MHz 204-pin SO-DIMM x 1 (maximum 4GB) ■ Supports LVDS and DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom D2550 1.86 GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom D2550 1.86GHz CPU ■ DDR3 800/1066MHz 204-pin SO-DIMM x 1 (up to 4GB) ■ Supports VGA, LVDS, DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom N2800 1.86GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom N2800 1.86GHz CPU ■ DDR3 800/1066MHz 204-pin SO-DIMM x 1 (up to 4GB) ■ Supports LVDS and DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom E620T 600MHz CPU equipped, 3.5" CPU board

Features ■ Equipped with Atom E620T 600MHz CPU ■ 512MB DDR2 667/800MHz ■ Supports LVDS and VGA ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom E660T 1.3GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom E660T 1.3GHz CPU ■ 1GB DDR2 667/800MHz installed ■ Supports LVDS and VGA ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom N455 1.66GHz CPU, 3.5" CPU board

Features ■ Equipped with Atom N455 1.66GHz CPU ■ 1 x 204-pin DDR3 800MHz (up to 2GB) ■ Supports LVDS and VGA ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom D525 1.8GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom D525 1.8GHz CPU ■ 1 x 204-pin DDR3 800MHz (up to 4GB) ■ Supports LVDS and VGA ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with 3rd generation Core i7/i5/i3 CPU, COM Express Type 6

Features ■ Equipped with 3rd generation Core i7/i5/i3 CPU ■ 4GB DDR3 1600MHz IC onboard ■ Supports 3 DDI ports: HDMI/DP/SDVO/DVI ■ Extended temperature range: -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with 4th generation Core i7/i5/i3 CPU, EBX board

Features ■ Equipped with Core i7-4700EQ / Core i5-4400E / Core i3-4102E / Celeron 2000E CPU ■ 1 x XR-DIMM DDR3 1600MHz (up to 8GB) ■ Supports VGA, LVDS, 2 x DP ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom E3845 / E3815 CPU equipped, EPIC CPU board

Features ■ Equipped with Atom E3845 (1.91GHz, 10W) / E3815 (1.46GHz, 5W) CPU ■ 1 x XR-DIMM DDR3 1600MHz (up to 4GB) ■ 32GB NAND Drive ■ Supports VGA, LVDS, 2 x DP ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Advantech Toyo will be exhibiting at the trade show "JASIS 2026," which will be held at Makuhari Messe International Exhibition Hall. At this exhibition, manufacturers of analytical and scientific instruments will gather to showcase cutting-edge scientific and analytical systems and solutions. At our booth, we will display filter products for microbiological testing and environmental analysis, water quality testing products, pure and ultra-pure water production equipment, and culture-related equipment. Additionally, we will also showcase analytical balances from Mettler Toledo, along with equipment from other well-regarded manufacturers in the industry. Our sales and technical staff will be available to assist with product selection, so please feel free to stop by!

[Speakers] Nomura Research Institute, Ltd. Global Manufacturing Consulting Department Group Manager Hirokazu Shimo Senior Consultant Shoki Tokugawa Senior Consultant Wataru Hashimoto Consultant Masaaki Amano Consultant Tomoya Nakamura [Presentation Items] 1. Key Development Themes of Major OEMs 2. Development Approaches of Each OEM 2-1. Toyota 2-2. Tesla 2-3. Suzuki 2-4. Nissan 2-5. Honda 3. Development Approaches of Suppliers 4. Key Points for Strengthening Development Capabilities 5. Q&A / Business Card Exchange

[Speaker] Ayaka Motomura, Consultant, Business Transformation Unit, NTT Data Management Research Institute [Key Lecture Content] With the advancement of Physical AI, telecommunications carriers have the opportunity to evolve from being "companies that provide lines" to companies that connect and control AI and the physical world in real-time. This seminar will organize the changes in communication demand brought about by Physical AI and the business opportunities for telecommunications carriers, while explaining the role of AIOps as the first step towards entry. Furthermore, it will discuss strategies for monetizing in the Physical AI market by deploying the operational intelligence accumulated through AIOps to network APIs and industry-specific services, as well as the layers that telecommunications carriers should hold. [Lecture Topics] Chapter 1: The Competitive Structure of the "Real World" Rewritten by Physical AI Chapter 2: Reasons Why Opportunities for "Reversal" Arise for Telecommunications Carriers in the Era of Physical AI Chapter 3: The First Step Towards Physical AI Chapter 4: Shifting AIOps from "Defense" to "Offense" Chapter 5: The Layers to Hold in the Era of Physical AI [Q&A / Business Card Exchange]

[Instructor] Partner Ryoji Mori, Eichi Law Office [Key Lecture Content] This lecture will explain the revised Personal Information Protection Act of 2028. The three-year review this time is a major revision, and it is essential to first understand where and how the revisions have been made, as well as the overall picture of the amendments. Next, we will explain the individual amendments that are practically important. The key points are as follows, but it is important to note that both the strengthening and relaxation of obligations are occurring simultaneously, increasing overall complexity. At the time of the lecture, it is expected that subordinate laws and guidelines will not yet be published, but we will discuss points that require attention upon publication. We will distinguish between what is necessary across businesses and what varies by industry. [Lecture Items] 1. Expansion of consent exceptions: Relaxation of the difficulty of obtaining consent and expansion of academic research institutions 2. Statistical exceptions: System content and how to read complex provisions (plus learning about acceptability from controversies) 3. Strengthening regulations on biometric information and children's information: Caution required for age verification 4. Contactable personal-related information: Changes in external transmission responses 5. Review of outsourcing regulations: Addition and removal of obligations for contractors 6. Administrative fines: Narrow target range and low amounts (not worth fearing) 7. Q&A / Business card exchange

[Instructor] Innovation Analyst Andy Kondo [Key Lecture Content] *The latest content will be added (changed) as appropriate based on the on-site survey of IAA Transportation 2026.* From September 15 to 20, 2026, the largest commercial vehicle exhibition in Europe, IAA Transportation, will be held in Hanover, Germany. It is a gathering place for manufacturers of commercial vehicles such as trucks and buses, as well as the parts, energy, and software that support them, occurring every two years. The cost structure of logistics, urban transportation and the environment, energy transition, decarbonization efforts, and a microcosm of the industry will reveal the future business environment just a step ahead. In this seminar, an innovation analyst who has been observing major global exhibitions such as CES and Hannover Messe for many years will report shortly after the event based on on-site coverage. Has autonomous driving become the main focus in commercial vehicles? Where is the energy transition for large vehicles settling in terms of batteries, hydrogen, and alternative fuels? How far have Chinese companies come? Based on photos taken at the venue and observations of actual products, the seminar will delve into the implications for Japanese companies.