Product Presentation of PERFECTRON and INNODISK

Compact PC for machine, factory, and building automation.

Features ■ Width 391 × Height 65 × Depth 216 mm, 5.49 liters ■ Atom D2550 1.86GHz CPU, fanless operation ■ DDR3 800/1066MHz x 2 (maximum 4GB) ■ 2 x 2.5" SATA HDD/SSD ■ 2 x Mini PCIe expansion slots ■ Multi-display 1 x VGA, 1 x DVI-D ■ Extended temperature support -40 to 70℃ (UT) ■ Wide DC input 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation.

Features ■ Width 342 × Height 65 × Depth 216 mm, 4.8 liters ■ Atom D2550 1.86GHz CPU, fanless operation ■ DDR3 800/1066MHz x 2 (maximum 4GB) ■ 2 x Mini PCIe expansion slots ■ Multi-display 1 x VGA, 1 x DVI-D ■ Extended temperature range -40 to 70℃ (UT) ■ Wide DC input 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation

Features ■ Width 195 × Height 51 × Depth 230 mm, 2.29 liters ■ Atom N2800 1.86GHz CPU, fanless operation ■ DDR3 800/1066MHz x 1 (maximum 2GB) ■ 1 x Mini PCIe expansion slot ■ Extended temperature support -40 to 70℃ (optional) ■ Wide DC input 9V to 30V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation.

Features ■ Width 370 × Height 77 × Depth 240 mm, 6.84 liters ■ 3rd generation Core i7/i5/i3 CPU, fanless operation ■ DDR3 1333/1600MHz x 2 (up to 16GB) ■ 2 x 2.5" SATA HDD/SSD ■ 2 x Mini PCIe expansion slots ■ Multi-display: 1 x VGA, 1 x DVI-D, 1 x HDMI ■ Extended temperature range: -40 to 70℃ (UT) ■ Wide DC input: 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Compact PC for machine, factory, and building automation.

Features ■ Width 370 × Height 122 × Depth 246 mm, 11.1 liters ■ 3rd generation Core i7/i5/i3 CPU, fanless operation ■ DDR3 1333/1600MHz x 2 (up to 16GB) ■ 2 x 2.5" SATA HDD/SSD ■ 1 x Mini PCIe, 1 x PCI, 1 x PCIe[x1] expansion slots ■ Multi-display: 1 x VGA, 1 x DVI-D, 1 x HDMI ■ Extended temperature range -40 to 70℃ (UT) ■ Wide DC input 9V to 24V

• Industrial PCs
• Process Control System
• Other information systems

Mini-ITX motherboard equipped with Atom D2550 1.86GHz.

Features ■ Atom D2550 1.86GHz support ■ DDR3 800/1066 MHz SO-DIMM x 2 (up to 4GB) ■ Supports VGA, LVDS, DVI ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom D525 1.8GHz equipped, Mini-ITX motherboard

Features ■ Atom D525 1.8GHz support ■ DDR3 800/1066 MHz SO-DIMM x 1 (up to 4GB) ■ VGA + LVDS compatible ■ Extended temperature range -20 to 70℃ compatible

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Socket G2, Mini-ITX motherboard compatible with Core i7/i5/i3

Features ■ Supports 3rd Gen Core i7/i5/i3 ■ DDR3 1333/1600 MHz SO-DIMM x 2 (up to 16GB) ■ Supports VGA, LVDS, DVI, HDMI ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

LGA1155 Core i7/i5/i3 compatible Mini-ITX motherboard

Features ■ Supports 3rd Gen Core i7/i5/i3 ■ DDR3 1333/1600 MHz SO-DIMM x 2 (up to 16GB) ■ Supports VGA, LVDS, DVI, HDMI ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Socket G2, Mini-ITX motherboard compatible with Core i7/i5/i3

Features ■ Supports 3rd Gen Core i7/i5/i3 ■ DDR3 1333/1600 MHz SO-DIMM x 2 (up to 16GB) ■ Supports VGA, LVDS, DVI, HDMI ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom N2600 1.6GHz equipped, Mini-ITX motherboard

Features ■ Atom N2600 1.6GHz support ■ DDR3 800/1066 MHz SO-DIMM x 1 (maximum 2GB) ■ Supports VGA, DVI-D, LVDS ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

LGA1155 compatible with Core i7/i5/i3 CPUs, ATX motherboard

Features ■ Supports LGA1155 Core i7/i5/i3 CPUs ■ DDR3 1066/1333/1600MHz 240-pin DIMM x 4 (up to 32GB) ■ VGA, DVI-D, HDMI compatible ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

LGA1155 compatible with Xeon E3/Core i3, ATX motherboard

Features ■ Supports LGA1155 Xeon E3/Core i3/Pentium CPUs ■ DDR3 1066/1333/1600MHz 240-pin ECC/Non-ECC DIMM x 4 (up to 32GB) ■ Supports VGA, DVI-D, HDMI ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU equipped, 3.5" CPU board

Features ■ Equipped with 3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU ■ DDR3 1333/1600MHz 204-pin SO-DIMM x 1 (up to 8GB) ■ Supports VGA, LVDS, DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU equipped, 3.5" CPU board

Features ■ Equipped with 3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU ■ DDR3 1333/1600MHz 204-pin SO-DIMM x 1 (up to 8GB) ■ Supports VGA, LVDS, DVI-I ■ Operating temperature range -40 to 85℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

StackPC Carrier Board EPIC Form Factor

Features ■Supported Module: StackPC ■VGA + DisplayPort ■Extended Temperature Range: -40 to 85℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom N455 CPU equipped, StackPC CPU board

Features ■ Equipped with Atom N455 1.66GHz CPU ■ 1 x DDR3 800MHz DIMM (up to 2GB) ■ VGA + LVDS ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom D525 CPU equipped, StackPC CPU board

Features ■ Equipped with Atom D525 1.8GHz CPU ■ 1 x DDR3 800MHz DIMM (up to 4GB) ■ VGA + LVDS ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Third generation Core i7/i3 CPU equipped, StackPC CPU board

Features ■ Equipped with 3rd generation Core i7/i3 CPU ■ 2 x DDR3 1333/1600MHz XR-DIMM with ECC (up to 8GB) ■ VGA + LVDS ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom N2600 1.6GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom N2600 1.6GHz CPU ■ DDR3 800/1066MHz 204-pin SO-DIMM x 1 (maximum 4GB) ■ Supports LVDS and DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom D2550 1.86 GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom D2550 1.86GHz CPU ■ DDR3 800/1066MHz 204-pin SO-DIMM x 1 (up to 4GB) ■ Supports VGA, LVDS, DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom N2800 1.86GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom N2800 1.86GHz CPU ■ DDR3 800/1066MHz 204-pin SO-DIMM x 1 (up to 4GB) ■ Supports LVDS and DVI-I ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom E620T 600MHz CPU equipped, 3.5" CPU board

Features ■ Equipped with Atom E620T 600MHz CPU ■ 512MB DDR2 667/800MHz ■ Supports LVDS and VGA ■ Extended temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom E660T 1.3GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom E660T 1.3GHz CPU ■ 1GB DDR2 667/800MHz installed ■ Supports LVDS and VGA ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom N455 1.66GHz CPU, 3.5" CPU board

Features ■ Equipped with Atom N455 1.66GHz CPU ■ 1 x 204-pin DDR3 800MHz (up to 2GB) ■ Supports LVDS and VGA ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with Atom D525 1.8GHz CPU, 3.5" CPU board.

Features ■ Equipped with Atom D525 1.8GHz CPU ■ 1 x 204-pin DDR3 800MHz (up to 4GB) ■ Supports LVDS and VGA ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with 3rd generation Core i7/i5/i3 CPU, COM Express Type 6

Features ■ Equipped with 3rd generation Core i7/i5/i3 CPU ■ 4GB DDR3 1600MHz IC onboard ■ Supports 3 DDI ports: HDMI/DP/SDVO/DVI ■ Extended temperature range: -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Equipped with 4th generation Core i7/i5/i3 CPU, EBX board

Features ■ Equipped with Core i7-4700EQ / Core i5-4400E / Core i3-4102E / Celeron 2000E CPU ■ 1 x XR-DIMM DDR3 1600MHz (up to 8GB) ■ Supports VGA, LVDS, 2 x DP ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

Atom E3845 / E3815 CPU equipped, EPIC CPU board

Features ■ Equipped with Atom E3845 (1.91GHz, 10W) / E3815 (1.46GHz, 5W) CPU ■ 1 x XR-DIMM DDR3 1600MHz (up to 4GB) ■ 32GB NAND Drive ■ Supports VGA, LVDS, 2 x DP ■ Operating temperature range -20 to 70℃

• Evaluation Board
• Industrial PCs
• Embedded Board Computers

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Notice of participation in the "FOOD Expo 2026." 【Date and Time】 　November 11 (Wednesday) - 13 (Friday), 2026 　Opening hours: 10:00 AM - 5:00 PM 【Venue】 　Tokyo Big Sight 　East Hall 2, Booth Number B-36 【Exhibits】 　Cardboard insulated boxes 　Craft cooler cubes 　Vacuum insulated panel 　Pallet cubes

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange