Information on Exhibiting at CEATEC JAPAN 2016

Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.

Samsung Diamond Industrial's "Scribe & Break Method" is a technology for cutting and processing device substrates that have metal films or silicone resins laminated onto materials such as glass, alumina (Al2O3), silicon carbide (SiC), sapphire, and silicon (Si). With the unique "Scribe & Break" technology, it achieves zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also allowing for cost reduction since no water is used. 【Features】 ■ Stable and high-speed cutting is possible for many materials! ■ High precision and quality cutting enables reduction of street width and accommodates small sizes! ■ Compatible with various semiconductor/electronic component processing! ■ Supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.

• LCD display
• Wafer
• Fine Ceramics

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

Nitto Kohki will be exhibiting at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

In this seminar, we will clearly introduce "how to organize a complicated IT infrastructure and envision the future" by incorporating specific processes and examples of IT infrastructure planning. It is designed for IT department heads who feel challenges with the current state of their IT infrastructure, allowing them to envision it in the context of their own environment. <Program> - Opening - What is the upstream process of IT infrastructure? - Thinking together about the future of IT infrastructure - Upstream process of IT infrastructure - Q&A <Recommended for> - IT department heads who make decisions on the implementation of IT infrastructure *Applications from competing companies may be declined.

[Speaker] Kenji Kikuchi, Executive Fellow, MDB Business Division, Japan Management Association Research Institute [Lecture Topics] 1. Important latest research trends to consider for the future 2. Latest business information gathering methods for future insights 3. Case studies on information gathering - perspectives on information collection and utilization 4. "Future insights" perspectives that leaders and personnel responsible for expanding existing businesses, new businesses, new product development, and exploring new applications should know 5. Introduction of the latest business information sources to pay attention to in the AI era for "future insights" 6. Q&A / Business card exchange