High-speed cutting with zero coolant! Dry processing scribe and break method.

Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.

Samsung Diamond Industrial's "Scribe & Break Method" is a technology for cutting and processing device substrates that have metal films or silicone resins laminated onto materials such as glass, alumina (Al2O3), silicon carbide (SiC), sapphire, and silicon (Si). With the unique "Scribe & Break" technology, it achieves zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also allowing for cost reduction since no water is used. 【Features】 ■ Stable and high-speed cutting is possible for many materials! ■ High precision and quality cutting enables reduction of street width and accommodates small sizes! ■ Compatible with various semiconductor/electronic component processing! ■ Supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.

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