Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.
Samsung Diamond Industrial's "Scribe & Break Method" is a technology for cutting and processing device substrates that have metal films or silicone resins laminated onto materials such as glass, alumina (Al2O3), silicon carbide (SiC), sapphire, and silicon (Si). With the unique "Scribe & Break" technology, it achieves zero kerf loss, high speed, high quality, and completely dry processing. This leads to increased product yield and reduced tact time, enhancing productivity, while also allowing for cost reduction since no water is used. 【Features】 ■ Stable and high-speed cutting is possible for many materials! ■ High precision and quality cutting enables reduction of street width and accommodates small sizes! ■ Compatible with various semiconductor/electronic component processing! ■ Supports multilayer composite materials! We propose the optimal processing methods based on years of accumulated know-how and theoretical simulations. *For more details, please download the catalog or contact us directly.
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basic information
In the scribing process, minimal surface treatment is applied to the planned separation line to create vertical cracks. It can accommodate both mechanical tool processing, such as with wheels, and laser processing. In the breaking process, the backside of the scribe line is accurately and rapidly pressed with a break blade to extend the vertical cracks and achieve complete separation. ■ MDI's original tools ensure long life The ceramic tools developed with proprietary technology secure a scribing distance of over 1000 meters on hard alumina substrates. ■ MDI's special scribing function addresses substrate distortion It accommodates substrates that warp during firing processes, such as LTCC. It can follow distortions of 0.5 mm with a high precision of ±30 μm for scribing. *For more details, please download the catalog or contact us directly.
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We support cutting processing of various semiconductors/electronic components. *For more details, please refer to the catalog.
Detailed information
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MDI Original Tool Ceramic tool capable of scribing over 1000m
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Samsung Diamond Industrial is a manufacturer of processing equipment that provides optimal process conditions using original cutting edges and laser oscillators for processing methods such as scribing, breaking, drilling, and patterning, along with automated devices that achieve high productivity. Since its establishment in 1935, the company has utilized its "high-quality cutting technology for various types of glass" to offer processing processes, equipment, and tools that can handle "all kinds of hard and brittle materials, as well as multilayer structures that include metals and organic materials." With solutions backed by theory and proven results, we aim to be a reliable "one-and-only partner" for our customers. Please feel free to contact us.
