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  4. Free Seminar for Embedded Software Developers
SEMINAR_EVENT
  • Feb 21, 2017
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Feb 21, 2017

Free Seminar for Embedded Software Developers

アイ・エル・シー アイ・エル・シー
You will gain an understanding of our products through an introduction to the embedded development solutions unique to ILC. We will explain the basic usage of ILC's embedded development support tools, how to create applications, and how to port them to target boards. We will provide detailed on-site support to ensure that your embedded application development proceeds smoothly. The instructors will be staff from ILC's development team. The seminar will be held in Tokyo and Nagoya, but if you would like it to be held in another location (including your company's premises), please contact ILC. Products being introduced: - GUI software development (GENWARE series) - Control software development (INTALOGIC) - Improving the efficiency of embedded software testing (Real-Series)
Free seminar for embedded software developers
Free seminar for embedded software developers
Date and time Monday, Feb 27, 2017 ~ Tuesday, May 30, 2017
01:00 PM ~ 05:30 PM
Held every Monday and Tuesday. If the minimum number of participants is not reached two weeks before the start of the course, it may be canceled due to unavoidable circumstances.
Capital Tokyo Venue: ILC Tokyo Headquarters 2-3-2 Marunouchi, Chiyoda-ku, Tokyo, Yusen Building 7F TEL: 03-3287-7700 FAX: 03-3287-3999 Event Dates: Every 2nd Monday, Tuesday, and 4th Monday, Tuesday of the month Nagoya Venue: ILC Nagoya Office 3-1-18 Taiko, Nakamura-ku, Nagoya, Nagoya KS Building 6F TEL: 052-452-7700 FAX: 052-453-4400 Event Dates: Every 1st Monday, Tuesday, and 3rd Monday, Tuesday of the month
Entry fee Free
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GENWARE3イメージ.jpg

Embedded GUI Integrated Development Environment GENWARE3

Achieving astonishing embedded efficiency improvements in embedded GUI development across all fields.

GENWARE3 is an integrated development environment for embedded GUI development that achieves remarkable efficiency improvements across all fields, from information appliances to industrial equipment. It provides a consistent development environment for all GUI development processes, from design and specification design to debugging. GENWARE3 thoroughly automates unnecessary tasks between each stage. For example, it allows for the automatic import of Flash/Photoshop data via drag and drop. This eliminates the need for designers to create UI specifications and manually place bitmap images based on those specifications. Additionally, by combining the import of screen transition diagrams created in Visio with a GUI scenario function that allows GUI operations to be created with just mouse actions, prototype development can be easily conducted. Furthermore, the created data can be converted into C/C++ source code, allowing for a seamless transition from prototype development to full-scale product development. With GENWARE3, GUI development can be conducted on a PC in the same environment as the actual device (such as fonts and colors), enabling verification of the GUI application's operation before transitioning to the actual device.

  • Development support tools (ICE, emulators, debuggers, etc.)
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G4_01.jpg

Embedded GUI Integrated Development Environment GENWARE4

New version of the embedded GUI integrated development environment GENWARE series! Supports the latest GUI features such as OpenVG and touch UI!

This is the latest version of the GENWARE series, an integrated development environment for embedded GUI. In addition to the features of GENWARE3, which has been well-received, enhancements have been made to create even higher quality GUIs, including controls compatible with OpenVG, the ability to import vector images created with Adobe Illustrator, and a list control (sample) that supports touch UI.

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INTALOGICイメージ.jpg

Software PLC INTALOGIC

Software PLC INTALOGIC

INTALOGIC is a software PLC that can be easily integrated into various control devices without depending on hardware or OS. It allows for the simple and cost-effective development of high-value-added user-specific control systems and units. Since INTALOGIC operates on a microcontroller board, it enables miniaturization of devices. Customization for I/O processing and point counts is also possible. The development language for INTALOGIC is ladder language, which is commonly used in control systems (compliant with IEC61131-3). In C language microcontroller program development, changes in specifications can lead to a lot of work, including program modifications, compilation, and writing to ROM. However, with INTALOGIC, you can easily respond to changes by simply modifying the ladder program and transferring it to the target. Additionally, INTALOGIC allows for the simulation of created ladder programs on a computer, enabling parallel development of hardware and control programs, which significantly shortens the development lead time. (PLC: Programmable Logic Controller)

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Real-Seriesイメージ.jpg

Embedded Software Development Support Package Group Real-Series

Embedded Software Development Support Package Group Real-Series

Real-Series is a truly usable embedded software development support package that allows for easy and compact implementation of state transition design models. It significantly reduces the development effort for embedded software. Real-Series can be utilized without stress from the creation of design documents in the upstream development process to coding and debugging in the downstream process. With Real-Series, source code is automatically generated from the state transition table (design document), allowing development to continue using Real-Series right up until just before product shipment. Even for bug fixes just before shipment, it is easy to return to the design level using the tool, preventing major failures such as hastily modifying source code and causing degradation. Additionally, Real-Series generates only the framework for state transitions during source code generation, which shortens source code generation time and ensures high readability of the source code. In Real-Series, various simple and repetitive tasks during debugging can be automated using features like automatic coverage, and debugging operation recording and playback, significantly improving debugging efficiency.

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Related catalog(4)

Embedded GUI Integrated Development Environment GENWARE3

Embedded GUI Integrated Development Environment GENWARE3

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Embedded GUI Integrated Development Environment GENWARE4

Embedded GUI Integrated Development Environment GENWARE4

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Software PLC INTALOGIC

Software PLC INTALOGIC

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Embedded Software Development Support Package Group Real-Series

Embedded Software Development Support Package Group Real-Series

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

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Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

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  • SEMINAR_EVENT

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

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  • SEMINAR_EVENT

Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

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  • SEMINAR_EVENT

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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