[New Product Announcement] Thermal Conductive Hot Melt TC50

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

• Other electronic parts
• Processing Contract
• Coating Agent

Waterproofing, insulation, and dustproofing for electrical components! We are currently offering a free collection of 'case studies and technical materials' filled with tips and know-how for process improvement!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! 'Hot Melt Molding' is a groundbreaking new technology for waterproof processing of circuit boards and electronic components that significantly reduces processing time compared to traditional methods. The sealing agent is primarily made from natural fatty acids derived from grains, making it excellent for sustainability. Our case study collection includes numerous examples where switching from potting to hot melt molding has led to reduced processing time and cost savings. Technical materials provide know-how on hot melt molding and waterproof processing of circuit boards and electronic components, including comparisons and benefits over traditional methods. ■ Currently, we are offering three types of case studies and two types of technical materials as a free gift ■ [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Materials (10 pages) ■ [Technical Material] Achieving VA by Switching from Potting (7 pages, 3 cases) * Please view the 'Hot Melt Molding Case Study Collection & Technical Materials' PDF available for download.

• Other electronic parts
• Processing Contract
• Coating Agent

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.

Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*

• Other electronic parts
• Processing Contract
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Features: ● Equipped with Intel Core Ultra 9 285H/7 255H/5 225H ● DDR5 SODIMM x 2 (up to 128G) (sold separately) ● VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 4 ● PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] ● 2.5GbE x 1 ● COMe Type6 standard, 95mm x 95mm size ● Operating temperature -20~70℃ ● Sold separately ECB-920A: Development carrier board COM-MTHC6-FAN01: CPU fan COM-MTHC6-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Processor: Qualcomm QCS6490 with Arm Cortex-A78 ×4 + Cortex-A55 ×4 (Octa-core) up to 2.7GHz ● LPDDR5 onboard memory (up to 8GB) ● Display: MIPI-DSI (4 lanes) ×1, DisplayPort ×1 ● USB 2.0 ×4 (one port supports OTG), Gigabit Ethernet ×2

In civil engineering sites during extreme heat, the surface temperature of the ground plates and the heat reflection significantly affect the working environment. In particular, steel plates tend to retain heat when exposed to sunlight, posing challenges for workers' heatstroke prevention and safety management. Hyper CLT ground plates are civil engineering materials utilizing wood CLT. As wooden ground plates, they can be used for temporary roads, access routes, heavy machinery work yards, material storage areas, and pedestrian pathways, making them a versatile alternative to steel plates in various civil engineering sites. In actual sites, there are cases where the surface temperature differs by about 20 degrees compared to steel plates, making them effective as a solution for heat prevention and reflection suppression. The 5×10 plate weighs approximately 230 kg, and the 5×20 plate weighs about 460 kg, making them lightweight and easy to handle even with small machinery, which helps reduce the burden of transportation, installation, and removal. They are materials that easily promote noise reduction, CO2 fixation, and environmental consideration unique to wood. Registered as a Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A," they can also be utilized for creative ideas and safety measures in public works. They are recommended for companies looking to reassess the summer site environment. We also accept inquiries for consultations and requests for materials tailored to site conditions. We can propose solutions for temporary plans during summer for both public and private civil engineering projects. Please feel free to consult with us.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs often change the base material around the crack due to heat, leading to residual stress and deformation, which constantly carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.