Advanced Design Technology (ADT) boasts some of the world's leading technology and achievements.

Improved processing efficiency. Dicing processing with high precision and low cost. Excellent operability.

The ADT-made "8020 Series" is a fully automatic dicing machine capable of cutting semiconductor wafers with a diameter of up to 8 inches with high precision and low cost. With twin spindles arranged to face each other, simultaneous dicing is possible, contributing to high processing efficiency. It features two touch screens for the main display and maintenance, equipped with an intuitive user interface for easy operation. 【Features】 - Supports hub/hubless blades up to 3" O.D. - High-power spindles of 1.8kW or 2.4kW - Excellent vision system with continuous zoom - Improved throughput with high-speed automatic alignment and cutting positioning *For more details, please refer to the materials. Feel free to contact us as well.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Fast, easy, and user-friendly! A dicing sheet applicator compatible with all standard tapes.

The "967 Wafer Mounting Machine" is a compact tabletop semi-automatic die-cutting sheet mounting device. It does not require pre-cut tape and is compatible with all standard tapes. Compared to manual mounting, it saves 25% of tape usage. Additionally, it displays the working mode and alarms on an LCD, ensuring high quality and high reliability. 【Features】 ■ Procedure management and hands-free operation ■ No bubbles ■ Tabletop design ■ Roller pressure adjustment ■ Compatible with all die-cutting tapes up to 8 inches ■ Fast, easy, and user-friendly *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer
• others

Solve the water problem of dicing water! Reduce industrial waste and operating costs!

The "AR-927 Water Recycling Device" is a dicing water recycling system that solves the water issues associated with dicing water. It guarantees suitable water quality, temperature, and volume, achieving a reduction in water consumption. Additionally, it reduces industrial waste and operational costs, and offers options such as pure water modules and UV cleaning. 【Features】 ■ Reduction of water consumption ■ Guarantee of suitable water quality, temperature, and volume ■ Reduction of industrial waste ■ Reduction of operational costs *For more details, please refer to the PDF document or feel free to contact us.

• Water treatment equipment
• Other water treatment equipment

Constantly exposing diamonds through self-grinding! Excellent cutting ability to handle hard and brittle materials.

The "Resin Bond Blade" is a dicing blade composed of abrasives embedded in a resin bond base. The blade's edge continuously exposes new diamonds, and the speed is controlled to keep the edge sharp, achieving highly accurate cuts with remarkable yield and long blade life. It is suitable for hard and brittle materials such as alumina, glass, and quartz. 【Features】 ■ Self-sharpening base that exposes diamonds ■ Excellent cutting performance ■ Base suitable for hard, durable, and complex materials ■ Highly precise dicing ■ Attractive ownership cost *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

A soft material and a hard material that undergoes machining! A long-lasting blade with excellent wear resistance.

The "Nickel Bond Blade" is a dicing blade composed of an abrasive embedded in a nickel bond substrate. It is manufactured using an artistically controlled electronic forming process, ensuring that diamonds are uniformly distributed throughout the nickel layer. This process not only allows the blade to be manufactured with extremely tight tolerances but also enables customization to meet specific customer requirements regarding particle size, hardness, and distribution. 【Features】 ■ Excellent wear resistance with a hard binder ■ Extremely thin blades (down to .0008”) ■ Outstanding durability against high exposure ■ Highly precise dicing ■ Exceptional blade longevity *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

From development to mass production! Increased productivity through efficient wafer transport and rapid, precise alignment!

The "7220 Series" is a space-saving fully automated device that widely offers advanced automation and process monitoring mechanisms that meet the productivity and quality required for challenging dicing. Starting with efficient wafer transport systems for streamlined operations, it enhances productivity by shortening height measurement time through rapid and accurate alignment and a blade wear prediction algorithm. In addition to automatic blade sharpening with a dedicated dress cassette, it also excels in operability with a touch panel display. 【Features】 ■ Streamlined operations with efficient wafer transport systems ■ Rapid and accurate alignment with continuous digital image magnification devices ■ Reduced height measurement time with blade wear prediction algorithms ■ Excellent process results with spray-type wafer cleaning technology ■ Quality assessment during the process with built-in inspection trays *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Publication on new features and enhancements related to the Dicing Saw 7120/7130 series.

This document introduces the automatic dicing machines of the '7120/7130 series'. We offer the standard model "Dicing Saw 7120 Series" with a stroke of up to 8 inches, and the standard model "Dicing Saw 7130 Series" with a stroke of up to 12 inches. It includes improvements to the hardware from the "old version 7100," which has been on the market for over 10 years, as well as new software features and enhancements. [Contents] ■ Model ■ Hardware Improvements ■ Low Vibration Spindle ■ New Software Features ■ Software Enhancements *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Highly adaptable to soft and hard materials! A long-lasting dicing blade based on metal.

The "Metal Sintered Dicing Blade" is a dicing blade composed of abrasives embedded in a metal substrate. Through a unique closed mold sintering process, the particle size of the diamond, the density of the diamond, and the metal binder are optimized to meet specific application precision and blade lifespan according to needs. The metal binder provides an extremely stable, stress-free substrate, and can be customized to meet the hardness and load resistance required for various dicing applications. 【Features】 ■ Various substrates for a wide range of applications ■ Low wear and long blade lifespan ■ High precision in blade dimensions ■ High precision in dicing ■ Attractive ownership cost *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Optimize dicing time! A single spindle that contributes to yield improvement and cost reduction!

The "7900 Uno" is an automatic, single-spindle dicing device. The "model 7910" consists of a 2" spindle and an 8" size. It features an easy-to-use, intuitive, GUI-based touch screen. It has a small installation footprint, is compact, and easy to maintain. In addition to performing cutting surface inspection, quality analysis, process data collection, and statistical analysis, it also has compatibility technology with the 7900 dual spindle device. 【Features】 ■ Low ownership costs ■ Small installation footprint and compact ■ High reliability and high precision ■ Optimization of dicing time ■ Yield improvement and cost reduction functions *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Simultaneous dicing with two spindles facing each other! A high-performance device that doubles productivity!

The "7900 Duo" is a dicing saw equipped with two opposing spindles that simultaneously dice wafers, doubling productivity. The dicing saw is fixed to the front-mounted spindle, eliminating the effects of heat and preventing misalignment of the cut position, which ultimately increases yield. Additionally, by combining a small footprint with high productivity and automation, it reduces costs, leading to a decrease in ownership costs and, consequently, a reduction in cost per product. 【Features】 ■ Simultaneous dicing with two opposing spindles ■ Low vibration base ■ Improved productivity with quick automatic alignment and cut positioning ■ Reduced ownership costs with a small footprint *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Quickly convert any angle from 0° to 15°! Equipped with an inclined spindle function!

The "7100 Series proVectus Dicing System" is a device designed with an inclined spindle function that allows for vertical cutting of optical electronic materials while also enabling adjustment for inclined dicing within a range of 0° to 15° within a few minutes thereafter. Thanks to an overall process solution specifically developed for blades, dicing parameters, and your company's components, it provides excellent adjustment of spindle angles, resulting in highly accurate inclined cuts and surface finishes. The quality of these cuts is high, significantly reducing the need for additional polishing, although it does not completely eliminate it. It is designed to meet the needs of optical electronic component manufacturers. 【Features】 ■ Quick conversion to any angle from vertical (0°) to 15° ■ Dedicated operating station with programmable angle settings for both angles ■ Field adjustment capability ■ Angle reproducibility of 0.1° ■ Resolution of 0.1° *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Applicable to glass plates and PCBs! Large panel dicing up to 24" × 18"!

The "ATD Model 7100 XLA" is a large panel dicing machine that accommodates sizes up to 24"×18". The chuck is customizable for user specifications and can support both clamped and unclamped options, as well as processing with or without tape. Loading and unloading are easy, and maintenance can be performed with ease. The monitor is adjustable and rotatable, and it comes with a USB hub. 【Features】 ■ Large panel size up to 24"×18" ■ Applications: Glass plates, PCBs, copper-clad FR4, QFN, etc. ■ Customizable chuck for user specifications ■ Supports clamped and unclamped options ■ Processing with or without tape *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Solving the issues of dicing! Contributing to productivity improvement through advanced process technology.

The "7120/7130 series" is a low-vibration spindle device available in 2" and 4" sizes, providing satisfactory usability and flexibility in response to your requirements. The turntable features high torque and high precision (1 micron). It has a long travel distance on the X-axis, making loading and unloading easy. Additionally, thanks to a unique algorithm, it can predict blade wear rates based on average blade consumption time, reducing wear rates to one-third of traditional methods and increasing production per hour. 【Features】 ■ Multiple panel dicing ■ Equipped with a high-resolution camera (2000×2000 pixels) ■ Easy loading and unloading ■ Easy maintenance ■ Supports customer-specific process specifications *For more details, please refer to the PDF materials or feel free to contact us.

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Reduced tape usage compared to manual methods! A precise dicing sheet applicator that prevents air bubbles.

The Japanese technology industry's "Wafer Mounter" is a compact tabletop semi-automatic die-cut sheet mounting machine. It is compatible with all standard tapes and does not require pre-cut tape. Compared to manual mounting, it uses only 25% of the tape, making it economical. Despite its minimal footprint tabletop design, it boasts accurate sequencing without air bubbles. 【Features】 ■ Procedure management and hands-free operation ■ No air bubbles ■ Minimal footprint, tabletop design ■ Adjustable roller pressure ■ Compatible with all standard tapes *For more details, please refer to the PDF document or feel free to contact us.

• Sealing machine

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

The wooden lightweight sheet "Hyper CLT Sheet," utilizing CLT (Cross Laminated Timber), is a sponsor of the Masters Koshien (Okayama). The Masters Koshien is where those who have experienced high school baseball come together across generations to pursue their goals once again. We resonate with their "attitude of continuing to challenge" and support their activities from Okayama. The Hyper CLT Sheet is a product created to provide a new option in civil engineering sites, which have primarily relied on steel sheets until now. It is lightweight, easy to handle, and features the environmental value unique to wood. Furthermore, it is registered as a **Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A,"** aiming for widespread adoption in various sites, starting with public works. Wood, NETIS, civil engineering, CLT, wooden lightweight sheets. We will continue to support challenges in both the field and sports from Okayama. Masters Koshien (Okayama) https://masters-okayama.com/

Features: ● Intel Core Ultra (Series 2) processor LGA 1851 socket (CPU sold separately) ● DDR5 6400MT/s dual-channel support, CU/U-DIMM x2 (up to 128GB) (memory sold separately) ● M.2 M-Key x1, E-Key x1 ● USB 3.2 x4, USB 2.0 x8 ● Intel Ethernet Controller I226-V (2.5GbE) x2 ● SATA 6Gb/s x2 (supports RAID 0 / 1 / 5) ● PCI Express Gen5 x16 x1, PCI Express Gen4 x4 x1, PCI Express Gen4 x1 x1 * This model does not include memory, storage, or OS.

Features: ● Intel Core Ultra 200S series processor LGA 1851 socket (up to 125W) (CPU sold separately) ● DDR5 6400MT/s dual-channel compatible, CU-DIMM/U-DIMM x4 (up to 256GB) (sold separately) ● M.2 M-Key x2, E-Key x1, B-Key x1 ● USB 3.2 x8, USB 2.0 x6 ● 2.5GbE LAN x3 ● SATA 6Gb/s x2 (supports RAID 0 / 1 / 5) ● PCIe Gen5 x16 x1, PCIe Gen4 x4 x2, PCIe Gen4 x1 x1 ● Compatible with ATX power supply * This model does not include memory, storage, or OS.

Features: ● Supports Intel Core Ultra 200S series processors with Intel H810 chipset and LGA1851 socket (up to 125W) (CPU sold separately) ● DDR5 CSO-DIMM x2 (up to 128GB) (memory sold separately) ● 2.5GbE LAN x2 ● HDMI x2, DisplayPort x1, LVDS/eDP x1 (supports simultaneous output of up to 3 screens) ● SATA 6Gb/s x4, M.2 M-Key x1, M.2 E-Key x1, M.2 B-Key x1, PCI Express Gen5 x16 x1 ● USB 3.2 Gen2 x2, USB 2.0 x8, RS-232/422/485 x1, RS-232 x5 ● Compatible with ATX power supply * This model does not include memory, storage, or OS.