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  4. [9/4 Osaka] Advantech Design-In Forum 2018
SEMINAR_EVENT
  • Aug 07, 2018
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Aug 07, 2018

[9/4 Osaka] Advantech Design-In Forum 2018

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This year's forum will feature speakers from key players in the IoT field, such as Microsoft Japan and Arm, who will present on themes centered around edge x cloud. Additionally, the program will include a more luxurious lineup than in previous years, showcasing various solution-ready packages (SRP) utilizing Advantech's latest edge computing solutions across different verticals. Advantech Design-In Forum (ADF) 2018 Event Overview [Osaka Venue] Date and Time: September 4, 2018 (Tuesday) 13:15 - 18:00 (Registration and Exhibition: 12:00 -) Venue: Grand Front Osaka Knowledge Capital https://kc-space.jp/accessmap/conference/ Capacity: 100 people Participation Fee: Free Contact: Advantech ADF Secretariat Phone: 0800-500-1055 (Toll-Free) Email: ajp_marcom@advantech.com
Date and time Tuesday, Sep 04, 2018
01:00 PM ~ 07:00 PM
Capital Venue: Grand Front Osaka Knowledge Capital
Entry fee Free
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EIS-DK10 1 20161201153212.jpg

Edge Intelligence Starter Kit【EIS-DK10】

Delivering everything needed for industrial IoT in one package. Start IoT immediately.

A one-package solution that includes the necessary edge systems for IoT, IoT software platform services (WISE-PaaS), wireless I/O modules, sensors, and pre-configured Microsoft Azure services. Suitable for creating POCs for IoT application development, such as predictive maintenance applications for factories.

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MIO-5272.jpg

3.5-inch Single Board Computer SBC [MIO-5272]

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer ● Supports Intel 6th Generation Core U Series (i7/i5/i3/Celeron), 2 x DDR3L-1600/1333 SODIMM with a maximum of 16 GB ● DirectX 11.3, OpenGL 4.4, OpenCL 2.1, supports independent display of 3 screens: VGA + LVDS + HDMI ● Flexible design using integrated multiple I/O: MIOe expansion allows for designs suitable for specific market applications and retention of proprietary know-how ● 2x Gigabit Ethernet, HD Audio, rich I/O interfaces (2 COM, 2 SATA, SMBus/I2C, GPIO, 2 Full-size Mini PCIe (one with mSATA), 4 USB 2.0, 2 USB 3.0, and TPM 2.0) ● Intel AMT 11.0, WISE-PaaS/RMM, and embedded software API

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ARK-3520P.jpg

6th Generation Intel Core Industrial Embedded PC ARK-3520P

"Fanless | Rugged | Abundant I/O" 3 independent screen displays | Wide range: 9~36V | -40 to 85℃ | VGA/HDMI

Advantech's ARK series adopts a modular design that can meet various customer requirements for industrial embedded IoT applications, offering not only I/O customization but also innovative software packages that include cloud and AI analytics suites. 【Key Features of This Product】 ◆ Equipped with 6th generation Intel Core i3/i5/i7 processors ◆ Three independent display outputs: VGA + HDMI + optional display ◆ DDR4 SO-DIMM memory (up to 32 GB) ◆ Flexible expandability via PCI/PCIe x 4 ◆ Wide range input power supply of 9-36V ◆ Diverse I/O with 6x high-speed USB 3.0 and 8x COM ports ◆ 2x removable 2.5-inch HDD drive bays ◆ Compatible with Advantech iDoor modules

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  • Embedded Board Computers

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ARK-1124C%20Double_Front%20left%20_S2017112715343220180110101043.jpg

Intel Celeron Small Industrial Embedded PC ARK-1124C

Fanless | Ultra-compact | Rugged | Abundant I/O Mini-PCIe | 4 COM | 12~24V | -20 to 60°C | VGA

Advantech's fanless embedded computer ARK series features a highly durable chassis with IP40 dust protection, 5G vibration resistance, and 50G shock resistance, along with an extended MTBF (Mean Time Between Failures). This series has obtained various safety certifications, including CE, FCC, CCC, UL, BSMI, and CB, allowing it to be sold in countries that enforce strict safety standards. 【Main Features of the Product】 ◆ Intel Celeron N3350 Dual-Core SoC ◆ VGA display, 4x RS-232/422/485, 2 x USB3.0 ◆ 1x full-size mini PCIe for communication modules ◆ 1 x 2.5-inch SATA III SSD/HDD, 1 x half-size mSATA ◆ Wide temperature range: -20 to 60℃ ◆ Lockable 12V DC input power supply ◆ 12-24V power module (optional) ◆ Advantech iDoor compatible two-layer module ◆ Compatible with Advantech WISE-PaaS/RMM

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AIMB-275.jpg

Mini-ITX Motherboard [AIMB-275]

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151.

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151 ● OS: Compatible with WindowsR 10 IoT ● Equipped with Intel Q170 / H110 chipset, supports 7th & 6th generation IntelR Core i processors (LGA1151) ● 260-pin SO-DIMM x2, maximum 32GB DDR4 2133 MHz SDRAM ● Supports triple display via VGA / DP / HDMI / LVDS (eDP) ● Supports PCIe x16 (3rd generation), 1 F/S miniPCIe, 1 M.2 (NGFF), 6 USB 3.0, and 3 SATA III ● Compatible with a wide range of 12V-24V DC input ● Supports Intel vPro, AMT 11.0, PECI 3.0, software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional) ● Supports WISE-PaaS/RMMlR and embedded software API

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EPC-S201_Front IO _S20180521175110.jpg

Fanless Embedded Single Board Computer [EPC-S201]

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System - Intel Atom N3350 Dual-Core SoC - Semi-industrial fanless slim system, DIN rail or wall mount design - VGA display, COM port, USB 3.0 x2, LAN x1 on the front - DIO port x1, COM port x1 on the side - Compatible with Advantech WISE-PaaS/RMM

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MIO-5391.jpg

3.5-inch Single Board Computer SBC [MIO-5391]

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

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  • Embedded Board Computers

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[WEB Seminar] Inheriting Technology: How to Create Work Instructions

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**Seminar Points** Improvement means changing standards for the better. There can be no improvement where there are no standards. If there are no standards, start by creating them. Standards are "rules." What to decide are "procedures," "methods," and "timing." This seminar is focused on determining "procedures" and creating "work instruction documents." **"Without standards, there is no improvement" — Learning from Toyota's teachings on documentation in the workplace** The source of Toyota's strength lies in the concepts of "improvement" and "standardization." At the core of this is a culture of making insights and skills visible in the workplace and documenting them. In other words, it is a system of knowledge transfer through documentation. Relying on the experience and intuition of veterans can be a strength in the workplace, but it also carries the risk that quality may change when people change. By ensuring that everyone performs tasks in the same way, we can achieve the same quality products (good products) in the same amount of time. First and foremost, the development of "work instruction documents" is essential. When presenting work instruction documents in video format, it is also a prerequisite that this "foundational document" is well established. *For more details, please download the PDF or contact us.*

Sep 08, 2026

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Notice of Participation in the Livestock Industry Materials EXPO

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We will be exhibiting at the "Livestock Materials EXPO" held at Makuhari Messe! We plan to showcase examples of our "Fermentation Drying Equipment for Livestock Manure," provide information on our "Composting Equipment and Deodorants," and introduce our "Subsidy Projects." Please feel free to stop by our booth. We will give a small gift to those who fill out our survey or have implemented our composting system! We look forward to meeting everyone. = Exhibition Information = Dates: October 1 (Wednesday) to October 3 (Friday), 2025, for three days from 10:00 to 17:00 Venue: Makuhari Messe, Halls 5-7, 9, and 10 2-1 Nakase, Mihama-ku, Chiba City Booth Number: Hall 9, 35-6

Sep 08, 2026

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Sep 08, 2026

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■ "Notice of Participation in the 30th Mechanical Components Technology Exhibition [Tokyo] ■ [July 9 (Wed) - July 11 (Fri), 2025]"

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Nitto Kohki will exhibit at the "30th Mechanical Components Technology Exhibition [Tokyo]" held at Makuhari Messe Hall 5 from July 9 (Wednesday) to July 11 (Friday). [Booth Number: Hall 5 31-32] At this exhibition, we will showcase a variety of products, including the electric suction hand "e-VEE" with a built-in pump that does not require compressed air, a cordless belt sander, the electric driver "Delvo" that can be mounted on robots, and the "Flow Monitor" that allows for easy visualization of the flow of cooling water in molds and other applications.

Sep 07, 2026

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[Seminar] Latest Trends in Hourly CO2 Emission Assessment in the Electricity Sector in Anticipation of Scope 2 Revision

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[Speaker] Mizutani Masataka Senior Researcher Energy Comprehensive Engineering Research Institute, General Incorporated Foundation Carbon Neutral Technology Center, Power System Group [Key Lecture Content] As discussions progress towards the revision of the GHG Protocol Scope 2, elements such as "when and where the electricity was generated" are gaining attention in corporate renewable energy procurement and CO2 emissions calculations. Additionally, with the expansion of renewable energy adoption, the CO2 emission intensity of electricity has begun to fluctuate significantly depending on the time of day and region. In this lecture, we will organize topics such as hourly matching, deliverability, and standard supply services (SSS) that are being discussed in the Scope 2 revision, and introduce examples of hourly CO2 emission intensities provided both domestically and internationally. Furthermore, through analysis examples using publicly available data, such as office buildings and EV charging, we will explain what can be revealed through hourly evaluations and consider the implications and responses for future renewable energy procurement, non-fossil certificates, and PPAs.

Sep 07, 2026

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