Notice of Participation in Ceatec Japan 2018

For bio-medical glass products. High transparency allows for clear observation. Exhibition participation.

Our company is engaged in the development and manufacturing of products using composite processing technology that combines techniques such as cutting, grinding, polishing, metallizing, and bonding. Among these, the "Undercut Bottom Transparent Processing" can finish the undercut bottom surfaces of glass materials such as Pyrex, Tempax, and quartz to a mirror-like state. The improvement in transparency allows for clearer observation from the outside, making it useful in fields such as bio and medical applications. 【Features】 ■ Metallization on side walls prevents light interference and absorption ■ Hole diameter, hole shape, and undercut depth can be freely set ■ Compatible with wafers up to φ200mm ■ Glass thickness can be set from 0.1 to 0.15mm to match the focal length of liquid immersion lenses *We are currently offering materials introducing our microfabrication technology! You can view more details from the 【PDF Download】. ★ We will be exhibiting at "CEATEC JAPAN 2018" ★

• Other processing machines
• Processing Contract

The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

• Processing Contract
• Surface treatment contract service
• Glass

Combining multiple processes to develop innovative products! We propose solutions that match your needs.

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Processing Contract
• Glass

Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

• Glass

Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.

"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.

• Glass

It can achieve anodic bonding without using adhesive, solving the outgassing problem. Compatible with wafer-level packaging (WLP).

"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.

• Glass

Glass alone without the use of organic substances such as adhesives. Sharp edge shapes can be achieved.

Glass microchannels (minimum 50μm) can be produced using borosilicate glass and quartz glass. The bottom surface is transparent, and sharp edge shapes can be achieved. Furthermore, since it is made solely of glass without the use of any organic materials such as adhesives, it excels in transparency, chemical resistance, and heat resistance. 【Main Features】 - Can be produced using borosilicate glass and quartz glass - The bottom surface is transparent, and sharp edge shapes can be achieved - Made solely of glass without the use of any organic materials such as adhesives - Excellent transparency, chemical resistance, and heat resistance For more details, please download the catalog or contact us.

• Other processing machines
• Processing Contract

Achieved square holes without R, which was "impossible" with conventional processing technology. Also capable of small diameters and narrow pitches.

Multiple through holes of 0.2mm square were processed into 0.5t Pyrex glass, creating a mesh-like structure. This processing technology was developed for mass production and can accommodate various quantities. 【Features】 ○ Numerous through holes processed at 0.1mm × 0.1mm ・ (Example) 150,000 holes on a 3-inch wafer ○ Selection of through hole shapes possible with a high aspect ratio (1:8 to 10) ・ Supports straight and tapered shapes ○ Achieves chip-on-glass ・ Improved contact performance during anodic bonding with Si *For more details, please download the catalog or contact us.

• Glass

Glass processing with excellent transparency, chemical resistance, and heat resistance.

Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 　　＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).

• Processing Contract
• Surface treatment contract service
• Glass

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Recently, we held technical training sessions for the MilkoScan FT3 at five locations nationwide. In this training, we provided a wide range of useful information for operating the equipment, including explanations of the principles and structure of the device, how to create measurement products, daily maintenance, and how to respond to issues when they arise. Additionally, this year we introduced new methods for utilizing digital services (such as FossCalibrator and IQX) and also prepared hands-on sessions where participants could experience operating the equipment using a PC. Thank you to everyone who participated. Please feel free to contact us with any questions after the training. ------- At Foss Japan, in addition to training sessions and workshops to ensure you can use our equipment with confidence, we hold many events throughout the year. In seminars and open houses tailored to specific industries and analytical techniques, we showcase Foss's latest analytical solutions. -------

We will be exhibiting at the "Monozukuri Fair 2026" held at Marine Messe Fukuoka from October 14 (Wednesday) to 16 (Friday). We will have a working model of a "small winch" powered by an electric driver equipped with our uniquely developed self-locking reduction mechanism "shoji-lock," and we will set up a corner where you can experience the actual lifting and lowering of workpieces. Please stop by. (Hall A, Booth Number AS-57)

[Lecturers] EY Strategy and Consulting Co., Ltd. Infrastructure Advisory Partner Kenichiro Fukuda Strategy Partner Ken Fujiyama Infrastructure Advisory Director Takashi Matsumura [Key Lecture Content] The water supply and sewage business is facing structural challenges such as facility aging, a shortage of workforce, and a decrease in revenue due to population decline. The government is promoting the introduction of Water PPPs, regional consolidation, and the digital transformation of water supply and sewage systems, marking a significant turning point in the way these businesses are operated. This change is expanding business opportunities for private companies in various areas, including operation and maintenance, pipeline renewal, digital technology, and the utilization of smart meters and data. Additionally, as a means of expanding business domains and enhancing competitiveness, there has been an increase in capital and operational partnerships and M&A between companies, leading to industry restructuring. In this seminar, based on the latest trends in policy and the market, we will introduce business strategies for private companies to enter and expand in the water supply and sewage market, including the use of M&A and capital operational partnerships, drawing on achievements from both public and private support.

[Lecturer] Koichi Iwama, Professor, Faculty of Economics and Management, Wako University / Chairman, Resource Economics Committee, Petroleum Technology Association [Key Lecture Content] In light of the prolonged crisis in the Strait of Hormuz, what will happen to the development of shale gas and shale oil in the United States moving forward? After the midterm elections, what will be the international LNG prices under the Trump administration after winter 2027? How will Japan's business strategies related to LNG projects grow? A leading expert on the shale gas and shale oil revolutions will clearly explain the future outlook.