Notice of Participation in Ceatec Japan 2018

For bio-medical glass products. High transparency allows for clear observation. Exhibition participation.

Our company is engaged in the development and manufacturing of products using composite processing technology that combines techniques such as cutting, grinding, polishing, metallizing, and bonding. Among these, the "Undercut Bottom Transparent Processing" can finish the undercut bottom surfaces of glass materials such as Pyrex, Tempax, and quartz to a mirror-like state. The improvement in transparency allows for clearer observation from the outside, making it useful in fields such as bio and medical applications. 【Features】 ■ Metallization on side walls prevents light interference and absorption ■ Hole diameter, hole shape, and undercut depth can be freely set ■ Compatible with wafers up to φ200mm ■ Glass thickness can be set from 0.1 to 0.15mm to match the focal length of liquid immersion lenses *We are currently offering materials introducing our microfabrication technology! You can view more details from the 【PDF Download】. ★ We will be exhibiting at "CEATEC JAPAN 2018" ★

• Other processing machines
• Processing Contract

The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

• Processing Contract
• Surface treatment contract service
• Glass

Combining multiple processes to develop innovative products! We propose solutions that match your needs.

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Processing Contract
• Glass

Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

• Glass

Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.

"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.

• Glass

It can achieve anodic bonding without using adhesive, solving the outgassing problem. Compatible with wafer-level packaging (WLP).

"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.

• Glass

Glass alone without the use of organic substances such as adhesives. Sharp edge shapes can be achieved.

Glass microchannels (minimum 50μm) can be produced using borosilicate glass and quartz glass. The bottom surface is transparent, and sharp edge shapes can be achieved. Furthermore, since it is made solely of glass without the use of any organic materials such as adhesives, it excels in transparency, chemical resistance, and heat resistance. 【Main Features】 - Can be produced using borosilicate glass and quartz glass - The bottom surface is transparent, and sharp edge shapes can be achieved - Made solely of glass without the use of any organic materials such as adhesives - Excellent transparency, chemical resistance, and heat resistance For more details, please download the catalog or contact us.

• Other processing machines
• Processing Contract

Achieved square holes without R, which was "impossible" with conventional processing technology. Also capable of small diameters and narrow pitches.

Multiple through holes of 0.2mm square were processed into 0.5t Pyrex glass, creating a mesh-like structure. This processing technology was developed for mass production and can accommodate various quantities. 【Features】 ○ Numerous through holes processed at 0.1mm × 0.1mm ・ (Example) 150,000 holes on a 3-inch wafer ○ Selection of through hole shapes possible with a high aspect ratio (1:8 to 10) ・ Supports straight and tapered shapes ○ Achieves chip-on-glass ・ Improved contact performance during anodic bonding with Si *For more details, please download the catalog or contact us.

• Glass

Glass processing with excellent transparency, chemical resistance, and heat resistance.

Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 　　＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).

• Processing Contract
• Surface treatment contract service
• Glass

Eplan, the comprehensive electrical design CAD used by customers worldwide. We will hold a real event called "EPLAN Operation Experience Session," where you can actually experience operating EPLAN. In the morning session, we will explain the overview of EPLAN, and in the afternoon session, you will have the opportunity to operate the actual equipment and gain hands-on experience. You can participate in just one of the seminars, or you can join both and experience EPLAN in one day. You can experience the operation and features of EPLAN P8 and Pro Panel at three locations: the EPLAN Shin-Yokohama office, the Osaka office, and the Osaka office. Participation is free! Please come and check out the feel of operating Eplan.

[Lecture Topics] 1. Regarding the SIP Phase 3 "Construction of a Smart Mobility Platform" Masaki Yahata, Policy Researcher, Cabinet Office, Office for Promotion of Science and Technology Innovation (in charge of Social System Infrastructure) 2. Initiatives by the Ministry of Internal Affairs and Communications on Communication Infrastructure Supporting Autonomous Driving Society Yudai Matsuo, Section Chief, Mobile Communications Division, Radio Department, Telecommunications Bureau, Ministry of Internal Affairs and Communications 3. NTT's Initiatives on Autonomous Driving and Smart Mobility Minako Tsumenaga, Executive Officer, Research and Development Marketing Headquarters, Alliance Division, NTT Corporation / Director, NTT Mobility Corporation 4. Toyota's Efforts Towards Zero Traffic Accidents Mitsuo Shida, Chief, Advanced Safety Systems Reform Department, Toyota Motor Corporation

[Lecture Topics] 1. Introduction to the "Mobility Roadmap 2026" Seiji Muto, Senior Advisor to the Director-General, Mobility Division, National Services Group, Digital Agency 2. Regional Transportation DX for Resolving "Transportation Gaps" Akihiro Watanabe, Deputy Director of the Mobility Services Promotion Division, Ministry of Land, Infrastructure, Transport and Tourism 3. Nissan's Efforts Towards the Practical Implementation of Mobility Services Yoshirou Takamatsu, Senior Researcher, Mobility Society & AI Research Institute, Nissan Motor Co., Ltd. 4. Challenges and Measures for the Social Implementation of Autonomous Driving Yuki Inoue, LPL for Autonomous Driving Business Planning, Honda Motor Co., Ltd. 5. Waymo's Initiatives: The Cutting Edge of Fully Autonomous Driving Commercialization Mika Yamamoto, Head of Policy & Government Affairs, Japan and Asia-Pacific, Waymo

[Instructor] Representative of Digital Infrastructure Consulting LLC (DIRC) President of Regenerative Infrastructure Inc. (R11i) Mr. Takashi Furuta [Key Lecture Content] The data center market, which has continued to grow based on the internet and cloud, is expected to see a further explosive increase in demand due to the extensive use of computational resources that constitute generative AI. Meanwhile, in the Japanese market, foreign funds and global operators are leading development, while Japanese companies face challenges such as revenue opportunities, business continuity through exit strategies, reduced flexibility due to early securing of power, constraints of grid electricity, soaring construction costs, and coexistence with local communities. This lecture will organize these structural challenges and explore integrated location strategies for power, communication, and computational resources in the AI era, conditions for regional dispersion to areas like Hokkaido and Kyushu, and the business strategies that Japanese players should adopt.

[Speaker] Technical Advisor Shikenoh Furuno, Japan Automobile Parts Industry Association [Key Lecture Content] In February 2026, the U.S. and Israel attacked Iran, effectively closing the Strait of Hormuz, which led to skyrocketing prices of crude oil, naphtha, and other petroleum products, severely impacting the global economy. While renewable energy (renewables) is becoming more widespread, the reality of the energy crisis has highlighted the world's continued heavy reliance on crude oil. This has prompted a reevaluation of the value of BEVs, revealing distinct regional differences in the market. While Europe, Japan, and Southeast Asia are experiencing growth, the U.S. continues to see a contraction. In China, REEVs are also on the rise, and the movement towards a hydrogen society utilizing surplus renewable energy is accelerating. Moreover, with the evolution of AI and SoC, the value of cars is shifting from hardware to software, and the development of SDVs and autonomous driving is rapidly advancing. However, there are also concerns about being technology-driven. This lecture will organize these changes and provide an outlook on the future mobility society, including energy considerations.