Notice of Participation in Ceatec Japan 2018

For bio-medical glass products. High transparency allows for clear observation. Exhibition participation.

Our company is engaged in the development and manufacturing of products using composite processing technology that combines techniques such as cutting, grinding, polishing, metallizing, and bonding. Among these, the "Undercut Bottom Transparent Processing" can finish the undercut bottom surfaces of glass materials such as Pyrex, Tempax, and quartz to a mirror-like state. The improvement in transparency allows for clearer observation from the outside, making it useful in fields such as bio and medical applications. 【Features】 ■ Metallization on side walls prevents light interference and absorption ■ Hole diameter, hole shape, and undercut depth can be freely set ■ Compatible with wafers up to φ200mm ■ Glass thickness can be set from 0.1 to 0.15mm to match the focal length of liquid immersion lenses *We are currently offering materials introducing our microfabrication technology! You can view more details from the 【PDF Download】. ★ We will be exhibiting at "CEATEC JAPAN 2018" ★

• Other processing machines
• Processing Contract

The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

• Processing Contract
• Surface treatment contract service
• Glass

Combining multiple processes to develop innovative products! We propose solutions that match your needs.

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Processing Contract
• Glass

Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

• Glass

Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.

"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.

• Glass

It can achieve anodic bonding without using adhesive, solving the outgassing problem. Compatible with wafer-level packaging (WLP).

"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.

• Glass

Glass alone without the use of organic substances such as adhesives. Sharp edge shapes can be achieved.

Glass microchannels (minimum 50μm) can be produced using borosilicate glass and quartz glass. The bottom surface is transparent, and sharp edge shapes can be achieved. Furthermore, since it is made solely of glass without the use of any organic materials such as adhesives, it excels in transparency, chemical resistance, and heat resistance. 【Main Features】 - Can be produced using borosilicate glass and quartz glass - The bottom surface is transparent, and sharp edge shapes can be achieved - Made solely of glass without the use of any organic materials such as adhesives - Excellent transparency, chemical resistance, and heat resistance For more details, please download the catalog or contact us.

• Other processing machines
• Processing Contract

Achieved square holes without R, which was "impossible" with conventional processing technology. Also capable of small diameters and narrow pitches.

Multiple through holes of 0.2mm square were processed into 0.5t Pyrex glass, creating a mesh-like structure. This processing technology was developed for mass production and can accommodate various quantities. 【Features】 ○ Numerous through holes processed at 0.1mm × 0.1mm ・ (Example) 150,000 holes on a 3-inch wafer ○ Selection of through hole shapes possible with a high aspect ratio (1:8 to 10) ・ Supports straight and tapered shapes ○ Achieves chip-on-glass ・ Improved contact performance during anodic bonding with Si *For more details, please download the catalog or contact us.

• Glass

Glass processing with excellent transparency, chemical resistance, and heat resistance.

Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 　　＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).

• Processing Contract
• Surface treatment contract service
• Glass

Evaluating drug efficacy, safety, pharmacokinetics, and physical properties comprehensively from the early stages of the drug discovery process is essential for efficient pharmaceutical development. To support these evaluations comprehensively, the drug discovery support software StarDrop offers various modules. In this presentation, we will introduce an overview of the functions included in the metabolism prediction module, the Metabolism module, its theoretical background, and how it contributes to solving various challenges related to drug metabolism.

We will be exhibiting at the JASIS exhibition held at Makuhari Messe International Exhibition Hall this year as well. [Exhibited Products] ■ High-resolution ICP optical emission spectrometer ■ Continuous light source atomic absorption spectrometer ■ TOC analyzer ■ Microwave sample digestion system [Exhibitor Seminars (New Technology Presentations)] ■ September 3 (Wed) 12:00–12:30 [Atomic Absorption] Venue: Makuhari Messe Conference Hall, Room 101 Surpassing the limits of atomic absorption analysis! A xenon continuous light source atomic absorption spectrometer that achieves efficient measurements like ICP-OES with easy operation. ■ September 4 (Thu) 15:00–15:30 [ICP-OES] Venue: TKP (formerly APA) Venue, Room No. 7 How far can we go? High-sensitivity analysis using a high-resolution ICP optical emission spectrometer equipped with an Echelle double monochromator and CCD detector. ■ September 5 (Fri) 15:00–15:30 [Trace Nitrogen, Sulfur, Chlorine] Venue: TKP (formerly APA) Venue, Room No. 1 Fully compliant with petrochemical JIS standards! A multifunctional nitrogen, sulfur, and chlorine analyzer that condenses solutions for routine analysis and research and development challenges into one device.

[Speaker] Representative Lawyer Hiroshi Noma, Hatsuki Law Office [Key Lecture Content] Climate change has become an urgent global issue, and decarbonization is a critical challenge in the energy/power sector. At the same time, the demand for electricity in data centers is rapidly increasing due to the proliferation of generative AI and cloud services. This seminar will provide a clear explanation of the latest trends in power generation development and electricity procurement in the decarbonization era, using green data centers that utilize corporate PPAs and non-fossil certificates as a subject. It will cover related policies and systems, such as the establishment of renewable energy as a primary power source and watt-bit collaboration, from the perspectives of both power generation companies and consumers. [Lecture Items] 1. Trends in decarbonization policies 2. The flow of new electricity demand - Data centers - 3. Latest trends in renewable energy power generation development 4. Procurement methods for renewable energy power from the consumer's perspective 5. Q&A / Business card exchange

[Speaker] Mr. Lee Qiangfu, Chief Analyst, Technical Research Department, Fourin Inc. [Lecture Topics] 1. SDV → AIDV: The status of AI adoption by major automobile manufacturers 2. Competition in AI + ADAS / Autonomous Driving 3. Changes in the nature of automobiles and profitability models associated with the incorporation of AI 4. Future prospects of AIDV competition 5. Q&A / Business card exchange

Did you know that the success or failure of an ERP upgrade project is actually determined by the integration plan with surrounding systems? Many companies are facing unexpected troubles as a result of relying solely on their ERP vendors. In this seminar, an SE who has been involved in numerous ERP upgrade projects will provide a detailed explanation of practical integration plans that lead to successful ERP upgrades. This is essential content for information systems personnel preparing for an ERP upgrade. You will take home specific know-how that can significantly reduce project risks through advance measures. <Recommended for> - Those who are preparing for an ERP upgrade in 1 to 3 years and are gathering information on what to prepare. - Those who want to understand the project risks of an ERP upgrade in advance. - Those who are considering how to efficiently succeed in an ERP upgrade within budget and schedule constraints.