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  1. Home
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  4. Notice of Participation in SEMICON Japan 2018 (December 12-14, 2018)
SEMINAR_EVENT
  • Oct 31, 2018
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Oct 31, 2018

Notice of Participation in SEMICON Japan 2018 (December 12-14, 2018)

ヒューブレイン ヒューブレイン
Hubbrain Inc. will be exhibiting at SEMICON Japan 2018, which will be held at Tokyo Big Sight from December 12 (Wednesday) to 14 (Friday). This exhibition is an international trade show for the electronics manufacturing supply chain, covering all processes from the front-end to the back-end of semiconductor manufacturing, as well as SMART applications such as automotive and IoT devices. We will be showcasing compact inspection machines that enable diverse inspections with simple settings, as well as inspection equipment that utilizes a 2-megapixel color camera. <Exhibited Products> ■ Free-Angle Appearance Inspection Machine ■ Upper-Type Simple Inspection Machine ■ Wafer and Chip Appearance Inspection Equipment, etc. <Booth Number> ■ East 2 #2332 We sincerely look forward to your visit.
Date and time Wednesday, Dec 12, 2018 ~ Friday, Dec 14, 2018
10:00 AM ~ 05:00 PM
Capital ■Tokyo Big Sight ■135-0063 Ariake 3-11-1, Koto-ku, Tokyo Get off at "Kokusai Tenjijo" Station on the Rinkai Line, about a 7-minute walk Get off at "Kokusai Tenjijo Seimon" Station on the Yurikamome, about a 3-minute walk
Entry fee Free
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SCJ18_ShowsInfo_for_web.pdf[756579]

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Wafer chip appearance inspection device

Simultaneous inspection of front and back possible! A wafer and chip appearance inspection machine that can perform both macro and micro inspections with one unit. Suitable for LED and semiconductor chips.

The "Wafer Chip Appearance Inspection System HM-256 Series" features a standard 3CMOS 3.2 million pixel color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer and dicing processes. It can inspect appearance defects that occur during the wafer and dicing processes with high speed and precision, allowing for the inspection of various chip patterns. 【Features】 ■ Inspection with variable image resolution (1.5 to 5µ) for each type ■ Inspection at sub-micron resolution possible with an embedded microscope (optional) ■ Defect classification based on complex conditions of image features ■ Inspection using multiple recipes (different image resolutions, lighting, and judgment programs) in a single run *For more details, please download the catalog or feel free to contact us.

  • Visual Inspection Equipment

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High-performance tabletop appearance inspection machine

Tabletop robot specifications! A low-cost, high-functionality tabletop appearance inspection machine.

The "High-Performance Tabletop Appearance Inspection Machine" is a compact tabletop inspection machine that uses a tabletop robot and has a footprint of 900×900 (mm) or less. Using our self-developed high-performance inspection software, it can accommodate various shapes of workpieces. The inspection results are displayed in real-time on a monitor in the form of an NG map, allowing for quick understanding of the product status. Despite its low price, it offers high-performance appearance inspection that is not inferior in quality. 【Features】 ■ Tabletop robot specification ■ Compatible with various shapes of workpieces ■ Easy inspection with a user-friendly interface ■ Inspection results displayed in real-time on a monitor in NG map format ■ Quick understanding of product status *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • Visual Inspection Equipment

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Free Angle Appearance Inspection Device

Equipped with a 2-axis rotating robot! An appearance inspection device close to visual inspection is realized at a low price!

This product is a "Free Angle Appearance Inspection Device" equipped with a 2-axis rotating robot. The robot hand is equipped with arbitrary angle setting functionality and a rotating mechanism, allowing it to position the workpiece at angles and locations suitable for image inspection. It features a "parallel processing function" that inspects alternately using two hands, and a "full circumference inspection function" that transfers the workpiece from hand 1 to hand 2 for execution. The hand tip can accommodate various shapes such as chuck mechanisms and suction mechanisms, making it compatible with a variety of workpiece shapes. 【Features】 ■ Equipped with a 2-axis rotating robot ■ Lower price than conventional models ■ High-functionality image inspection system ■ Equipped with parallel processing and full circumference inspection functions ■ Compatible with various shapes *For more details, please refer to the PDF document or feel free to contact us.

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

  • NEW
  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

  • NEW
  • SEMINAR_EVENT

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

  • NEW
  • SEMINAR_EVENT

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

  • NEW
  • SEMINAR_EVENT

Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

  • NEW
  • SEMINAR_EVENT

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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