We will be exhibiting at Embedded Technology 2018 / Embedded Comprehensive Technology Exhibition.

It is possible to change the display/operation section to a more understandable and user-friendly interface.

The Intelligent Touch Panel [High Resolution Type] is a control board that facilitates the introduction of high-definition color displays and touch interfaces to the operation sections of various industrial devices (such as analytical equipment, manufacturing equipment, machine tools, etc.), along with supporting PC software and proprietary firmware. [Features] ○ A compact intelligent touch panel display control board that integrates display/input/control/communication functions. ○ Easy implementation with a complete set of hardware, control firmware, and screen design tools. ○ The use of screen design tools allows for easy customization of screens after implementation.

• Touch Panel

We will design and develop comprehensively from the operation department to the control department.

The Intelligent Touch Panel [Compact Type] is a control board that facilitates the introduction of high-definition color displays/touch interfaces to the operation sections of various industrial devices (analysis equipment, manufacturing equipment, machine tools, etc.), along with supporting PC software and proprietary firmware. [Features] - Integration of display, input functions, communication functions, CPU, and memory - Compatible with small color graphic LCDs (e.g., WQVGA, VGA) - Supports resistive touch panel technology - USB and RS232C communication capabilities - LCD sizes: 4.3/5.7/10.4 inches (size negotiable) For more details, please contact us or download the catalog.

• Touch Panel

To shorten the development period and reduce costs!

This board is equipped with a Xilinx Artix-7(R), features an FMC I/F (HPC) site, and comes with a variety of memory and interfaces in a compact PCI Express half-size format. By combining both FMC standard carrier boards and AD/DA boards, it enables the construction of flexible systems for high-speed, high-precision, multi-channel data transmission and reception. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging processes.

• Circuit board design and manufacturing
• Embedded Board Computers

To shorten the development period and reduce costs!

This is an FMC carrier board equipped with an ALTERA Cyclone (R) V, featuring one FMC I/F (HPC) site and PCI Express Gen2 x4. By combining FMC standard carrier boards with AD/DA boards, it enables the construction of flexible systems for high-speed, high-precision, and multi-channel data transmission and reception. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging processes.

• Circuit board design and manufacturing
• Embedded Board Computers

To shorten the development period and reduce costs!

This is a PCI board equipped with a Xilinx Spartan-6(R) and one FMC I/F (LPC) site. By combining this carrier board with an FMC module, it enables the construction of flexible systems. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging.

• Circuit board design and manufacturing
• Embedded Board Computers

Proposal for shortening the development period and reducing costs.

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system capable of high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

Propose the shortening of the development period and cost reduction.

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with a D/A device. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception, among other applications.

• Embedded Board Computers
• Embedded system design service

Proposal for shortening the development period and reducing costs.

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with A/D and D/A devices. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system that is high-speed, high-precision, and multi-channel. 【Advantages of FMC】 - Shortened development time - Flexible system construction - Easy implementation of additional features or changes after product release by replacing the FMC module - Cost reduction and reuse in the development of the next model through circuit standardization

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is a digital I/O module compliant with the FMC (FPGA Mezzanine Card) standard. By combining this product with a board that has an FMC site, flexible system construction is possible.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is a digital I/O module compliant with the FMC (FPGA Mezzanine Card) standard. By combining this product with a board that has an FMC site, flexible system construction is possible.

• Embedded Board Computers
• Embedded system design service

For shortening the development period and reducing costs! Multi-channel A/D and D/A boards.

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with A/D and D/A devices. By combining this product with a board that has an FMC site, it enables the construction of flexible systems for high-speed, high-precision, multi-channel data transmission and reception. It allows for speedy design and evaluation, contributing to reduced development time and lower costs.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system with high speed, high precision, and multiple channels.

• Embedded Board Computers
• Embedded system design service

For shortening development time and reducing costs! A/D and D/A boards compatible with multiple channels.

The "RFM-ADAFF2408-D500/S95KL" is an embedded A/D and D/A board compliant with the FMC standard. It supports multi-channel data transmission and reception with 24 channels for A/D and 8 channels for D/A, allowing for the construction of high-precision and flexible systems when combined with FMC carrier boards. It enables speedy design, evaluation, and debugging tasks, contributing to reduced development time and lower costs. 【Main Specifications】 ■ Type: A/D and D/A ■ Resolution: 16bit ■ Number of Channels: AD 24ch / DA 8ch ■ Sampling: AD 500kSPS / DA 95kSPS ■ FMC: LPC *For more details, please download the catalog or contact us.

• Embedded Board Computers
• Embedded system design service

Proposal for shortening the development period and reducing costs.

This product is an I/O module that conforms to the FMC (FPGA Mezzanine Card) standard and is equipped with a D/A device. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Notice of participation in the "FOOD Expo 2026." 【Date and Time】 　November 11 (Wednesday) - 13 (Friday), 2026 　Opening hours: 10:00 AM - 5:00 PM 【Venue】 　Tokyo Big Sight 　East Hall 2, Booth Number B-36 【Exhibits】 　Cardboard insulated boxes 　Craft cooler cubes 　Vacuum insulated panel 　Pallet cubes

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange