We will be exhibiting at the "7th High-Performance Plastic Exhibition" during the High-Performance Materials Week 2018.

Simultaneous punching of polyimide films with adhesive, varying in size and thickness.

Polyimide boasts extremely high heat resistance and excellent mechanical properties, electrical insulation, and chemical resistance. It is used in applications such as insulating substrates for FPC in electronic components used in smartphones and camera modules. Myojo Electric has extensive know-how from years of experience in handling thermosetting resins, allowing us to add a peeling prevention process that is prone to occur during the processing of small-sized films. This enables us to simultaneously process polyimide films of various sizes and thicknesses with thermosetting adhesives applied, and we have a track record of large-volume production projects. Additionally, we can provide a consistent response from material procurement to bonding with supplied parts and after-curing, tailored to customer requests, so please feel free to contact us. 【Product Information】 - Various tape processing - Lamination processing - Thermal lamination - Bonding processing For more details, please contact us or download the catalog.

• Printed Circuit Board
• Processing Contract
• Engineering Plastics

Heat-resistant and insulating glass epoxy, one-stop from molding to processing.

We can contribute to reducing your total costs by molding and machining laminated round bars (pipes) and custom laminated plates made of glass epoxy (Galaepo) according to your specifications, including cutting processes (machining centers, NC lathes), pressing, and routing. We also address various issues such as cutting tools and dust during processing. We have a proven track record in a wide range of fields and applications, from reinforcement plates for electronic components' FPCs to custom products used in heavy electrical, railway, and telecommunications sectors, so please feel free to consult us.

• Processing Contract

Custom-made ultra-thick laminated boards for the power electronics field.

In fields such as power electronics where high voltage power is handled, equipment, plants, railway infrastructure, and communication base stations require insulation materials that conform to the shape of the installation site while maintaining insulation strength. According to customer requests, we can custom-manufacture large-diameter pipes up to 200mm in diameter and pipes with multiple inner diameters using glass substrates and epoxy resin through a wet molding process. Additionally, we can also custom-manufacture ultra-thick laminated boards up to 200mm using paper, cloth, and glass cloth substrates combined with epoxy resin through a pressure heat molding process. Furthermore, for FRP laminated pipes, we use the hand lay-up method (winding method) to freely design the wall thickness. We can provide a consistent response from material supply to machining utilizing our expertise in thermosetting materials. We are also capable of accommodating short lead times and small production runs, so please feel free to contact us.

• Processing Contract

From general-purpose plastics to super engineering plastics, as well as processing of metals in addition to resin materials.

At Meisei Electric Co., Ltd., we leverage our extensive experience in electronic components to not only sell resin materials tailored to our customers' needs but also to provide a wide variety of processing options. Precision cutting can be performed on various resin materials, from general-purpose engineering plastics to super engineering plastics, as well as metals. Additionally, by providing information on material selection and processing methods, we can offer solutions to our customers' problems and cost performance that meets their needs. We also offer a diverse range of molding and bending processing for display-related covers, as well as pressing for tapes and films. Please feel free to consult with us. 【Product Information】 ○ Thermosetting resin processed products ○ Pallet jig processed products ○ Various resin processed products For more details, please contact us or download the catalog.

• Processing Contract

For use in smartphones, automotive, and wearable fields, such as reinforcement plates and for conductive, shielding, and heat dissipation applications.

Information devices such as smartphones, tablet devices, and camera modules are becoming smaller and more high-performance every day. Along with this, there is a demand for high-density mounting of electronic components, as well as measures for heat and high frequency. Meisei Electric provides comprehensive support, from adhesive tape bonding processing to die-cutting of thermosetting tapes with various functions, and from vacuum bonding processing using customer-supplied materials to temporary bonding and complete curing through aging. Additionally, we have a proven track record of large lot mass production, processing different sizes and thicknesses of polyimide in a dedicated clean room, including lamination, separator tab processing, and partial adhesion. Please feel free to contact us. 【Product Information】 - Various tape processing - Lamination processing - Thermal lamination - Bonding processing For more details, please contact us or download the catalog.

• Printed Circuit Board
• Processing Contract
• Engineering Plastics

Bonding processing of optical materials such as OCA with substrates like plastic and glass.

We can provide proposals that include the latest materials, leveraging our trading company functions to connect with material manufacturers for optical films such as anti-reflective and light-diffusing films. We possess equipment with different lamination methods and are equipped to handle mass production by preparing processing jigs based on the know-how we have cultivated over many years, starting from condition setting in principle prototypes. For example, in applications for anti-reflection, we offer proposals tailored to the characteristics of materials such as AG, AR, moth-eye, α-gel, and OCA. We have a track record in fields such as smartphones, tablets, display devices, automotive components, robotics, measurement devices, and wearable technology. 【Business Activities】 ○ Vacuum lamination processing ○ Functional film lamination processing ○ Optical film lamination processing For more details, please contact us or download our catalog.

• Other electronic parts
• Processing Contract
• Engineering Plastics

Fukuda Corporation has been pursuing leak detection for 60 years and is dedicated to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing performance. We will propose suitable testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

In civil engineering sites such as mountainous areas and construction sites, it may be necessary to use wooden boards on slopes or inclined access roads. Hyper CLT boards are civil engineering materials utilizing wood CLT, which can be laid not only on flat ground but also on sloped terrain. They can be used for temporary roads, access routes, heavy machinery entry paths, and measures against muddy conditions, creating a driving environment that takes advantage of the unique surface characteristics of wood. The 5×10 board weighs approximately 230 kg, and the 5×20 board weighs about 460 kg, making them lightweight and easy to install and remove even with small machinery, which is a notable feature for maneuverability in narrow sites. This wooden board is registered as a technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS system as "TH-250021-A," and can also be utilized for safety measures and innovative ideas in public works.

Metal cracks are one of the concerns in equipment maintenance operations. Repairs using conventional welding methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" or "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be performed even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

● The production time for cast prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or varying dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

● To determine the sealing and waterproofing of sealed products based on pressure changes, it is not necessary to conduct tests that involve spraying water on the product or immersing it in water. ● Once the product is placed in a dedicated fixture within the inspection device, waterproofing can be quantitatively confirmed through automatic measurement. ● The target product size is W 300 × D 210 × H 100 mm or smaller. ● The target products include automotive cameras, smartphones, ECUs, small motors, and other packaging containers, and are effective for any products that require confirmation of sealing, waterproofing, and airtightness. ● For product specifications and details, please contact us.