Notice of Participation in the 48th NePCON Japan

Ra up to 97 for high color rendering and flat illumination. Operation tests for near-infrared devices and growth tests, among others.

The pseudo-sunlight illumination "SOL Series" is a lighting device that uses high color rendering LEDs as the light source. It offers flat illumination and types that allow for color temperature adjustment without filters, as well as types that can mix arbitrary color temperatures by adjusting the luminous intensity of LEDs with different color temperatures, enabling the reproduction of external light environments. 【Features】 ■ Capable of reproducing the color temperature of the day from morning to evening (SOL-100 series/1000 series) ■ Supports external communication control (SOL-300 series/1000 series) ■ Surface brightness of over 5 million cd/m² (SOL-300 series) ■ High illuminance of 40,000 to 50,000 lux (SOL-800 series) ■ Achieves over 100,000 lux (SOL-600-01T05) *Product documentation can be viewed via "PDF Download." The materials also include examples of growth tests using combinations of near-ultraviolet and visible regions, as well as evaluation tests of cameras that detect invisible regions.

• Lighting for image processing

Nitto Kohki will hold the "2026 Attack Fair in Misato" at the Misato City Cultural Hall Exhibition Room for two days on Wednesday, August 26, 2026, and Thursday, June 27, 2026. The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for visitors and many fun activities prepared. We look forward to welcoming everyone!

On November 6th, the "Reiwa 8th Year Sennan Region Manufacturing Promotion Seminar and Exhibition Exchange Meeting" will be held. Nichiko Electric Co., Ltd. will also present improvement case studies at the Kaizen presentation session. Advance registration is required (free of charge), so we would be grateful if you could apply and attend on the day. ◎ Reiwa 8th Year Sennan Region Manufacturing Promotion Seminar and Exhibition Exchange Meeting (Advance registration required, free of charge) Date and Time: November 6, 2026 (Friday) from 12:10 to 17:00 Venue: Miyagi Prefecture Okawara Joint Government Building, 2nd floor "Room 201" / 4th floor "Large Conference Room" (Address: 129-1 Minami, Okawara Town, Shibata District, Miyagi Prefecture) Organizer: Specified Nonprofit Corporation Sennan Wide Area Industrial Association, Miyagi Prefecture Okawara Regional Promotion Office Co-sponsor: General Incorporated Association Miyagi Prefecture Management Association Sennan Branch Miyagi Prefecture Okawara Regional Promotion Office, Regional Promotion Department (Contact: Yokoyama) TEL: 0224-53-3199 / FAX: 0224-53-3076 Please fill out the attached application form and apply via email. Application Deadline: October 27, 2026 (Monday) (Note) Members of the NPO Sennan Wide Area Industrial Association and members of the General Incorporated Association Miyagi Prefecture Management Association Sennan Branch should also apply by the above deadline.

Next-generation large and high-speed metal 3D printers that offer short lead times, low costs, and high precision are being rapidly introduced to the market. These printers are actively being utilized in the manufacturing of large metal parts and products in the aerospace, automotive, defense, industrial machinery, plant, and civil engineering and construction sectors, as well as for the repair of metal parts and molds, and reverse engineering. In the first lecture of this seminar, we will provide an overview of the Farsoon LPBF method large and high-speed metal 3D printer, which can produce parts up to 1500mm, along with its short lead time, low-cost, and high-quality manufacturing technology and public case studies. The second lecture will cover the short lead time manufacturing technology and examples from Fujikohsai Industries, which has adopted the large metal 3D printer from Meltio, as well as low-cost and material reduction cases utilizing topology optimization. The third lecture will present applicable cases from JFE Engineering, which has introduced a large metal 3D printer from Nidec Machine Tool and is experiencing a surge in requests for manufacturing marine and rocket engine parts, plant equipment parts, and applications in parts and mold repair and reverse engineering. The fourth lecture will showcase the latest manufacturing technology and examples from Sanko Gosei, which is producing high-functionality and high-quality diverse large resin mold parts using a large hybrid 3D printer from Matsuura Machinery. We will provide a clear and detailed explanation of the above topics.

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

[Lecturers] PwC Consulting LLC Senior Manager Yosuke Enomoto Senior Manager Tomoe Ejiri [Key Lecture Content] Against the backdrop of the rapid proliferation of generative AI, the digital infrastructure supporting data processing, communication, and computing resources is undergoing a significant transformation. In this presentation, we will first organize the trends in the terrestrial data center market expanding from AI demand, as well as the structural changes surrounding power, location, and networks. Furthermore, as communication and data processing infrastructure expands into space, we will take a broad view of the future of next-generation digital infrastructure that integrates terrestrial and space elements. Additionally, we will explore new business transformations and opportunities that arise from combining satellite data and internal and external data with AI, and implementing them in business and decision-making through the Forward Deployed Engineer (FDE) approach.