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  3. 白土プリント配線製作所
  4. We will be exhibiting at the 48th Nepcon Japan - 20th Printed Circuit Board EXPO.
SEMINAR_EVENT
  • Dec 18, 2018
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Dec 18, 2018

We will be exhibiting at the 48th Nepcon Japan - 20th Printed Circuit Board EXPO.

白土プリント配線製作所 白土プリント配線製作所
【A Specialized Exhibition Showcasing the World's Most Advanced Printed Circuit Boards】        ~ 20th Printed Circuit Board EXPO ~ Shirato Printed Circuit Board Manufacturing Co., Ltd. will be exhibiting at the 48th Nepcon Japan ~ 20th Printed Circuit Board EXPO. ● Featured Exhibits ● Aluminum-based substrates, copper-based substrates, and composite substrates laminated with FR-4, etc. - High-frequency compatible printed circuit boards → Mainly for communication, printed circuit boards using low dielectric constant materials. - Thick copper printed circuit boards → Please let us know your needs (mainly for high current applications). - General printed circuit boards → We accommodate a wide range from 2-layer boards to multilayer boards. We accept both prototypes and mass production, including small and medium lots, so please feel free to consult with us.
Date and time Wednesday, Jan 16, 2019 ~ Friday, Jan 18, 2019
10:00 AM ~ 06:00 PM
*Only on the final day until 17:00.
Capital 【Venue】Tokyo Big Sight (Exhibition Booth: East Hall 4 E34-40) 【Address】〒135-0063 3-11-1 Ariake, Koto-ku, Tokyo 【Phone】03-5530-1111 (Main) 【Organizer】Reed Exhibitions Japan Ltd. 【Concurrent Event】Nepcon Japan Seminar *Admission to this exhibition requires an invitation ticket and two business cards. One invitation ticket is valid for one person only. (Valid for three days during the event. Entry to concurrently held exhibitions is also allowed.) If you are attending with multiple people, you will need an invitation ticket for each person. *This exhibition is for business negotiations, so entry is not permitted for students and those under 18 years of age.
Entry fee Free Please bring your invitation ticket. *If you do not have this ticket, the admission fee is 5,000 yen per person.
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Deep Ultraviolet Compatible Printed Wiring Board 'DEEP UV-LED PWB'

Deep ultraviolet (UV-C) reflectance over 70%! No discoloration even after over 2000 hours of UV exposure testing. Compatible with high thermal conductivity.

The "DEEP UV-LED PWB" is a metal printed wiring board that has high reflectivity and light resistance against deep ultraviolet light. It achieves over 70% reflectivity for UV-C (deep ultraviolet range of 250nm). It also has over 80% reflectivity for UV-A and UV-B. There are test results showing "no discoloration and no decrease in reflectivity even after 2000 hours of exposure under 365nm conditions." It is also suitable for embedded applications such as deep ultraviolet LEDs. 【Features】 ■ UV-C deep ultraviolet range: Reflectivity over 70% ■ UV-A UV-B: Reflectivity over 80% ■ Insulation layer thermal conductivity: Can support over 5W ■ Heat dissipation materials: Available in aluminum or copper (2 types)

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Deep Ultraviolet Compatible Printed Wiring Board 'DEEP UV-LED PWB'

Deep Ultraviolet Compatible Printed Wiring Board 'DEEP UV-LED PWB'

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Machine elements and parts
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Airflow photography - Camera specialized for fine particle visualization

Maintenance Resilience 2026 We will exhibit a fine particle visualization system at the 52nd Plant Maintenance Show. (July 15 (Wed) - July 17 (Fri), 2026 / Tokyo Big Sight, East Hall 1, 1-H12)

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The particle visualization technology developed under our brand "ViEST" has a very high level of detection sensitivity, capable of visualizing the suspended or adhered states of micro and nano-sized particles in real time. We are engaged in the sale of visualization systems and contract services for evaluation (investigating particles and airflow in production processes, inside and outside manufacturing equipment, evaluating the performance of cleaning products, proposing yield improvement measures, etc.) both domestically and internationally. In manufacturing environments, invisible fine foreign substances, dust generation, particle adhesion due to static electricity, and airflow disturbances can cause quality defects and reduced yield. Our company clarifies these contamination factors through visualization technology and provides consistent support from identifying the source of the problem to considering and confirming improvement measures. Do you have any of the following concerns? - Unable to identify the cause of foreign matter contamination - Want to check airflow and cleanliness in clean rooms - Want to understand dust generation from manufacturing equipment and transport systems - Want to reduce particle adhesion to films and substrates - Want to improve contamination that leads to reduced yield

Jul 04, 2026

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July 9, 2026 (Thursday) 13:30 - [Co-hosted Webinar by Restek] A Must-See for GC-MS Users! The Latest GC Columns Effective for Trace Analysis and Recent Case Studies on MS Utilization

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In this seminar, we will focus on the challenges of sensitivity reduction and separation performance in GC/MS analysis, and introduce the latest technologies and practical know-how that can help solve these issues. This time, we will also have a presentation from LECO Japan, who will discuss the benefits and applications of high-resolution and high-separation analysis with real examples. Additionally, Restek will introduce column technologies effective for improving sensitivity in trace analysis. Restek: We will explain the inert performance of the RMX GC column, which is effective for improving sensitivity in trace analysis, and the column technology that suppresses adsorption loss in low concentration areas, along with actual measurement data. LECO: We will present the latest application examples of comprehensive detection of trace components using high-sensitivity GC-TOFMS and RMX columns, including environmental, aroma, and material analysis. This content is recommended for anyone involved in multi-component analysis using GC/MS, whether for target or non-target analysis, as well as those who are just starting out. We will provide clear explanations suitable for beginners in GC/MS, so please join us.

Jul 03, 2026

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[Seminar] KDDI's Mobility Control Center Concept

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[Speaker] Hidetaka Ishibashi, Director of IoT Planning Department, KDDI Corporation [Key Lecture Content] Against the backdrop of declining birth rates, an aging population, and labor shortages, the nature of mobility is reaching a significant turning point. KDDI has established a "Mobility Control Center" to integratively support new mobility solutions such as autonomous vehicles, drones, and robots, based on the knowledge and infrastructure cultivated through the operation of connected cars. In this lecture, we will focus on the communication and monitoring functions that are essential for the social implementation of each mobility solution, discussing the challenges and efforts towards their resolution, as well as the future vision that KDDI aims for. [Lecture Items] 1. Efforts and history of connected cars 2. Development and initiatives for new mobility 3. Importance of remote monitoring in a mobility society 4. Challenges in communication and monitoring and efforts towards solutions 5. Future vision of the mobility society that KDDI aims for 6. Q&A

Jul 03, 2026

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[Seminar] Pioneering the Era of AI Data Centers through Photonic-Electronic Integration

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[Speaker] Ayako Tejima, Chief Researcher, and Yi Zhang, Senior Researcher ICT Research and Consulting Department, Information and Communications Research Institute, Inc. [Key Lecture Content] The rapid increase in power consumption of data centers due to the proliferation of generative AI has become a critical issue that affects the sustainable growth of AI businesses. In this lecture, we will explain the photonic-electronic convergence technology, which is being implemented in society as a trump card to break through this "power wall." While analyzing the research and development trends of global players, primarily major semiconductor companies in the United States, and market trends, we will present the trends of NTT's IOWN, the winning strategies of Japanese companies with strengths in materials, implementation, and equipment, as well as future business opportunities and challenges toward social implementation from a business perspective. [Lecture Items] 1. Why photonic-electronic convergence now? 2. What is photonic-electronic convergence? 3. Global market trends 4. Japan and the initiatives of Japanese companies 5. Future outlook 6. Challenges 7. Q&A / Business card exchange

Jul 03, 2026

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Challenge in the Field of Space and Aviation Seminar

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In the ever-evolving aerospace industry, the keywords are "environmental resistance," "high performance," and "lightweight" for equipment. This seminar has been planned as an opportunity to provide various topics, from explanations of difficult-to-machine materials such as titanium and Inconel to the latest trends in the space business. We hope you will watch and find hints for the next stage.

Jul 03, 2026

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