A lecture on the measurement device for resin curing shrinkage stress has been scheduled.

On March 12, our company representative, Nakamune, will give a lecture at the seminar "Curing Mechanism of Epoxy Resins and Rapid Curing, Stress Measurement" hosted by the Technical Information Association.
I will provide detailed information about the recently established JIS standard, "Continuous Measurement Method for Shrinkage Rate of UV-Cured Resins and Thermosetting Resins." Additionally, I will also discuss our product, the "Resin Curing Shrinkage Stress Measurement Device Custron," which is used for this measurement. We have received great feedback not only for the introduction of the device but also for our contract measurement services.
We would be delighted if you could participate. Furthermore, if you contact us, you can join the seminar at a discounted price. Interested customers are encouraged to reach out to us freely. Please also take a look at the special Custron page we recently launched.

Date and time | Tuesday, Mar 12, 2019 03:00 PM ~ 05:00 PM |
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Entry fee | Charge Discount available *Please inquire. |
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