We will exhibit at Japan IT Week Spring 2019 / Embedded Systems Development Technology.

It is possible to change the display/operation section to a more understandable and user-friendly interface.

The Intelligent Touch Panel [High Resolution Type] is a control board that facilitates the introduction of high-definition color displays and touch interfaces to the operation sections of various industrial devices (such as analytical equipment, manufacturing equipment, machine tools, etc.), along with supporting PC software and proprietary firmware. [Features] ○ A compact intelligent touch panel display control board that integrates display/input/control/communication functions. ○ Easy implementation with a complete set of hardware, control firmware, and screen design tools. ○ The use of screen design tools allows for easy customization of screens after implementation.

• Touch Panel

We will design and develop comprehensively from the operation department to the control department.

The Intelligent Touch Panel [Compact Type] is a control board that facilitates the introduction of high-definition color displays/touch interfaces to the operation sections of various industrial devices (analysis equipment, manufacturing equipment, machine tools, etc.), along with supporting PC software and proprietary firmware. [Features] - Integration of display, input functions, communication functions, CPU, and memory - Compatible with small color graphic LCDs (e.g., WQVGA, VGA) - Supports resistive touch panel technology - USB and RS232C communication capabilities - LCD sizes: 4.3/5.7/10.4 inches (size negotiable) For more details, please contact us or download the catalog.

• Touch Panel

To shorten the development period and reduce costs!

This board is equipped with a Xilinx Artix-7(R), features an FMC I/F (HPC) site, and comes with a variety of memory and interfaces in a compact PCI Express half-size format. By combining both FMC standard carrier boards and AD/DA boards, it enables the construction of flexible systems for high-speed, high-precision, multi-channel data transmission and reception. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging processes.

• Circuit board design and manufacturing
• Embedded Board Computers

To shorten the development period and reduce costs!

This is an FMC carrier board equipped with an ALTERA Cyclone (R) V, featuring one FMC I/F (HPC) site and PCI Express Gen2 x4. By combining FMC standard carrier boards with AD/DA boards, it enables the construction of flexible systems for high-speed, high-precision, and multi-channel data transmission and reception. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging processes.

• Circuit board design and manufacturing
• Embedded Board Computers

To shorten the development period and reduce costs!

This is a PCI board equipped with a Xilinx Spartan-6(R) and one FMC I/F (LPC) site. By combining this carrier board with an FMC module, it enables the construction of flexible systems. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging.

• Circuit board design and manufacturing
• Embedded Board Computers

Proposal for shortening the development period and reducing costs.

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system capable of high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

Propose the shortening of the development period and cost reduction.

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with a D/A device. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception, among other applications.

• Embedded Board Computers
• Embedded system design service

Proposal for shortening the development period and reducing costs.

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with A/D and D/A devices. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system that is high-speed, high-precision, and multi-channel. 【Advantages of FMC】 - Shortened development time - Flexible system construction - Easy implementation of additional features or changes after product release by replacing the FMC module - Cost reduction and reuse in the development of the next model through circuit standardization

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is a digital I/O module compliant with the FMC (FPGA Mezzanine Card) standard. By combining this product with a board that has an FMC site, flexible system construction is possible.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is a digital I/O module compliant with the FMC (FPGA Mezzanine Card) standard. By combining this product with a board that has an FMC site, flexible system construction is possible.

• Embedded Board Computers
• Embedded system design service

For shortening the development period and reducing costs! Multi-channel A/D and D/A boards.

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with A/D and D/A devices. By combining this product with a board that has an FMC site, it enables the construction of flexible systems for high-speed, high-precision, multi-channel data transmission and reception. It allows for speedy design and evaluation, contributing to reduced development time and lower costs.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system with high speed, high precision, and multiple channels.

• Embedded Board Computers
• Embedded system design service

For shortening development time and reducing costs! A/D and D/A boards compatible with multiple channels.

The "RFM-ADAFF2408-D500/S95KL" is an embedded A/D and D/A board compliant with the FMC standard. It supports multi-channel data transmission and reception with 24 channels for A/D and 8 channels for D/A, allowing for the construction of high-precision and flexible systems when combined with FMC carrier boards. It enables speedy design, evaluation, and debugging tasks, contributing to reduced development time and lower costs. 【Main Specifications】 ■ Type: A/D and D/A ■ Resolution: 16bit ■ Number of Channels: AD 24ch / DA 8ch ■ Sampling: AD 500kSPS / DA 95kSPS ■ FMC: LPC *For more details, please download the catalog or contact us.

• Embedded Board Computers
• Embedded system design service

Proposal for shortening the development period and reducing costs.

This product is an I/O module that conforms to the FMC (FPGA Mezzanine Card) standard and is equipped with a D/A device. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

Sekisui Filler Co., Ltd. will exhibit at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Automotive Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coatings - Optical adhesives We sincerely look forward to your visit.

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the 28th INTERPHEX Week Tokyo. At the exhibition, we will be showcasing 100% inspection equipment compliant with Container Closure Integrity Testing (CCIT) standards, as well as sampling inspection machines. We sincerely invite you to visit our booth at this opportunity and would greatly appreciate your attendance despite your busy schedule. Yours sincerely, [Dates] May 20 (Wed) - 22 (Fri), 2026 10:00-17:00 (JST) [Venue] Makuhari Messe, Japan 8 Hall Booth No. 41 - 36

[Instructor] Hiroto Hayashi, Attorney at Law, New York State, Mori Hamada & Matsumoto Law Firm, Foreign Law Joint Enterprise [Key Lecture Content] Recently, batteries are expected to serve as a balancing power source for the realization of renewable energy as a primary power source. Due to changes in the business environment brought about by market development and government support measures, opportunities in the battery business are expanding. For grid-connected batteries, there are multiple options for long-term decarbonization power source auctions, tolling models, and merchant models, and the points of project development vary depending on the offtake method. Additionally, with the spread of the FIP system, the installation of batteries alongside renewable energy generation facilities is also progressing. In this lecture, we will explain the systems related to batteries, as well as key points for contract creation and negotiation, and financing necessary to steadily advance projects. We will also outline the challenges and prospects for project development and project finance formation according to each offtake scheme.

[Lecturer] Hideo Yamada, Ph.D. Honorary Professor, Waseda University Visiting Professor, Business Breakthrough University Graduate School [Key Lecture Content] Companies face various trade-offs (dilemmas) such as quality vs. cost, inventory levels vs. service levels, and standardization vs. differentiation. Traditionally, companies have responded to trade-offs by (1) finding a balance or (2) prioritizing one over the other. However, this does not lead to fundamental solutions. In this lecture, I will propose a third method that is neither balancing nor prioritizing. Using case studies from over 50 Japanese companies, I will explain it in an easy-to-understand manner. If we can turn long-standing trade-offs into trade-ons (coexistence), business opportunities will arise. [Lecture Topics] 1. What is a trade-off? 2. Trade-offs between customers and companies 3. Trade-offs within companies 4. Trade-offs within customers 5. How to turn trade-offs into trade-ons 6. Steps for exploration 7. Q&A / Business card exchange

[Lecturers] Corporate Partner, Nishimura & Asahi Law Office Osaka, Mr. Satoshi Niki Associate, Nishimura & Asahi Law Office - Foreign Law Joint Enterprise, Mr. Shu Numazawa [Key Lecture Content] In recent years, the diversification of defense cooperation and advancements in dual-use technology have significantly changed the management and international sharing of advanced technologies. This lecture will clarify the basic structure of Article 3 of the Japan-U.S. Technology Agreement and the significance of "similar treatment," while explaining the institutional transformation brought about by the introduction of the non-public patent application system under the Economic Security Promotion Act. Furthermore, considering the relationship between this system and the Japan-U.S. Technology Agreement, we will examine how to reposition the patent applications and secrecy management of defense-related technologies within the context of expanding international joint research and multilateral defense cooperation. [Lecture Items] 1. Diversification of defense cooperation and advancements in dual-use technology 2. Basic structure of Article 3 of the Japan-U.S. Technology Agreement 3. Practical application of "similar treatment" 4. Introduction of the non-public patent system (Economic Security Promotion Act) 5. Relationship between the non-public patent system and Article 3 of the Japan-U.S. Technology Agreement 6. Expansion of international joint research and reevaluation of Article 3 7. Q&A / Business card exchange