We will exhibit at Japan IT Week Spring 2019 / Embedded Systems Development Technology.

It is possible to change the display/operation section to a more understandable and user-friendly interface.

The Intelligent Touch Panel [High Resolution Type] is a control board that facilitates the introduction of high-definition color displays and touch interfaces to the operation sections of various industrial devices (such as analytical equipment, manufacturing equipment, machine tools, etc.), along with supporting PC software and proprietary firmware. [Features] ○ A compact intelligent touch panel display control board that integrates display/input/control/communication functions. ○ Easy implementation with a complete set of hardware, control firmware, and screen design tools. ○ The use of screen design tools allows for easy customization of screens after implementation.

• Touch Panel

We will design and develop comprehensively from the operation department to the control department.

The Intelligent Touch Panel [Compact Type] is a control board that facilitates the introduction of high-definition color displays/touch interfaces to the operation sections of various industrial devices (analysis equipment, manufacturing equipment, machine tools, etc.), along with supporting PC software and proprietary firmware. [Features] - Integration of display, input functions, communication functions, CPU, and memory - Compatible with small color graphic LCDs (e.g., WQVGA, VGA) - Supports resistive touch panel technology - USB and RS232C communication capabilities - LCD sizes: 4.3/5.7/10.4 inches (size negotiable) For more details, please contact us or download the catalog.

• Touch Panel

To shorten the development period and reduce costs!

This board is equipped with a Xilinx Artix-7(R), features an FMC I/F (HPC) site, and comes with a variety of memory and interfaces in a compact PCI Express half-size format. By combining both FMC standard carrier boards and AD/DA boards, it enables the construction of flexible systems for high-speed, high-precision, multi-channel data transmission and reception. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging processes.

• Circuit board design and manufacturing
• Embedded Board Computers

To shorten the development period and reduce costs!

This is an FMC carrier board equipped with an ALTERA Cyclone (R) V, featuring one FMC I/F (HPC) site and PCI Express Gen2 x4. By combining FMC standard carrier boards with AD/DA boards, it enables the construction of flexible systems for high-speed, high-precision, and multi-channel data transmission and reception. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging processes.

• Circuit board design and manufacturing
• Embedded Board Computers

To shorten the development period and reduce costs!

This is a PCI board equipped with a Xilinx Spartan-6(R) and one FMC I/F (LPC) site. By combining this carrier board with an FMC module, it enables the construction of flexible systems. We propose a reduction in development time and costs through the acceleration of design, evaluation, and debugging.

• Circuit board design and manufacturing
• Embedded Board Computers

Proposal for shortening the development period and reducing costs.

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system capable of high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

Propose the shortening of the development period and cost reduction.

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with a D/A device. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception, among other applications.

• Embedded Board Computers
• Embedded system design service

Proposal for shortening the development period and reducing costs.

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with A/D and D/A devices. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system that is high-speed, high-precision, and multi-channel. 【Advantages of FMC】 - Shortened development time - Flexible system construction - Easy implementation of additional features or changes after product release by replacing the FMC module - Cost reduction and reuse in the development of the next model through circuit standardization

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is a digital I/O module compliant with the FMC (FPGA Mezzanine Card) standard. By combining this product with a board that has an FMC site, flexible system construction is possible.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is a digital I/O module compliant with the FMC (FPGA Mezzanine Card) standard. By combining this product with a board that has an FMC site, flexible system construction is possible.

• Embedded Board Computers
• Embedded system design service

For shortening the development period and reducing costs! Multi-channel A/D and D/A boards.

This product is an I/O module compliant with the FMC (FPGA Mezzanine Card) standard, equipped with A/D and D/A devices. By combining this product with a board that has an FMC site, it enables the construction of flexible systems for high-speed, high-precision, multi-channel data transmission and reception. It allows for speedy design and evaluation, contributing to reduced development time and lower costs.

• Embedded Board Computers
• Embedded system design service

To shorten the development period and reduce costs!

This product is an I/O module of the FMC (FPGA Mezzanine Card) standard equipped with an A/D device. By combining this product with a board that has an FMC site, it is possible to build a flexible system with high speed, high precision, and multiple channels.

• Embedded Board Computers
• Embedded system design service

For shortening development time and reducing costs! A/D and D/A boards compatible with multiple channels.

The "RFM-ADAFF2408-D500/S95KL" is an embedded A/D and D/A board compliant with the FMC standard. It supports multi-channel data transmission and reception with 24 channels for A/D and 8 channels for D/A, allowing for the construction of high-precision and flexible systems when combined with FMC carrier boards. It enables speedy design, evaluation, and debugging tasks, contributing to reduced development time and lower costs. 【Main Specifications】 ■ Type: A/D and D/A ■ Resolution: 16bit ■ Number of Channels: AD 24ch / DA 8ch ■ Sampling: AD 500kSPS / DA 95kSPS ■ FMC: LPC *For more details, please download the catalog or contact us.

• Embedded Board Computers
• Embedded system design service

Proposal for shortening the development period and reducing costs.

This product is an I/O module that conforms to the FMC (FPGA Mezzanine Card) standard and is equipped with a D/A device. By combining this product with a board that has an FMC site, it is possible to build a flexible system for high-speed, high-precision, multi-channel data transmission and reception.

• Embedded Board Computers
• Embedded system design service

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

Nakakin will be exhibiting at 'FOOMA JAPAN 2026 (International Food Industry Exhibition)' held at Tokyo Big Sight. This exhibition proposes "A rich future opened by food technology" through cutting-edge technology, products, and services in food machinery, amidst growing interest in "food safety and security." We aim to facilitate the exchange and dissemination of technology and information related to food machinery, equipment, and associated devices, contributing to the further development of the food industry. We sincerely look forward to your visit.

[Speaker] Academic Visitor, University of Strathclyde, UK Visiting Professor, Offshore Wind Research and Education Center, Kyushu University Senior Researcher, Institute for Sustainable Energy Policies (ISEP) Mr. Yo Yasuda [Lecture Topics] 1. International Trends in Decarbonization and Japan's Position (1) Risks of Fossil Fuel Dependence and Decarbonization as Risk Management (2) Discussions on Decarbonization and Renewable Energy in International Organizations (3) Discussions on Decarbonization and Renewable Energy in Japan (4) Discrepancies Between International and Domestic Discussions (The U.S. is not the world) 2. International Discussions on Large-Scale Introduction of Renewable Energy (1) Electrification and Sector Coupling (Why are EVs and Heat Pumps Advancing?) (2) Externalities and Benefits (Long-Term Perspective and Risk Management) (3) Flexibility (The notion that "renewable energy is unstable" is outdated) 3. Challenges and Solutions for Japan, Methodology for Information Gathering (1) Fake News and Scientific Methodology (2) Non-Scientific Narratives and Evidence-Based Policy Making (EBMP) (3) AI and Specialized Information Retrieval 4. Q&A / Business Card Exchange *Reference: "The Future of 90% Renewable Energy by 2050 - Scenarios and Scientific Basis for Achieving Decarbonization" by Yo Yasuda, Yamato Keikokusha (December 2024)

[Speaker] Akira Yamauchi, President and CEO of Intellectual Property Landscape Co., Ltd. Patent Attorney, AIPE Certified Senior Intellectual Property Analyst [Lecture Topics] 1. What is Physical AI? [1] Industrial Robots [2] Humanoids [3] Autonomous Vehicles as the main fields Overview of the population setting for the three fields and the key players in each field 2. [1] Industrial Robot Analysis 3. [2] Humanoid Analysis 4. [3] Autonomous Vehicle Analysis 5. Summary and Discussion of the Analysis Results for the Three Fields 6. Q&A Session